Category: Chip provider

Latest Epudo Tablets at HK fair: Sleek Design, Nano Molding Metal Case Technology, MediaTek, Unisoc

Posted by – May 13, 2023

Epudo is a prominent tablet manufacturing company that has been in business for over a decade. Based in DongGuan City, China, the company has established itself as a reliable provider of high-quality tablets for consumers across the world.

Recently, Epudo introduced their latest tablet model, and Jenny, a representative from the company, took to YouTube to showcase its features. The new tablet is a technological marvel that comes with a metal case made using Nano Molding technology, making it not only visually appealing but also durable.

The tablet comes in sizes ranging from 10.1 to 12.6 inches, making it suitable for a range of uses. It runs on the latest Android operating system and has both MediaTek and Unisoc CPUs, ensuring a smooth and seamless user experience. The tablet also has a poker pin, which makes it easy to connect to a keyboard and convert it into a laptop.

During the video, Jenny also shared that Epudo has sold millions of tablets in the 13 years that they have been in business. They have experience in creating tablets for different purposes, including models designed specifically for kids with fun animal shapes. These kid-friendly tablets are a private design of ePudo and feature animals such as deer, tiger, and dog, which kids will love.

Apart from the new model, Jenny also showcased several other tablets in various sizes and designs. This range of tablets provides customers with a range of options to choose from and caters to the needs of different consumers.

One of the most significant advantages of Epudo’s tablets is their pricing. The new 11-inch tablet model that Jenny showcased is priced much lower than an iPad, making it an affordable option for consumers. The exact pricing will depend on the quantity ordered, but it is safe to say that the tablets are priced competitively.

Overall, the video showcases Epudo’s commitment to creating high-quality, innovative, and affordable tablets. With their experience in the industry and range of products, customers can trust WePro to deliver tablets that meet their needs and exceed their expectations.

filmed at Hong Kong Sourcing Fair Mobile Electronics GlobalSources Spring 2023 in Hong Kong

Alldocube 13.3/14-inch laptop with Mediatek/Rockchip CPU options and competitive pricing

Posted by – April 24, 2023

Alldocube showcases a laptop with a 13.3 or 14-inch display, made by a factory that produces many laptops and tablets. The laptop can be configured with a Mediatek or Rockchip CPU, with options for 3, 5, or 6 cores, and the design is suitable for tablets, which the factory has been making for over 15 years. The price is competitive and customizable keyboards can be made for any country. The CPU is an Intel Celeron with a large memory. The host discusses the possibility of including a Rockchip CPU in the laptop, as seen in the colorful Rockchip world booth at the factory. The host visited the factory 10 years ago and notes how busy it has been in recent years.

filmed at Hong Kong Sourcing Fair Mobile Electronics GlobalSources Spring 2023 in Hong Kong

Phonemax P10 rugged 5G smartphone, MediaTek Dimensity 700, 12,000mAh battery, waterproof, shockproof

Posted by – April 23, 2023

Summer from Phonemax, a professional manufacturer of rugged smartphones and tablets, introduces their latest 5G model, the P10 at Hong Kong Sourcing Fair Mobile Electronics GlobalSources Spring 2023 in Hong Kong. It comes with a MediaTek Dimensity 700 CPU, 12GB RAM, and 256GB internal memory, along with a 6.7-inch full HD display and a 12,000mAh battery. The phone is also waterproof, shockproof, and has four cameras, including a 48-megapixel main camera. The Android version is the latest Android 12, and the chipset solution is MediaTek Dimensity. Phonemax is looking for distributors worldwide and welcomes inquiries from India and Indonesia. The company also offers affordable entry-level models starting at $79 with a 4GB RAM and 64GB storage capacity. In addition to rugged smartphones and tablets, Phone MAX also offers regular phones and a 12.6-inch Windows tablet running on an Intel CPU. The tablet comes with a special charging dock, and the company is compatible with other docks.

Nuvoton Booth Tour, NuMicro MA35D1 Arm Cortex-A35 with Arm Cortex-M4 at Embedded World 2023 #ew23

Posted by – March 31, 2023

Nuvoton Technology Corporation, a leading microcontroller platform provider, will showcase important products at the Embedded World 2023 show in Nuremberg Germany: the new MA35D1 processor for object detection on edge computing and a series of automotive/industrial battery monitoring ICs that enhance battery durability, safety, performance, and sustainability.

NuMicro MA35D1 series is a heterogeneous multi-core microprocessor targeted to high-end edge IIoT gateway. It is based on dual 64-bit Arm Cortex-A35 cores with speed up to 1 GHz, and one 180 MHz Arm Cortex-M4 core. Based on the high-performance cores, the MA35D1 series facilitates the tiny AI/ML for edge computing.

The video on YouTube is about a demonstration of sensors that are designed to detect driver status and emergency situations. These sensors are manufactured by a semiconductor company that provides image sensors for various markets, such as the automotive market. The demonstration includes a 3D tof camera that can detect the direction of a driver’s face and eyes, the distance of objects, and the state of the driver. The camera has image Tif sensors and four light sources. Another example is a camera designed for autonomous applications that detect obstacles, such as autonomous vacuum cleaners and tractors. The camera has a range of up to 50 meters. The video also introduces a new product, a microcontroller, and a new technology in battery management and deterioration diagnosis. The battery monitoring chips come in two types: one for industrial use and one for automotive use. The chips can measure the health of a battery, its range, and its cycle. The technology used for monitoring battery health is called electrochemical impotence spectroscopy. It can help determine the state of the battery’s health by analyzing the signals it generates. (chatgpt generated this paragraph based on auto subtitle)

This video was recorded as part of my Embedded World 2023 day 3 Livestream here:

Watch all my Embedded World videos here:

Diamond Systems Osbourne carrier board for NVIDIA Jetson AGX Orin high-performance GPU module #ew23

Posted by – March 18, 2023

Osbourne is a versatile carrier board for the NVIDIA Jetson AGX Orin high-performance GPU module. It provides access to all I/O features of the Orin module and includes numerous sockets for I/O expansion. Osbourne has been designed to be used in almost any application ranging from commercial to industrial to airborne to rugged military use.

Key highlights of Osbourne include:

Industry-standard camera adapter socket for use with a wide range of CSI, GMSL, and other cameras
10Gb Ethernet + 1GB Ethernet ports
Wide temperature operation – matching the range of the Orin module
Dual minicard sockets with PCIe and USB interfaces
Dual M.2 sockets for flash memory (M key 2242/2280) and network connectivity (E key 2230)
I/O concentrator connector enables use with standard and custom I/O breakout boards
Osbourne is available as a carrier board alone or with an Orin module and fan sink installed and ready for use. A Linux OS based on Nvidia L4T and customized to support all I/O on Osbourne is available for free download.

Flexible I/O Connector Design
All I/O on Osbourne is accessed through a single high-speed, high-density connector along the board edge. This decouples the board design from any specific I/O connector arrangement and frees you to select whatever I/O connector scheme you want. Standard connector boards are available for typical use cases, including a panel-mount connector board for installation in an enclosure and a breakout board for use with cables.

OSBOURNE: Nvidia Solutions, NVIDIA Jetson Embedded Computing Solutions, NVIDIA Jetson AGX Orin

Panel I/O Board
The Panel I/O board provides the ability to install Osbourne directly into an enclosure without the use of cables. All I/O is provided on a series of commercial-style connectors designed to be mounted in an enclosure front panel.

OSBOURNE: Nvidia Solutions, NVIDIA Jetson Embedded Computing Solutions, NVIDIA Jetson AGX Orin
Panel I/O boards can also be designed with right-angle orientation. Below is an example of a connector board with MIL-DTL-38999 connectors for a rugged system using Orin.

OSBOURNE: Nvidia Solutions, NVIDIA Jetson Embedded Computing Solutions, NVIDIA Jetson AGX Orin
Front view, panel I/O board with MIL-DTL-38999 connectors

I/O Expansion
Jasper includes dual PCIe minicard sockets with both PCIe and USB interfaces, supporting a wide range of I/O and communications/networking modules from Diamond as well as third party vendors. It includes an M.2 E key socket for installation of WiFi and other networking modules. Also a PCIe slot connector enables attachment of standard desktop-style PCIe slot I/O boards with PCIe x8 / x4 / x1 connection.

Mass storage is provided with an M.2 2242/2280 NVME socket and a Micro-SD card socket.

This booth tour was recorded as part of my Embedded World 2023 Day 2 Livestream here:

Watch all my Embedded World videos here:

Tecno Phantom V Fold, Mediatek Dimensity 9000+, sub-$1000 (INR 79,999) to be launched first in India

Posted by – March 8, 2023

Tecno Phantom V Fold is their first foldable phone, with no gap when folded, using a different water drop structure. Using the Mediatek Dimensity 9000+ high performance cpu, good triple cameras, 5000mAh battery, 2000 x 2296 Pixels (~ 388 Pixels per inch) when unfolded, 6.42″ LTPO AMOLED of 1080x2550px resolution at 120Hz when folded. Their custom version of Android has foldable display UI features such as 4 simultaneous apps opened side by side. Driving mode with UI features around the map.

TECNO is an innovative technology brand with operations in over 70 countries and regions across five continents. Since its launch, TECNO has been revolutionizing the digital experience in global frontier markets, relentlessly pushing for the perfect integration of modern stylish and aesthetic design with the latest technologies. Today, TECNO has developed into a recognized leader in building a digitally connected smart lifestyle for consumers, delivering state-of-the-art innovations through a wide range of smartphones, smart wearables, laptops and tablets, HiOS operating systems and smart home products.
Guided by its brand essence of “Stop At Nothing”, TECNO is committed to unlocking the best and newest technologies for forward-looking individuals, inspiring consumers worldwide to never stop pursuing their best selves and their best futures by creating stylish, intelligent products.
For more information, please visit TECNO’s official site:

MediaTek Booth Tour, Dimensity 9200, Satellite Communications and more at MWC 2023 #mwc23

Posted by – March 1, 2023

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. This was part of my MWC 2023 day 2 livestream here

Silicon Labs at Embedded World 2022 day3

Posted by – June 30, 2022



Posted by – June 29, 2022


Renesas Audio Codecs at Embedded World 2022 day2

Posted by – June 25, 2022


Nordic Semiconductors at Embedded World 2022 (at 2h54m in my Livestream day1)

Posted by – June 24, 2022


Texas Instruments at Embedded World 2022 (at 2h31m in my Livestream day1)

Posted by – June 24, 2022


Coffee with Toradex CEO, COO and CMO

Posted by – November 18, 2021

I had the pleasure of an impromptu chat with Toradex’s CEO (Samuel Imgrueth), COO (Stephan Dubach) and CMO (Daniel Lang) set against a gorgeous locale close to the Toradex headquarters in Switzerland. We talked about Toradex’s history, key focus and offerings and a lot more.

CES 2021: Kyocera DuraForce Ultra 5G UW, rugged, drop/water proof, Snapdragon 765G, push to talk

Posted by – January 22, 2021


TI Jacinto 7 new Advanced driver assistance systems processor DRA8 gateway TDA4 SoC ADAS platform

Posted by – November 4, 2020


Nvidia Maxine Interview, AI video compression conferencing technology

Posted by – October 31, 2020


ST Booth Tour at MWC

Posted by – July 2, 2020

Virtual tour at ST Microelectronics MWC 2018 booth, checking out Smart Home demo using BlueCoin board and chats with Alexa and sees how motion and voice sensors can be used to automate your home. Also sees MEMS Micro-Actuators demonstrating ST’s PETRA technology which is tipped to revolutionize headphones. Other demos include a water proof pressure sensor, touch sensors that can be used even with gloves, an NFC smart tile (ST25DV at ) which can tell you whether your goods have been shaken, Deep convolution neural networks demonstration talking about artifical intelligence on microcontrollers and used on sensors as part of the IoT, super accurate Teseo GNSS ADAS sensor that works on all satellite constellations and more.

Ittiam H265 Real Time Encoder

Posted by – June 17, 2020
Category: Intel

Ittiam Systems, a leading technology provider to the broadcast and media industry, announced the availability of its i265 H.265/HEVC Encoder for the new Intel Visual Compute Accelerator (Intel VCA) platform. The recently announced Intel Visual Compute Accelerator is a PCIe based media processing card with 3 Intel Xeon E3 series processors, designed to accelerate high-end media transcoding in a standard Intel Xeon E5 series processor based server. Intel VCA offers a lower total cost of ownership, lower power requirement and higher density compared to other solutions for Data Centers, Broadcasters and Distribution Networks. Ittiam’s multiprocessor implementation of its i265 H.265/HEVC Encoder for Intel VCA, an industry first, leverages the integrated Intel IrisTM Pro graphics capabilities and interconnects on the Intel VCA card to enable real time 4K60 broadcast quality encoding in 1RU servers. This also delivers significant performance scaling for offline high quality encoding and dense transcoding applications. Ittiam’s i265 H.265/HEVC Encoder for Intel VCA leverages Ittiam’s deep expertise in video algorithms and graphics acceleration. i265 for Intel VCA is available now as a codec SDK for system developers and will be available as part of Ittiam’s upcoming Media Engine transcoding system. About Ittiam Systems: Ittiam Systems is a global technology company with deep R&D driven solutions for media creation, management and consumption, ittiam provides advanced media codecs, software development platforms, systems and workflows for embedded and online applications. Its solutions are at the heart of tens of millions of lifestyle products that drive mobility, content access, networking and sharing.

NORDIC Bluetooth 5, IEEE 802.15.4 , Thread and Cellular IoT Ultra Low Power Wireless Solutions from SEMICONDUCTOR.

Posted by – June 11, 2020

Nordic Semiconductor provides ultra-low power (ULP) wireless chips that can run for a long time from small power sources, like watch batteries. NORDIC the latest version of Bluetooth is Bluetooth5 by NORDIC .It represents the greatest advancements in the specification since Bluetooth 4.0 and the introduction of Bluetooth Low Energy. Errata High throughput, Long range, advertising extensions, increased broadcast capacity, improved co-existence. IEEE 802.15.4: is a standard for low data rate, low power networks. IEEE 802.15.4 defines the physical (PHY) and Medium Access Control (MAC) layers and forms the basis for numerous upper layer networking specifications including Thread, 6LowPAN, Zigbee and Wireless HART. IEEE 802.15.4 is supported by the Nordic nRF52840 multi-protocol SoC. Thread is a standards-based IPv6-based mesh networking protocol developed for simply and securely connecting products around the home to each other, to the internet and to the cloud. Cellular IoT (A low power LTE-M and NB-IoT solution for wide area network deployments). The LTE-M and NB-IoT standards are open standards created by 3GPP to allow wide deployment of IoT nodes while leveraging existing cellular infrastructure. The LTE protocols are designed for unparalleled scalability in number of nodes while maintaining good Quality of Service. Both technologies offer eDRX and PSM which are techniques for lowering the power consumption compared to traditional LTE. In eDRX, device and network agree exact times when the device will be ready to receive data.

(text by flatslap5657 of

Gole11 Indiegogo Materials Update, to ship to early bird backers by end June, Manufacturing next

Posted by – May 20, 2020

John gives an update from the Gole design house and factory building maker of the Gole11 now crowdfunding with now 100x $139 each 2-pack perks ($278 for 2pcs) available on Indiegogo at if the campaign reaches the $100K goal by June 20th then all early bird backers (at $99, $119, $139 (2pcs) or $169) will get their Gole11 shipped to them before the end of June, and in July regular backers (those at $199) will be getting it.