TechNexion shows their lineup of new devices based on the ultra low-power NXP i.MX8M Mini in their ultra-small PICO form factor combining ARM Cortex-A53 and an M4 microcontroller at embedded world 2019, it supports Android, Linux, Yocto, Ubuntu OS is only 37 x 40 mm and at a low cost. The SoM integrates a fully certified wireless module PIXI-9377 based on Qualcomm QCA9377. They also show their Qualcomm QCA9377, QCA6174 devices and more. TechNexion announces two new SoM families: AXON and FLEX. AXON is a product family of small form factor (58 x 37 mm) modules designed for specialized embedded applications requiring another dimension of I/O flexibility. AXON-IMX8M-MINI is also based on NXP i.MX8M Mini applications processor and features AXON Fabric programmable logic, a specialized IC that provides additional functions including nearly infinite pinmuxing, allowing for true pin-to-pin compatibility between SoC versions. FLEX series, on the other hand, is a low-cost family making use of low-cost LPDDR4 SO-DIMM connector. FLEX-IMX8M-MINI (69.6 x 35 mm) offers HD multimedia streaming and integrated 3D graphics at a price point for the cost sensitive market. TechNexion launches several products based on Intel Apollo Lake processor family (Intel Atom x5-E3930, x5-E3940 or x7-E3950) that can be easily deployed in diverse industrial applications ranging from manufacturing robots and machinery, to radar and sensors on ships, trains and automobiles, to in-vehicle experience, video systems and more. TC-1010-APL and TC-1560-APL Multi Touch HMIs come in 10.1” and 15.6” sizes. On the other hand, TCK3-APL is a ruggedized box PC fully customizable to handle your projects with IoT integration. TechNexion also shows their expanded lineup of fully certified (CE / ETSI / FCC / IC / RCM / TELEC) PIXI and STIX series combo wireless communication modules based on Qualcomm QCA9377 and QCA6174 solutions. The modules are available in several M.2 and in the mini-PCIe form factor.
TechNexion shows off their new products at Computex 2018: pre-certified IoT modules, Android Things development kits, IP69K embedded systems and more. The booth tour starts with Android Things development kit PICO-PI-IMX7 live demo, based on NXP i.MX7 Dual applications processor and ARM Cortex-A7 architecture has been the go-to development kit since the official Android Things launch at Google I/O in May. The company also demonstrates PICO-IMX8M SoM based on NXP i.MX8M processor and Cortex-A53 + M4 architectures that delivers a whooping 4K UltraHD video performance with HDR and pro audio fidelity for multimedia applications. TechNexion is also launching CE, ETSI, FCC, IC, RCM and TELEC pre-certified IoT wireless communication modules and development kits: PIXI-9377 based on Qualcomm QCA9377, PIXI-6174 based on Qualcomm QCA6174 that deliver high transmission rates, low latency and improved range in noisy industrial environments. The company is showcasing a fully waterproof TWP-1010-IMX6 HMI based on NXP i.MX6 ARM Cortex-A9 processor that was specially designed to withstand extreme environments and cleaning with a jet spray. TWP series likewise includes models based on Intel Braswell architecture. TEK5-APL box PC based on Intel Atom x5-E3930, x5-E3940, x7-E3950 and Apollo Lake architecture, enclosed in a fully ruggedized enclosure for use in a vehicle.
TechNexion is a design and manufacturing company showing in this video its engineering team, that designs IoT smart devices, development boards for the needs of projects like the ARM powered Android Things ecosystem by Google or Amazon Alexa Voice-Recognition development platform and its advanced manufacturing capabilities. In the video, we get a direct glimpse of how ARM modules and systems are designed and how much automation is being utilized in a smart SMT factory. The video tour takes you through all production stages from the module design to SMT manufacturing to post production functional testing. The factory churns out up to 250K PCBA per month. Filmed on location at the TechNexion factory in Taipei, Taiwan in June 2017.
TechNexion shows the Android Things ARM Powered development platform designed to enable energy-efficient, secure and portable applications for Google’s Internet of Things ecosystem strategy. The development platforms provide hardware that developers need to speed up their IoT projects on the Android Things platform as well as onto other supported platforms such as Ubuntu, Debian, Yocto Project, regular Android and more. TechNexion also continues to build on its complete lineup of System on Modules designed for modular, versatile, scalable and low-power applications that can be easily integrated into other devices for all types of IoT development.
TechNexion is a Taiwanese company under European Management with own manufacturing facilities in Taipei, Taiwan. Florian Wohlrab, Marketing manager at TechNexion shows us around their booth at COMPUTEX 2016. The first thing to see is their tiny Modules which pack an ARM based NXP i.MX6/7 CPU (UltraLite/Solo/DualLite/Dual/Quad) with RAM, Memory and WiFi on just 36mm x 40mm. They are also the only one running a NXP i.MX7 live demo at their booth. The NXP i.MX7D is with 2x Cortex-A7 and a Cortex-M4 this a tiny, ultralow power, that can be used for vending machines, industrial applications or generic headless systems. TechNexion is also committed to the open source EDM standard for ARM Modules. Their boards are fit for Digital Signage, rugged industrial Applications and many more. Technexion can scale up to the NXP i.MX6 QUAD Plus, which will be available shortly. They also have some cool ARM bassed systems like their BoxPC the TEK Series. This Box PC’s have MiniPCIe slots with SIM-Card holder inside and also M.2 Slots for memory upgrade. Technexion also supports USB Type-C and for automation a VGA connector as well a HDMI to fit it for Digital Signage as well. Inside is a modular system which allows you to switch e.g. Power input between 12V/24V/10~30V/PoE (Power over Ethernet). TechNexion HMI series ranges from 7” to 10” and 15” again with NXP processors. All the Software is freely available on their website with no need to register.
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TechNexion announces their upcoming Freescale i.MX 53 based TMX-536 System on Module together with Bachata carrier board.
Development kits will become available in the first quarter of 2012 that will come as all previous TechNexion development kits with source code linux, android and windows embedded compact 7 support backed up with unbeatable documentation to give people all the information that they need to successfully implement TechNexion SoM’s in their project.