At Embedded World 2025, Forlinx Embedded presented their extensive portfolio of system-on-modules (SoMs) and single board computers (SBCs), designed to streamline client projects across various industries, including industrial automation, electronics, and medical equipment. Their range includes solutions based on prominent architectures like RISC-V, ARM, and products powered by key semiconductor partners such as NXP, Texas Instruments, and Rockchip. More details on their portfolio are available at [https://www.forlinx.net].
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Synaptics is my Embedded World 2025 video coverage sponsor, check out my Synaptics videos here: https://www.youtube.com/playlist?list=PL7xXqJFxvYvhAbQoe9YN4c84SqXxIY3fQ
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One of the highlights from Forlinx Embedded at the show was the introduction of their RISC-V-based System-on-Module, reflecting a growing industry trend toward open-source hardware architectures. By leveraging RISC-V, Forlinx provides developers flexibility and efficient integration paths for applications demanding customization and low-power performance.
A major spotlight at their booth was the FET-MX9352-C SoM, powered by NXP’s latest i.MX93 processor. This module incorporates a dual-core ARM Cortex-A55 processor alongside a Cortex-M33 coprocessor, effectively targeting real-time processing tasks and energy-sensitive applications. The module is optimized for diverse sectors including medical, industrial automation, and smart electronics, showcasing versatility and broad application scope.
Forlinx highlighted their long-standing relationship with NXP Semiconductors, noting their position as China’s largest distributor of NXP’s ARM-based solutions. This partnership has enabled them to develop widely adopted products, with extensive deployments in sectors that require reliability and performance, such as industrial automation, healthcare, and automotive markets.
Additionally, Forlinx presented modules based on Rockchip processors, notably featuring the RK3588 SoM. This SoM integrates an octa-core CPU comprising four Cortex-A76 and four Cortex-A55 cores, providing robust performance capabilities suitable for AI-driven applications and multimedia processing. With up to 16GB LPDDR4x RAM and comprehensive support for Linux and Android, it meets the needs of sophisticated edge computing scenarios.
The company also discussed their involvement with Texas Instruments, highlighting the enduring popularity of TI’s platforms within the electronics sector. By integrating TI’s robust and proven technologies, Forlinx ensures that their SoMs can be readily adopted in critical embedded solutions, particularly in the industrial and electronics markets, benefiting from TI’s established ecosystem and broad compatibility.
Forlinx employs a modular approach in their products, aiming to significantly reduce development complexity for their customers. Their commitment to providing compact form-factor solutions was evident in the demonstration of smaller, highly integrated boards, allowing developers greater versatility in design and deployment for compact embedded systems.
Forlinx Embedded’s presence at Embedded World 2025 demonstrated their strategic focus on collaboration, robust technology platforms, and the importance of adaptability in the embedded technology landscape. Through consistent partnerships and technical expertise, they continue to facilitate efficient and scalable development across numerous industrial applications.
Check out all my Embedded World 2025 videos in this playlist: https://www.youtube.com/playlist?list=PL7xXqJFxvYvjgUpdNMBkGzEWU6YVxR8Ga
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