Category: Tradeshows

Brewer Science interview at IDTechEx Printed Electronics

Posted by – April 8, 2015

Brewer Science is a global technology leader in developing and manufacturing innovative materials, processes, and equipment for the reliable fabrication of cutting-edge microdevices used in electronics such as tablet computers, smartphones, digital cameras, televisions, and LED lighting. Brewer Science provides process flexibility and a competitive edge for its customers and plays a critical role in the supply chain. Since 1981, when its ARC® materials revolutionized lithography processes, Brewer Science has expanded its technology to include products enabling advanced lithography, thin wafer handling, 3-D integration, chemical and mechanical device protection, and products based on carbon nanotubes and nanotechnology. Learn more in this interview made at the IDTechEx Printed Electronics USA show. For more see http://www.IDTechEx.com

Printed Electronics Europe takes place in Berlin April 28-29th 2015

ATOM Nanoelectronics at IDTechEx Printed Electronics

Posted by – April 8, 2015

The vision of Atom NanoElectronics, Inc.is to innovate scalable and high throughput printing technologies for low cost, high performance optoelectronic devices, to democratize optoelectronic devices for every person. Atom NanoElectronics focuses on developing printed 3-D SWCNT electronics and SWCNT display backplanes that will become pervasive around the world. Atom NanoElectronics is currently printing organic light emitting diodes (OLEDs) on the top of printed SWCNT display backplanes. Atom NanoElectronics is working toward building a manufacturing base for printed Active Matrix Organic Light Emitting Diode (AMOLED) displays and will become a dominant world-wide display supplier. Learn more in this interview made at the IDTechEx Printed Electronics USA show. For more see http://www.IDTechEx.com

Printed Electronics Europe takes place in Berlin April 28-29th 2015

AT&T and the Internet of Things

Posted by – April 8, 2015

AT&T commenting on the Internet of Things at the IDTechEx Internet of Things Applications Conference.

Printed Electronics Europe takes place in Berlin April 28-29th 2015

Intel x3 Sofia platform with ARM Mali400/450/720 GPU

Posted by – April 7, 2015

After spending Billions of dollars in the past year to buy market share in the tablet market, Intel’s mobile division reported an operating loss of $4.21 billion for 2014, Intel subsidized Shenzhen tablet design houses and factories, they probably want to stop that very expensive subsidy by trying to convince the design houses and factories to use Intel's next generation x86 platform which Intel may claim to not be requiring subsidies to buy market share anymore. Previously code-named Sofia, Intel's x3 platform is a two chip 3G solution using ARM Mali-400MP4 GPU in the Intel x3 C3130 dual-core, ARM Mali-450MP4 GPU in the quad-core Intel x3-C3230RK (marketed/designed with Rockchip) and 4G LTE with the ARM Mali-760MP2 GPU in the quad-core Intel x3 C3440. Will Intel manage to price their next generation x86 at MediaTek-like levels and will they really be able to keep design houses and factories interested if they stop subsidizing them, if they stop dumping the price and giving away their CPUs for free, giving factories PCB designs for free (reference design based), PCB and tablet productions subsidized, marketing subsidized, software development subsidized and etc? What is Intel's real potential market share in tablets and smartphones when they stop this subsidy? And why doesn't Intel just make more ARM devices in and out of their Fab like they did the Intel/Rockchip XMM6321 dual-core ARM Cortex-A5 that I filmed here: http://armdevices.net/?s=XMM6321

ARM mbed IoT Starter Kit on IBM’s Bluemix cloud platform

Posted by – April 6, 2015

ARM launches the ARM mbed IoT Starter Kit Ethernet Edition, an extremely easy to use development kit for Internet of Things, to channel data from Internet-connected devices directly into IBM's Bluemix cloud platform. The combination of a secure sensor environment by ARM with cloud-based analytics, mobile and application resources from IBM allows fast prototyping of new smart products and unique value-added services for the IoT market. It is particularly suitable for developers with no specific experience in embedded or web development, as it provides a platform for learning new concepts and creating working prototypes. After the initial out of box experience, the infinite possibilities of cloud applications can be explored through IBM's production grade BlueMix platform, in which deployment and device management is as simple for one device as it is for a million of them. The starter kit hardware can be modified and extended to explore the device design space, and a finalised design can be taken to production using the mbed SDK and HDK.

ARM mbed IoT Starter Kit can be ordered here: https://developer.mbed.org/platforms/IBMEthernetKit/

ThinFilm Printed Electronics NFC Smart Labels for Internet of Things

Posted by – April 6, 2015

Thinfilm is a Norway-based company focused on expanding the traditional Internet of Things into a much broader Internet of Everything using the benefits of printed electronics. Thinfilm’s NFC Barcode and Smart Label product platforms use 13.56MHz Near Field Communication (NFC) technology to communicate from Thinfilm labels (placed on everyday things, at the item level rather than the box/palette/case level) to NFC capable devices, including smartphones and industrial readers. The 128-bit NFC Barcode is manufactured on Thinfilm’s printed-dopant polysilicon (PDPS) manufacturing platform, which enables high-performance transistors capable of handling wireless communication and NFC frequencies and data rates. The payload consists of a mix of fixed ID ROM bits, which cannot be electrically modified for security purposes, and dynamic bits that can the assigned to sensors. Thinfilm recently announced OpenSense technology, which transmits information about the state of a seal (factory sealed or previously opened) to a smartphone. This is being demonstrated in Barcelona in the form of a Johnnie Walker whisky Smart Bottle, which can communicate a unique identification number and dynamic sensing data to a smartphone. The OpenSense technology can lead to improved consumer engagement and can be used to verify authenticity of the underlying product while the seal is still intact. Next, Thinfilm’s temperature sensing Smart Labels integrate batteries, sensing circuitry, optional visual printed electrochromic displays, and NFC wireless transmission function into a single self-contained smart sensing system. These systems use NFC to tell a smartphone or other compatible device whether a food or pharmaceutical shipment stayed within specified temperature limits or whether it became too hot or too cold during transport. That simple data can help caretakers, retailers, and supply chain partners to make smart decisions by providing a real time indication of the temperature behavior (within limits vs. exceeded limits), and the big data pushed to the cloud with every interaction will help brand owners and others to make smarter business decisions based on trends captured by thousands or even millions of units active at any point in time. Learn more at www.thinfilm.no

You can contact ThinFilm here:
Matthew Bright
Director, Product & Technical Marketing
Thin Film Electronics, Inc.
phone +1 408 503 7311
matthew.bright@thinfilm.no
www.thinfilm.no
Address: 2865 Zanker Rd, San Jose, CA 95134-2101, United States
Twitter: @thinfilmmemory
Facebook: Thinfilm
LinkedIn: Thin Film Electronics

IDTechEx interviews PolyIC at Printed Electronics USA

Posted by – April 3, 2015

PolyIC has developed its own printed electronics technology platform, including proprietary printing process, as well as roll to roll quality control methods. Web speed is at least 30m/min. With the recent focus on transparent conductive films (TCFs), the company now offers bare transparent conducting films or complete touch sensor (capacitive). The touch sensor can be single layer or 2 layers of film. The sensor comes with the tail (printed on same substrate), which is an advantage compared to ITO-based sensors where the tail (flexible PCB) has to be added. This interview was taken at the IDTechEx event Printed Electronics USA. For more information see http://www.IDTechEx.com.

Printed Electronics Europe takes place in Berlin April 28-29th 2015

DOWA interview with IDTechEx at Printed Electronics USA

Posted by – April 3, 2015

IDTechEx interview DOWA at Printed Electronics USA. Learn more at http://www.PrintedElectronicsWorld.com

Printed Electronics Europe takes place in Berlin April 28-29th 2015

Optomec and 3D Printing Electronics: Interview with IDTechEx

Posted by – April 3, 2015

Optomec provides two technology offerings. The LENS system, a blown powder laser-based 3D printer for metals which the company manufactures under license from the Sandia National Laboratory. The second is an Aerosol Jet system which provides for conformal, direct-write, non-contact deposition of materials for printed electronics, which the company developed in-house. It can utilize a wide range of materials, with less constraints compared to inkjet. It has been successfully demonstrated and used in metallization of solar cells. This interview with IDTechEx was taken at Printed Electronics USA, hosted by IDTechEx.

Printed Electronics Europe takes place in Berlin April 28-29th 2015

Printed Flexible Temperature Sensors from PST Sensors, interview with IDTechEx

Posted by – April 3, 2015

PST Sensors (pty) Ltd is a spin-out of the University of Cape Town NanoSciences Innovation Centre. It is positioned as a technology solutions provider, and works with its partners and customers to produce integrated temperature sensing and printed electronics products. Both its printed silicon technology and temperature sensing technology have received industry awards. PST Sensors has R&D facilities in Cape Town and offices in Cape Town and London.

Printed Electronics Europe takes place in Berlin April 28-29th 2015