Category: Chip provider

Nuvoton Booth Tour, NuMicro MA35D1 Arm Cortex-A35 with Arm Cortex-M4 at Embedded World 2023 #ew23

Posted by Charbax – March 31, 2023
Category: Exclusive videos, Nuvoton

Nuvoton Technology Corporation, a leading microcontroller platform provider, will showcase important products at the Embedded World 2023 show in Nuremberg Germany: the new MA35D1 processor for object detection on edge computing and a series of automotive/industrial battery monitoring ICs that enhance battery durability, safety, performance, and sustainability.

NuMicro MA35D1 series is a heterogeneous multi-core microprocessor targeted to high-end edge IIoT gateway. It is based on dual 64-bit Arm Cortex-A35 cores with speed up to 1 GHz, and one 180 MHz Arm Cortex-M4 core. Based on the high-performance cores, the MA35D1 series facilitates the tiny AI/ML for edge computing.

The video on YouTube is about a demonstration of sensors that are designed to detect driver status and emergency situations. These sensors are manufactured by a semiconductor company that provides image sensors for various markets, such as the automotive market. The demonstration includes a 3D tof camera that can detect the direction of a driver’s face and eyes, the distance of objects, and the state of the driver. The camera has image Tif sensors and four light sources. Another example is a camera designed for autonomous applications that detect obstacles, such as autonomous vacuum cleaners and tractors. The camera has a range of up to 50 meters. The video also introduces a new product, a microcontroller, and a new technology in battery management and deterioration diagnosis. The battery monitoring chips come in two types: one for industrial use and one for automotive use. The chips can measure the health of a battery, its range, and its cycle. The technology used for monitoring battery health is called electrochemical impotence spectroscopy. It can help determine the state of the battery’s health by analyzing the signals it generates. (chatgpt generated this paragraph based on auto subtitle)

This video was recorded as part of my Embedded World 2023 day 3 Livestream here: https://youtu.be/veLiINwb_9Y?t=16058

Watch all my Embedded World videos here: https://www.youtube.com/playlist?list=PL7xXqJFxvYvjgUpdNMBkGzEWU6YVxR8Ga

Diamond Systems Osbourne carrier board for NVIDIA Jetson AGX Orin high-performance GPU module #ew23

Posted by Charbax – March 18, 2023
Category: Exclusive videos, Nvidia

Osbourne is a versatile carrier board for the NVIDIA Jetson AGX Orin high-performance GPU module. https://www.diamondsystems.com/products/osbourne It provides access to all I/O features of the Orin module and includes numerous sockets for I/O expansion. Osbourne has been designed to be used in almost any application ranging from commercial to industrial to airborne to rugged military use.

Key highlights of Osbourne include:

Industry-standard camera adapter socket for use with a wide range of CSI, GMSL, and other cameras
10Gb Ethernet + 1GB Ethernet ports
Wide temperature operation – matching the range of the Orin module
Dual minicard sockets with PCIe and USB interfaces
Dual M.2 sockets for flash memory (M key 2242/2280) and network connectivity (E key 2230)
I/O concentrator connector enables use with standard and custom I/O breakout boards
Osbourne is available as a carrier board alone or with an Orin module and fan sink installed and ready for use. A Linux OS based on Nvidia L4T and customized to support all I/O on Osbourne is available for free download.

Flexible I/O Connector Design
All I/O on Osbourne is accessed through a single high-speed, high-density connector along the board edge. This decouples the board design from any specific I/O connector arrangement and frees you to select whatever I/O connector scheme you want. Standard connector boards are available for typical use cases, including a panel-mount connector board for installation in an enclosure and a breakout board for use with cables.

OSBOURNE: Nvidia Solutions, NVIDIA Jetson Embedded Computing Solutions, NVIDIA Jetson AGX Orin

Panel I/O Board
The Panel I/O board provides the ability to install Osbourne directly into an enclosure without the use of cables. All I/O is provided on a series of commercial-style connectors designed to be mounted in an enclosure front panel.

OSBOURNE: Nvidia Solutions, NVIDIA Jetson Embedded Computing Solutions, NVIDIA Jetson AGX Orin
Panel I/O boards can also be designed with right-angle orientation. Below is an example of a connector board with MIL-DTL-38999 connectors for a rugged system using Orin.

OSBOURNE: Nvidia Solutions, NVIDIA Jetson Embedded Computing Solutions, NVIDIA Jetson AGX Orin
Front view, panel I/O board with MIL-DTL-38999 connectors

I/O Expansion
Jasper includes dual PCIe minicard sockets with both PCIe and USB interfaces, supporting a wide range of I/O and communications/networking modules from Diamond as well as third party vendors. It includes an M.2 E key socket for installation of WiFi and other networking modules. Also a PCIe slot connector enables attachment of standard desktop-style PCIe slot I/O boards with PCIe x8 / x4 / x1 connection.

Mass storage is provided with an M.2 2242/2280 NVME socket and a Micro-SD card socket.

This booth tour was recorded as part of my Embedded World 2023 Day 2 Livestream here: https://youtu.be/hniKDIbTYLE?t=18799

Watch all my Embedded World videos here: https://www.youtube.com/playlist?list=PL7xXqJFxvYvjgUpdNMBkGzEWU6YVxR8Ga

Tecno Phantom V Fold, Mediatek Dimensity 9000+, sub-$1000 (INR 79,999) to be launched first in India

Posted by Charbax – March 8, 2023
Category: Exclusive videos, MediaTek

Tecno Phantom V Fold is their first foldable phone, with no gap when folded, using a different water drop structure. Using the Mediatek Dimensity 9000+ high performance cpu, good triple cameras, 5000mAh battery, 2000 x 2296 Pixels (~ 388 Pixels per inch) when unfolded, 6.42″ LTPO AMOLED of 1080x2550px resolution at 120Hz when folded. Their custom version of Android has foldable display UI features such as 4 simultaneous apps opened side by side. Driving mode with UI features around the map.

TECNO is an innovative technology brand with operations in over 70 countries and regions across five continents. Since its launch, TECNO has been revolutionizing the digital experience in global frontier markets, relentlessly pushing for the perfect integration of modern stylish and aesthetic design with the latest technologies. Today, TECNO has developed into a recognized leader in building a digitally connected smart lifestyle for consumers, delivering state-of-the-art innovations through a wide range of smartphones, smart wearables, laptops and tablets, HiOS operating systems and smart home products.
Guided by its brand essence of “Stop At Nothing”, TECNO is committed to unlocking the best and newest technologies for forward-looking individuals, inspiring consumers worldwide to never stop pursuing their best selves and their best futures by creating stylish, intelligent products.
For more information, please visit TECNO’s official site: www.tecno-mobile.com

MediaTek Booth Tour, Dimensity 9200, Satellite Communications and more at MWC 2023 #mwc23

Posted by Charbax – March 1, 2023
Category: Exclusive videos, MediaTek

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. This was part of my MWC 2023 day 2 livestream here https://www.youtube.com/watch?v=uV5-rsvcRsM

Silicon Labs at Embedded World 2022 day3

Posted by Charbax – June 30, 2022
Category: Exclusive videos, Silicon Labs

via https://youtu.be/7GwELcFnt5o

Renesas RZ/V2L SMARC SOM

Posted by Charbax – June 29, 2022
Category: Exclusive videos, Renesas, Geniatech

via https://youtu.be/mLwJ85Y-exs

Renesas Audio Codecs at Embedded World 2022 day2

Posted by Charbax – June 25, 2022
Category: Exclusive videos, Renesas

via https://youtu.be/8M-B8aCKhps

Nordic Semiconductors at Embedded World 2022 (at 2h54m in my Livestream day1)

Posted by Charbax – June 24, 2022
Category: Exclusive videos, Nordic Semiconductor

via https://youtu.be/FQocfRt1vI8

Texas Instruments at Embedded World 2022 (at 2h31m in my Livestream day1)

Posted by Charbax – June 24, 2022
Category: Exclusive videos, Texas Instruments

via https://youtu.be/Ub2FI0H5ugg

Coffee with Toradex CEO, COO and CMO

Posted by Charbax – November 18, 2021
Category: Development Boards, Nvidia, NXP, Toradex

I had the pleasure of an impromptu chat with Toradex’s CEO (Samuel Imgrueth), COO (Stephan Dubach) and CMO (Daniel Lang) set against a gorgeous locale close to the Toradex headquarters in Switzerland. We talked about Toradex’s history, key focus and offerings and a lot more.

CES 2021: Kyocera DuraForce Ultra 5G UW, rugged, drop/water proof, Snapdragon 765G, push to talk

Posted by Charbax – January 22, 2021
Category: Smartphones, Exclusive videos, Qualcomm

via https://youtu.be/fbpmWv_GJA4

TI Jacinto 7 new Advanced driver assistance systems processor DRA8 gateway TDA4 SoC ADAS platform

Posted by Charbax – November 4, 2020
Category: Cars, Exclusive videos, Texas Instruments

via https://youtu.be/Zr9hGfvbY8o

Nvidia Maxine Interview, AI video compression conferencing technology

Posted by Charbax – October 31, 2020
Category: Exclusive videos, Nvidia

via https://youtu.be/CRwqfSZaKOQ

ST Booth Tour at MWC

Posted by Charbax – July 2, 2020
Category: STMicroelectronics, MWC

Virtual tour at ST Microelectronics MWC 2018 booth, checking out Smart Home demo using BlueCoin board and chats with Alexa and sees how motion and voice sensors can be used to automate your home. Also sees MEMS Micro-Actuators demonstrating ST’s PETRA technology which is tipped to revolutionize headphones. Other demos include a water proof pressure sensor, touch sensors that can be used even with gloves, an NFC smart tile (ST25DV at http://bit.ly/ST25DV ) which can tell you whether your goods have been shaken, Deep convolution neural networks demonstration talking about artifical intelligence on microcontrollers and used on sensors as part of the IoT, super accurate Teseo GNSS ADAS sensor that works on all satellite constellations and more.

Ittiam H265 Real Time Encoder

Posted by Charbax – June 17, 2020
Category: Intel

Ittiam Systems, a leading technology provider to the broadcast and media industry, announced the availability of its i265 H.265/HEVC Encoder for the new Intel Visual Compute Accelerator (Intel VCA) platform. The recently announced Intel Visual Compute Accelerator is a PCIe based media processing card with 3 Intel Xeon E3 series processors, designed to accelerate high-end media transcoding in a standard Intel Xeon E5 series processor based server. Intel VCA offers a lower total cost of ownership, lower power requirement and higher density compared to other solutions for Data Centers, Broadcasters and Distribution Networks. Ittiam’s multiprocessor implementation of its i265 H.265/HEVC Encoder for Intel VCA, an industry first, leverages the integrated Intel IrisTM Pro graphics capabilities and interconnects on the Intel VCA card to enable real time 4K60 broadcast quality encoding in 1RU servers. This also delivers significant performance scaling for offline high quality encoding and dense transcoding applications. Ittiam’s i265 H.265/HEVC Encoder for Intel VCA leverages Ittiam’s deep expertise in video algorithms and graphics acceleration. i265 for Intel VCA is available now as a codec SDK for system developers and will be available as part of Ittiam’s upcoming Media Engine transcoding system. About Ittiam Systems: Ittiam Systems is a global technology company with deep R&D driven solutions for media creation, management and consumption, ittiam provides advanced media codecs, software development platforms, systems and workflows for embedded and online applications. Its solutions are at the heart of tens of millions of lifestyle products that drive mobility, content access, networking and sharing.

NORDIC Bluetooth 5, IEEE 802.15.4 , Thread and Cellular IoT Ultra Low Power Wireless Solutions from SEMICONDUCTOR.

Posted by Charbax – June 11, 2020
Category: Exclusive videos, Nordic Semiconductor, CES

Nordic Semiconductor provides ultra-low power (ULP) wireless chips that can run for a long time from small power sources, like watch batteries. NORDIC the latest version of Bluetooth is Bluetooth5 by NORDIC .It represents the greatest advancements in the specification since Bluetooth 4.0 and the introduction of Bluetooth Low Energy. Errata High throughput, Long range, advertising extensions, increased broadcast capacity, improved co-existence. IEEE 802.15.4: is a standard for low data rate, low power networks. IEEE 802.15.4 defines the physical (PHY) and Medium Access Control (MAC) layers and forms the basis for numerous upper layer networking specifications including Thread, 6LowPAN, Zigbee and Wireless HART. IEEE 802.15.4 is supported by the Nordic nRF52840 multi-protocol SoC. Thread is a standards-based IPv6-based mesh networking protocol developed for simply and securely connecting products around the home to each other, to the internet and to the cloud. Cellular IoT (A low power LTE-M and NB-IoT solution for wide area network deployments). The LTE-M and NB-IoT standards are open standards created by 3GPP to allow wide deployment of IoT nodes while leveraging existing cellular infrastructure. The LTE protocols are designed for unparalleled scalability in number of nodes while maintaining good Quality of Service. Both technologies offer eDRX and PSM which are techniques for lowering the power consumption compared to traditional LTE. In eDRX, device and network agree exact times when the device will be ready to receive data.

https://www.nordicsemi.com/en

(text by flatslap5657 of http://fiverr.com/s2/bb496d0ed0)

Gole11 Indiegogo Materials Update, to ship to early bird backers by end June, Manufacturing next

Posted by Charbax – May 20, 2020
Category: Intel, Gole, Exclusive video

John gives an update from the Gole design house and factory building maker of the Gole11 now crowdfunding with now 100x $139 each 2-pack perks ($278 for 2pcs) available on Indiegogo at http://igg.me/at/gole11 if the campaign reaches the $100K goal by June 20th then all early bird backers (at $99, $119, $139 (2pcs) or $169) will get their Gole11 shipped to them before the end of June, and in July regular backers (those at $199) will be getting it.

$99 Gole11 on Indiegogo, 11.6″ FHD Touch, 4 COM Ports RS232/485, Intel Celeron N3450, Windows 10 Pro

Posted by Charbax – May 5, 2020
Category: Intel, Gole, Exclusive video

Gole11 Mini PC now crowdfunding at http://igg.me/at/gole11 starting at $99 for the first 30 early birds, comes with an 11.6″ 1920×1080 capacitive touchscreen, runs Intel Celeron N3450 at 2.2Ghz, 4GB RAM, 64GB eMMC, comes with a full Windows 10 Pro.

RENESAS Industrial Ethernet

Posted by Charbax – April 4, 2020
Category: Renesas, Embedded World

Renesas’ Industrial Internet Solution The growth and expansion of factory automation (FA) applications is well established. Industrial robots are replacing human workers, and FA in general is delivering improved efficiency and stability. A recent and very significant development in this area is industrial networks that better support such applications by linking all elements of production systems to the Internet. Specifically, momentum is increasing for an “industrial Ethernet” that interconnects FA machinery via Ethernet-compliant protocols. Facilitating this system-design advancement, Renesas is shipping samples of a new communication-LSI series tailored specifically for the industrial Ethernet. To learn more about this development, EDGE talked with Akira Denda, General Manager of the Industry & Network Solutions Business Division, 1st Solution Business Unit; and Katsunobu Suzuki, Section Manager of the Industry & Energy SoC Department in that organization. The interview that follows covers the challenges faced by designers of the computer controlled, networked industrial equipment used to produce many types of products. It also highlights why R-IN32M3 LSI devices are destined to accelerate the proliferation of industrial-Ethernet system designs in a multitude of market

Nordic Semiconductor nRF5340 dual Arm Cortex-M33 at Embedded World 2020, NB-IoT, LTE-M, BLE, Quuppa

Posted by Charbax – March 11, 2020
Category: Nordic Semiconductor, Exclusive video

Nordic Semiconductor’s Bjørn Kvaale shows the latest cellular IoT NB-IoT, LTE-M, GPS and BLE Bluetooth 5.1 Direction Finding, Zigbee and Thread solutions for development on the market today. Showing their Bluetooth Low Energy solutions including the newly launched nRF5340 SoC featuring dual Arm Cortex-M33 processors, truly secure, with two flexible processors, the advanced feature set, and an operating temperature up to 105 °C, makes it the ideal choice for professional lighting, advanced wearables, and other complex IoT applications The nRF5340 PDK is the preview development kit for the nRF5340 SoC, containing everything needed to get started with development, on a single board. The PDK supports development with an extensive range of wireless protocols. It supports Bluetooth Low Energy, including the Long Range and high-speed 2 Mbps features. Mesh protocols like Bluetooth mesh, Thread and Zigbee can be run concurrently with Bluetooth LE, enabling smart phones to provision, commission, configure and control mesh nodes. NFC, ANT, 802.15.4 and 2.4 GHz proprietary protocols are also supported. The PDK is bundled with an NFC antenna that quickly enables testing of nRF5340’s NFC-A tag peripheral. A SEGGER J-Link debugger is on the board, enabling full-blown programming and debugging, of both the nRF5340 SoC and external targets. All analog and digital interfaces, and GPIOs are available via headers and edge connectors. The kit is Arduino Uno Rev3 hardware compatible, meaning it can be easily interfaced with external device shields, including the Power Profiler Kit. Four buttons and four LEDs simplify input and output to and from the nRF5340 SoC, they are all user-programmable. An on-board external memory is connected to the 96 MHz QSPI peripheral in the nRF5340 SoC. The PDK is typically powered with USB, but can be powered by a wide range of sources, within the supply range of 1.7 to 5.0 V. In addition to USB, it can be powered with external source, but also includes a CR2032 battery holder and a Li-Po battery connector, for in-field testing. Current consumption can be measured by using the dedicated current measurement pins. The nRF Connect SDK is the software development kit for the nRF5340 SoC, and it has board support for the nRF5340 PDK.