Category: Chip provider

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NXP i.MX RT106A Arm Cortex-M7 MCU for Alexa

Posted by Charbax – October 28, 2019

Turnkey, low cost i.MX RT solution speeds time to market. Cloud-based voice assistants, led by Amazon’s Alexa, have become common in many homes, embedded in smart speakers like Amazon’s Echo products. Soon, the newly emerging trend to build voice assistants directly into smart devices such as light switches, ceiling fans, appliances, smoke detectors, and thermostats, will make voice control ubiquitous throughout the home. Voice assistants conveniently and unobtrusively located throughout the home enable a family’s entire network of connected smart devices to be controlled by voice commands from any room. For example, “Alexa, turn off all the lights,” or even more powerful routines can be created such as, “Alexa, good morning,” which can turn on music, start the coffee pot, adjust the thermostat settings, and more.

Today, a few smart home device and appliance makers are introducing versions of their products with built-in voice assistants. Until now, the technology required to embed cloud voice assistants has required a powerful multicore microprocessor unit (MPU), similar to the application processor in smart phones, with large Flash and SDRAM memories, and complex power management. Such implementations have not been a fit for cost sensitive consumer devices, which has impeded the proliferation of smart home devices with built-in voice.

At Embedded World this week, NXP Semiconductors announced the first MCU based implementation of an Alexa client, based on a new member of NXP’s popular i.MX RT crossover processor family of devices. This new solution enables device makers to build Alexa into products using a low cost, low power microcontroller unit (MCU), a device that is typically already required in any connected smart home product, meaning that OEMs can now add voice to their products at very low incremental cost (not much more than the cost of the microphones). Running on Amazon FreeRTOS, NXP’s new MCU-based AVS solution leverages the power of AWS IoT Core to minimize the processing resources needed to build Alexa into a product. Compared to previous implementations running Linux with large memory footprints, requiring more than 50 MB RAM and several Giga-Bytes of Flash, NXP’s MCU solution needs less than 1 MB of on-chip RAM and fewer than 16 MB of Flash, significantly reducing cost and size.

The i.MX RT106A (“ten-sixty-a”), has a 600 MHz Arm™ Cortex-M7™ processor, 1 MB of on chip SRAM, an LCD display, camera interface, advanced security and flexible communication, combined with a complete turnkey AVS software solution and a production ready hardware design, to enable OEMs to quickly and easily add Alexa to their product designs.

With this solution, device makers realize further benefits of shorter time to market, lower development and lifetime costs. It brings together the Alexa Voice Service, AWS IoT Core, and Amazon FreeRTOS to provide complete and best-in-class security, deployment, and device monitoring.

NXP’s i.MX RT MCU-based AVS solution is available as a complete kit for evaluation, development and prototyping. The hardware consists of two small, 30 mm x 40 mm (1.2” x 1.6”) boards. The MCU system on module (SoM) carries the i.MX RT106A processor, 32 MB of HyperFlash memory, a Wi-Fi/Bluetooth module and an optional NXP A71CH secure element. The audio board has three MEMS microphones and connects to a speaker driven by NXP’s TFA9894D smart audio amplifier. The hardware ships with software that includes everything necessary for a developer to, out-of-the-box, connect to the Alexa Voice Service and immediately start prototyping. This one-stop-shop software package includes far-field voice processing (echo cancellation, noise suppression, beam forming, barge-in), an Alexa wake word inference engine, an AVS client application, API and all necessary drivers.

Samples of the i.MX RT106A processor and the SLN-ALEXA-IOT solution kit are available to qualified early access customers now.

Renesas SOTB (silicon-on-thin-buried-oxide) Low Power ARM microcontrollers for energy harvesting

Posted by Charbax – October 28, 2019

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today unveiled an innovative energy-harvesting embedded controller that can eliminate the need to use or replace batteries in IoT devices. Developed based on Renesas' breakthrough SOTB™ (silicon-on-thin-buried-oxide) process technology, the new embedded controller achieves extreme reduction in both active and standby current consumption, a combination that was not previously possible to achieve in conventional microcontrollers (MCUs). These extreme low current levels of the SOTB-based embedded controller enables system manufacturers to take a step further and completely eliminate the need for batteries in some of their products through harvesting ambient energy sources such as light, vibration, and flow. The use of extreme low-power and energy harvesting gives rise to a new market of maintenance-free connected IoT sensing devices with endpoint intelligence for applications in industrial, business, residential, agricultural, healthcare, and public infrastructure, as well as health and fitness apparel, shoes, wearables, smart watches, and drones. Renesas has already begun supplying the new embedded controller to beta customer.

Renesas’ first commercial product using SOTB technology, the R7F0E embedded controller, is a 32-bit, Arm® Cortex®-based embedded controller capable of operating up to 64 MHz for rapid local processing of sensor data and execution of complex analysis and control functions. Consuming just 20 μA/MHz active current, and only 150 nA deep standby current, approximately one-tenth that of conventional low-power MCUs, these industry-leading characteristics make the R7F0E perfectly suited for extreme low-power and energy harvesting.

$399 Weibu Snapdragon 850/8cx/835 Laptop and 2-in-1, Windows 10 ARM Powered

Posted by Charbax – October 22, 2019

Weibu is the Shenzhen design house ready to work with brands to mass produce affordable Qualcomm Snapdragon 835/850 and soon (from Q1 2020) also the Snapdragon 8cx based 13.3", 10.8" and 14.1" and other sizes from FHD to 3Kx2K displays, for long battery, built-in LTE.

Cosmo Communicator shipping now to backers, Dual Display Backlit Keyboard Phone, MTK P70+STM32

Posted by Charbax – October 22, 2019

Cosmo Communicator is right now being mass produced and shipping out to the nearly 4000 backers of the nearly $2M Indiegogo project at https://www.indiegogo.com/projects/cosmo-communicator#/ here is an extensive interview with Janko Mrsic-Flogel, CEO of Planet Computers, the creator of the awesome Gemini PDA Clamshell Keyboard Phone (which I used for 9 months in 2018 as my main phone) and now following that up with the Dual Display Cosmo Communicator, integrating dual-SIM 4G LTE, supports Android 9, Sailfish and other Linux operating systems to come with a multi-boot support, a full physical backlit keyboard, dual colour touchscreen displays, 24MP camera, external 1.91" touchscreen when the phone is closed and a large 6" internally when the phone is opened in full productivity mode. It also integrated a toggle switch with backside fingerprint reader for quick secure unlocking. In this video, Janko shows some of the features supported on that secondary 570x240, 300ppi, 1.91" external display which runs Free RTOS separately on an STMicroelectronics STM32 processor. With supported interactions such as music control, phone dialing, quick dialing, notifications and much more. The new processor is the MediaTek P70 Quad Arm Cortex A73 with Quad
Arm Cortex A53 with an Arm Mali G72 MP3 GPU.

Onyx Boox Note2 10.3″ Qualcomm Front light

Posted by Charbax – October 14, 2019

An overview of the new Onyx Boox Note2, with its new performance.
You can see behind the scenes as they show it to many Chinese media: https://youtu.be/91-ENuLUXzM

Onyx Boox Note2, Max3 with Onyx CEO

Posted by Charbax – October 13, 2019

Onyx presents the new 10.3" Note2 with Qualcomm Octa Core ARM Cortex-A53 platform, responsive, with front-light, battery effecient, probably the most optimized and the most advanced E Ink notepad in the world at the moment. And the new 13.3" Boox Max3 also thinner, lighter, also running on the Qualcomm Octa-core platform on an Android 9 base.

Geniatech IoT TV Box, Zigbee Gateway with OpenWRT, LoRa Gateway, Zigbee Dongle, HDMI Capture

Posted by Charbax – October 13, 2019

Geniatech shows their new IoT integrations for their TV Box market expertise, adding Smart Home functionality in the TV Box, introducing their Zigbee Gateway, Industrial IoT LoRa Gateway based on their Snapdragon 410 Dragonboard 96Boards Developer Board 4 Hub to do the edge computing, Zigbee Dongle adds IoT Smart Home to any Set-top-box such as the Geniatech ATX598Max and other that supports it in the software. Geniatech HDMI Capture

Kirin 990, World’s first 5G SoC with NSA/SA, 7nm UEV+, 10 billion transistors with Arm Mali-G76 MC16

Posted by Charbax – October 2, 2019

Kirin 990 5G is world’s 1st Flagship 5G SoC powered with 7nm+ EUV with Arm Mali-G76 MC16 GPU, over 10 billion transistors, supports NSA/SA (Non-Standalone and Standalone) architectures simultaneously, compatible with all different bands and frequencies of 4G and 5G, connects with 2G, 3G, 4G and 5G, Kirin 990 5G reaches 5G peak download rate, In Sub-6GHz band, the theoretical peak download speed can reach 2.3 Gbps and the theoretical peak upload speed can reach 1.25 Gbps, designed in three levels of efficiency, the Kirin 990 Series achieves great improvement in overall performance and energy efficiency. HUAWEI’s self-developed Da Vinci architecture NPU features a Big-Core plus ultra-low consumption Tiny-Core contributing to a boost in AI performance. In AI face recognition, the efficiency of NPU Tiny-Core can be enhanced up to 24x than the Big-Core. The ISP is enhanced by 15% using BM3D hardware-level noise reduction capable of producing vivid photos of natural views, city architectures and night shot, real-time video segmenting and rendering using its stable video processing capability architecture elevates outstanding performance and great energy efficiency. UFS 3.0 for fastest mobile device data transfer speed.

$999 Samsung Galaxy Book S on Qualcomm Snapdragon 8cx

Posted by Charbax – September 28, 2019

Samsung use the Qualcomm Snapdragon 8cx ARM processor on 7nm system-on-a-chip (40% faster CPU, 80% faster GPU compared to Galaxy Book 2), runs Windows 10, with 23 hours of battery, gigabit LTE, always on, always connected, touch-to-wake, instant-on feature, 0.96kg weight, 13.3" 1080p, multi-touch display (10 points), 1TB SSD, AKG stereo sound with Dolby Atmos support, 8GB LPDDR4X RAM, MicroSD slot, 720p front-facing camera, Wi-Fi 802.11 a/b/g/n/ac, Bluetooth 5.0, USB-C port, and Windows Hello sign-in via a fingerprint sensor. The laptop's dimensions are 305.2×203.2×6.2-11.8 mm.

Geniatech Developer Board 8

Posted by juliusaugustus – August 21, 2019

The Geniatech Developer Board 8 is a Snapdragon 820e based development board designed for commercial and industrial applications. The product features a Qualcomm Snapdradon 820e, 4gb lpddr4 ram, 64GB UFS 2.0,
1x 96boards 40 pin, 1x 96boards 60 pin, full sized HDMI and SD 3.0. The product can run Linux Debian, Linux OpenEmbedded and Android. The Developer Board 8 sells for $350.