The cheapest 13.3″ Ultrabook killer, now selling at near $100, with a dual-core ARM Cortex-A9 processor WM8880 from VIA WonderMedia. Running smooth Android, but of course would be nicer with Chrome OS (or Chromium OS) and Ubuntu, on dual or triple boot. It has 1GB RAM, 8GB Flash, 1366×768 screen resolution, 5000mAh battery could do 10+ hours battery life if the display was a Pixel Qi ultra-low power sunlight readable LCD. This is where the upcoming Intel-killing Ultrabook-killing is going to come from.
Danae Ringelmann, Co-Founder of Indiegogo talks about the status of the crowd funding website at Gigaom Roadmap.
and you can watch her official interview at Gigaom Roadmap:
3D as cinema magic – is just the beginning! A broad array of research bodies ranging from research institutes, private sector development labs and universities to radio stations and TV companies and telecoms are now engaged in planning and developing 3D production, 3D content, and 3D distribution. Yet most of these initiatives are standalone with little or no contact between them. The 3D Innovation Center Berlin offers the whole cast of actors a platform and a pre-competitive environment where they can exchange views and opinions, build contacts, put their products and systems to the test and present them jointly to a diversity of target audiences. The ready availability of know-how covering the whole 3D systems chain will generate new synergies – in terms of product development, marketing and sales as well as market positioning and public relations.
The 3D Innovation Center Berlin is:
- a showroom for products, prototypes and ideas
- a development platform and testbed for 3D technologies, applications and infrastructures
- an R&D lab for projects, innovations and standards
- a communication platform for providers, users and the general public
- a transfer platform for expertise and professional training
- a marketing instrument for advertising, sales and PR
- a pool of resources for experts, know-how, and marketing and target audience data etc.
The establishment and organization of the 3D Innovation Center is in the hands of the Fraunhofer Heinrich Hertz Institute, The 3D Innovation Center is planned to operate for an initial period of five years. The start-up phase of the 3D Innovation Center is funded by the German Federal Ministry of Economics and Technology (BMWi).
Pipo releases this Ultra-U7 tablet, with the same 7.85″ display as on iPad Mini, it’s with the 1.2Ghz MediaTek MT8389 quad-core ARM Cortex-A7 processor, 1GB RAM, with 3G dual-sim calling functionality, selling at retail price of 999rmb in China ($164) the retail price target may be below $199€ in USA/Europe (consider import taxes etc). It also includes an excellent back-facing 8megapixel camera with auto-focus and flashlight.
You can read more about it here: http://pipo.com.cn/product.php?id=127
Arne Weber of faytech Co., Ltd. demonstrates his company’s 8″-22″ All-in-One Touchscreen PCs built around faytech’s proprietary designed mainboard (manufactured exclusively by the industrial division of ASUS). Each of faytech’s fanless industrial Touchscreen PCs can be manufactured using a number of different touch technologies (resistive, capacitive, SAW or IR), and with a variety of connectors to fit any industrial use. Customization is also available including high brightness and IP65/IP68 ratings for outdoor usage. The standard 8″-22″ Touchscreen PC models comes with a 5-wire resistive touchscreen, industrial LCD Panel with LED backlight, Intel Atom N2600 chipset with AMD’s Caicos mobile HD7400 series chipset with dedicated 512MByte RAM (supporting WinXP, Win7, Win8, Linux, 32Bit, 64Bit), 2GByte RAM, 30 or 60GByte SSD, W-LAN and numerous USB and serial connections.
You can contact faytech here:
faytech Co., Ltd.
Fl. 4, Bldg. C, Second Phase,
Hongmen Tech. Zone,
Shangxue Duan, Jihua Rd.,
Tel: +86 (0) 755 89580612
Here’s an overview of the Fraunhofer Heinrich Hertz Institute (HHI) with Ralf Schäfer Head of Image Processing agt HHI in Berlin Germany. The core competencies of HHI are in the areas of Photonic Networks and Systems, Mobile Broadband Systems, Photonic Components and Electronic Imaging.
Activities in photonic networks and components expand a spectrum from highly capacitive flexible long haul networks to the broadband inhouse network and their components
R&D-activities in the area of mobile broadband systems focus to design aspects of future cellular systems and their realization for various mobile communications systems. multi-antenna systems (MIMO) up to 1 Gbit/s, resource management for both cellular mobile, radio systems and WPAN-systems up to 60 GHz.
Optical and opto-electronic components and modules are developed and manufactured. Our range includes InP-based lasers and detectors with wavelengths from 1.1 µm to 2.0 µm, polymer lightwave circuits, and diffractive optics.
Main topics are further video- and audio-coding / transmission (Video over IP), the 2D- und 3D image processing, the image reproduction in virtual environments, teleimmersive systems, autostereoscopic displays, miixed reality displays, man-machine-interactions and information and videoretrieval.
Luke Shields of JCSC shows off his supposed to be platform for open source platform development in schools, encouraging children to experiment making hardware, re-painting old home consoles, integrate ARM development boards, modulate, what you want may not be what I want and what I want may not be what you want. Check it out.
Calxeda shows their new ARM Cortex-A15 based ECX-2000 supporting 16GB RAM on quad-core, used by HP in one of their new HP Moonshot ARM Server platform. Performance is 2x to 3x faster than their previous ARM Cortex-A9 Server platform. Calxeda also has 2 64bit ARM Server chips on their Roadmap with full production systems to be expected for early 2015 or so.
You can read more about Calxeda ECX-2000 at http://www.calxeda.com/ecx-2000-family/