ARMdevices.net

IAR covers the full embedded build pipeline, from compiler/assembler/linker through C-SPY debugging, plus static and runtime analysis for code quality and certification work in safety- and security-critical firmware https://www.iar.com/

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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A core theme is zero-trust device security where you assume the contract manufacturer is not trusted, then use components like IAR Embedded Trust and IAR Secure Deploy to enforce secure provisioning, reduce overproduction risk, block illegal cloning, and keep firmware authentic via secure boot, encrypted update delivery, and encryption for data at rest and in transit

That maps well to what many teams now face in medical, automotive, industrial control, and consumer IoT, where regulation and procurement demand evidence of secure lifecycle control, MISRA compliance, and functional-safety readiness across standards like ISO 26262, IEC 61508, and IEC 62304

On the booth demo side, Sean highlights IAR C-STAT static analysis in its TÜV-certified form, alongside certified toolchains that help reduce tool-qualification effort, and the broader shift toward IAR cloud-enabled platform work where builds, analysis, and security gates can slot into CI/CD and DevSecOps routines across distributed teams

The discussion on AI stays practical: many developers already use AI code generation inside editors like Visual Studio Code, while IAR focuses on verification, determinism, and partner ecosystems, including POSIX-compliant RTOS options such as PX5 for teams migrating from embedded Linux toward tighter real-time behavior at booth 813 during Embedded World North America 2025

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Meet Mitilesh Muley from ART (Advanced Realtime Tracking) as he walks through an immersive cycling demo: a standard Garmin trainer is paired with a motion platform and a head-tracked display so the bike physically tilts with the virtual uphill/downhill terrain while your viewpoint updates in real time. https://ar-tracking.com/en

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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The core idea is outside-in optical tracking: infrared cameras observe retroreflective markers on the headset and props, then tracking software (ART’s DTRACK) turns those 2D observations into a continuously streamed 3D pose. In compact setups this can be a plug-and-play stereo unit like SMARTTRACK3, while higher-end cameras such as ARTTRACK6/M target high frame rate and low latency for tight VR control loops today.

Why the “little balls” on the glasses? A single marker gives 3DoF position, but a multi-marker target yields full 6DoF pose with millimeter-level stability, which matters when perspective shifts are obvious to the eye. Markerless computer-vision tracking can work, but accuracy and occlusion handling are harder; ART also points toward deep-learning approaches like CAPTA when you need to track objects without tagging there.

Beyond this cycling rig, the same pipeline maps to flight simulation, maintenance rehearsal, ergonomics testing, in-car HMI prototyping, and mixed-reality manufacturing workflows where humans and tools must align with a digital twin. ART describes deployments from small lab volumes to hall-scale multi-camera arrays, with thousands of installations and long-running customer programs in the field of work.

Filmed on the Supercomputing SC25 show floor in St Louis with the HLRS booth nearby, the interview highlights how precise 6DoF tracking becomes infrastructure for interactive HPC visualization, CAVE/XR labs, and real-time engines like Unity or Unreal via VRPN/OpenVR style data streams. The takeaway is simple: when you need repeatable, low-jitter pose data for simulation and training, robust marker targets plus calibrated IR camera geometry still win, fast.

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Modern clusters look uniform from the scheduler, but tiny hardware differences can quietly dominate time-to-solution. In this talk, University of Utah researcher Sowmya Yellapragada describes summer work at Lawrence Berkeley National Lab that treats heterogeneity as a first-class signal, not a nuisance, using empirical node profiles to avoid “fast nodes idle, slow nodes overloaded” behavior. https://www.utah.edu/

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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The study targets architectural and intra-generation variation, including GPU–GPU differences where you might assume identical behavior. On NERSC Perlmutter, the same NVIDIA A100 family (40 GB vs 80 GB) can shift kernel runtime by roughly 9–26%, especially across memory-bound AMReX kernels, which means naïve load balance can waste expensive accelerators even when every job “fits” on paper.

Two schedulers are compared against a classic homogeneous knapsack baseline. Performance-aware scheduling compresses each node into a 1D relative-speed vector (better/worse than a reference), while relation-aware scheduling lifts that into a 2D relative performance matrix describing how every node compares to every other node, which is useful when topology, memory size, or contention creates non-transitive order.

The evaluation uses 14 representative AMReX kernels spanning compute-bound and memory-bound behavior, and reports near-perfect scheduling efficiency with measurable speedups in moderate heterogeneity and dramatic gains when CPU and GPU resources coexist. Recorded at Supercomputing SC25 in St. Louis, it also frames heterogeneity as a broader orchestration problem that can extend to cloud placement, Kubernetes clusters, and ML-assisted runtime prediction, in the same kind of on-site interview format you also capture at events like Web Summit Lisbon 2025.

A key next step is I/O contention and data movement: PCIe/NVLink traffic, burst buffers, and shared parallel filesystems can turn a “balanced” compute schedule into a stalled pipeline. Modeling those middleware effects alongside compute profiling would let future schedulers optimize makespan with a more realistic cost model, and keep utilization high without guessing.

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Microchip shows a “smart transport” concept where many small sensor/actuator nodes speak Bluetooth Low Energy and a gateway (here, a phone) collects telemetry and control in real time, reducing long wire runs while keeping a familiar “vehicle sensor network” mental model for embedded developers. https://www.microchip.com/en-us/product/pic32wm-bz6204ue

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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In the demo, each board behaves like a subsystem: a CAN-connected cluster, touch input driving a motor function, a temperature-driven fan loop, and a solar-panel node where shining a phone flashlight visibly changes the measured voltage. The interesting part is the full path: sensor → BLE link → gateway UI, plus bidirectional control back to the edge device in the same session for tight feedback.

The platform callout is the PIC32-BZ6 family (also available as RF-certified modules): a 128 MHz Arm Cortex-M4F MCU with FPU, 2 MB Flash and roughly 512 KB SRAM, aimed at leaving headroom for OTA firmware growth while hosting multiprotocol stacks like Bluetooth LE and IEEE 802.15.4 (Thread, Matter, and proprietary options). Pairing that with “real” MCU peripherals such as CAN-FD and typical ADC/PWM/touch blocks is what lets one design bridge legacy bus traffic with app-driven wireless control today.

Filmed at Embedded World North America 2025, it’s a practical snapshot of how embedded teams mix deterministic CAN-style domains with BLE and 802.15.4 ecosystems, aiming for simpler harnessing, easier provisioning, and smartphone-first diagnostics while keeping the real-time loop close to the device for predictable edge behavior here.

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HLRS (High Performance Computing Center Stuttgart) sits at the intersection of classic high-performance computing and applied research, with one foot in engineering workflows and the other in “global challenges” like climate modeling and risk analysis. In this conversation, Managing Director Basan Kola frames supercomputing as practical infrastructure: accelerate design loops, validate manufacturing ideas earlier, and make large simulations usable by teams that do not live in MPI code every day. https://www.hlrs.de/

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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A nice part of the booth story is how HLRS turns raw compute into something people can feel and understand: a VR bicycle ride where head motion drives the viewpoint, and the workload “pushes back” as the track climbs, blending real-time visualization, interaction latency constraints, and human factors into one demo. It’s a small example of a bigger theme in scientific visualization: tight coupling between simulation output, rendering pipelines, tracking, and user input so decisions can happen in the moment rather than after a batch job is done there.

The drone demo points at a more operational pipeline: capture reality with 3D scanning (photogrammetry and/or LiDAR), build a high-fidelity model, then run scenario simulation on top—flooding, terrain evolution, and climate-condition what-ifs. That workflow depends on data fusion, meshing, uncertainty handling, and repeatable compute environments, because the value is not the pretty point cloud but the ability to test how a system behaves under stress in the future.

For robotics, the focus is “virtual commissioning” and modular digital twins: training and validating a robot arm against a virtual cell before the physical module is even assembled, then translating that to real hardware with fewer integration surprises. Recorded on the Supercomputing SC25 show floor in St. Louis, the booth walk-through ties this to industrial partners (including TRUMPF-style laser/manufacturing contexts), where physics-based simulation, collision checking, and control-loop tuning benefit from HPC throughput and clean toolchains on the floor.

The forward-looking thread is convergence: HLRS is betting on HPC + AI as a single stack (and keeping quantum on the horizon), where simulation produces data, AI improves surrogate modeling and parameter search, and both share the same expensive infrastructure efficiently. The HammerHAI “AI Factory” angle adds the missing glue—secure and accessible AI compute for industry and academia, plus practical support for datasets, training, and deployment patterns that make supercomputing useful beyond a single lab, right up to production edge.

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From the OpenHPC booth at Supercomputing SC25, this short interview frames OpenHPC as a Linux Foundation community project that bundles the “boring but critical” ingredients of a functional HPC cluster into a coherent, reproducible baseline: provisioning, a scheduler/resource manager starting point, I/O clients, developer toolchains, and common scientific libraries that many labs have relied on for decades. https://openhpc.community/

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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A big theme is integration work: cluster software is not just Linux packages in isolation, it is drivers, kernel/user-space interfaces, RDMA-capable networking, and the rest of the stack that must be built and validated together. OpenHPC maintains continuously rebuilt repositories and uses automated build-and-test workflows so versions stay consistent, reducing the odds that an OS update breaks MPI, an interconnect fabric, or a compiler toolchain stack.

The conversation also touches the reality of heterogenous fleets and global preferences: OpenHPC targets both x86_64 (AMD/Intel) and Arm (aarch64), and it is commonly consumed on enterprise-compatible Linux choices such as Rocky Linux and AlmaLinux, alongside other supported distributions. Sponsorship and contributions help keep the infrastructure running, while the project stays open to practical fixes from universities, labs, and cloud operators when a particular hardware permutation behaves oddly out in the field.

If you are building your first cluster, the takeaway is that OpenHPC is meant to be a safe starting line, not a locked box: you can rebuild packages with your own tuning flags, interconnect choices, and site policy, while still inheriting a tested packaging framework. The community workflow—GitHub plus real-time help channels—also matters, because “it works on my nodes” is an endless combinatorics problem in HPC, and shared troubleshooting is part of the product of this work.

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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One of the more interesting integrations is “smart surfaces” that combine comfort and sensing. The demo pairs radiant heating elements with capacitive proximity/touch, so the surface can warm quickly for EV energy efficiency while still warning the user as temperature rises and tracking contact to reduce burn risk. The same sensing discipline maps to Hands-Off Detection (HoD) for assisted driving, where the vehicle must detect hand presence even when heating, humidity, or electromagnetic interference would normally confuse a sensor, and it does this with a single-chip touch architecture in mind there.

On the display side, the cockpit is treated as a multi-screen domain: a wide curved OLED dash area plus a separate touchpad zone that supports pinch-to-zoom navigation gestures, touch buttons, and a functional-safety posture aligned with ISO 26262 (Microchip even markets M1-generation maXTouch parts as ASIL-B ready building blocks for large curved displays, including OLED and emerging microLED). Filmed at Embedded World North America 2025, the booth setup also stitches in rear-view camera views, wireless phone charging detection, and lightweight “in-car app” interactions to show how these inputs can coexist inside.

The practical takeaway is that the demo is already “car-real”, but production depends on OEM and Tier-1 integration across the full bill of materials: the display vendor, seat or trim supplier for heating elements, and the ECU teams that own safety cases and cybersecurity boundaries. As the interview notes, a 2–3 year path from reference cockpit to a shipping program is plausible once touch robustness, thermal behavior, and driver-distraction rules are validated on the road.

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Marcus Webster explains how Webster & Webster Associates works as a boutique recruiting and executive-search firm focused on embedded systems and IoT/IIoT roles across North America and Europe, covering engineering, product management, technical sales, marketing, and leadership hires. The emphasis is on finding scarce, domain-specific talent that can ship real products and navigate customer-facing realities, not just interview well. https://www.websterandwebster.com/

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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A recurring theme is fit beyond keywords: technical depth, cultural alignment, and the practical “company fit” that determines whether someone will thrive in a given roadmap, org structure, and go-to-market motion. He describes looking for “diamonds in the rough” by triangulating signals like real embedded experience, problem-solving habits, and communication style, then supporting candidates with resume tuning, interview prep, and offer context to improve outcome quality and long-term value.

There’s also a skills message aimed at engineers: build a T-shaped profile with at least three strong areas, spanning low-level embedded work (firmware, MCU/SoC, drivers, RTOS/Linux) and higher-level system thinking (networking, cloud connectivity, product constraints), while treating AI tooling as part of the modern workflow. He points to “YouTube university,” AI chatbots, and community learning as ways to keep pace without waiting for formal training, especially when stacks evolve quickly.

The conversation was filmed on the show floor at Embedded World North America 2025, where community nodes and meetups help people learn from peers and discover roles they wouldn’t find via generic job boards. Webster highlights cross-border mobility as normal in this market: EU↔US moves, plus work across Japan, Korea, and Taiwan, with sensitivity to cultural differences in outreach, interviewing, and negotiation.

Finally, he clarifies the business model: candidates don’t pay, and client companies fund the search, with the recruiter operating more like an external talent partner than HR. Beyond introductions, they share live market signal—hiring velocity, role demand, and compensation ranges—so CEOs and hiring managers can calibrate plans, and candidates can aim their next move with clearer expectation and zero candidate fee.

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Monogoto CEO Itamar Kunik frames connectivity as the hidden control plane behind modern robots, drones, vehicles, wearables, and any other physical product that needs reliable cloud reach. His core point is software-defined connectivity: treat cellular networking like programmable infrastructure, so developers can ship hardware faster while still getting fleet telemetry, remote access, logs, and update paths that work at scale. https://monogoto.io/

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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A practical pain point he highlights is onboarding friction: many consumer and industrial devices never get connected because Wi-Fi setup is annoying, unstable, or simply skipped by the person who owns the device. Monogoto’s answer is to pre-embed cellular as a managed back channel, so the device can always report health metrics, pull firmware, and stay serviceable even when local networks are down. The comparison to point-of-sale terminals is useful: cellular avoids dependence on venue Wi-Fi and keeps the device reachable in the field today.

Software-defined here means policy and configuration can change after deployment without a truck roll, a recall, or a risky firmware change just to alter networking behavior. That includes region-aware routing and data-residency posture (for example keeping traffic in-region to align with GDPR expectations), plus per-device debugging workflows like temporarily opening specific ports, whitelisting a support IP, or enabling a diagnostic configuration for one unit. Conceptually it’s “connectivity-as-code”: API-driven control over routes, permissions, and device/network state, even as products expand into new countries and carrier environments there.

The panel discussion leans into security maturity for connected products: fleets of scanners, tablets, trucks, and gateways need the same cyber hygiene that cloud-native software teams take for granted. Kunik describes expectations like configurable firewall rules, audit trails, continuous monitoring/observability, and the ability to apply controls such as deep packet inspection, data-leak prevention, or traffic mirroring into enterprise SOC/SIEM tools. The most concrete primitive is secure over-the-air updates and trusted change control, so CVEs and misconfigurations can be fixed quickly without breaking uptime posture.

Filmed at Embedded World North America 2025, the conversation positions programmable connectivity as a foundation for edge AI deployments where devices roam across countries, carriers, and regulatory regimes. Monogoto’s broader framing (public cellular plus private LTE/5G, with satellite NTN also appearing in the wider platform narrative) reflects a shift toward hybrid networking fabrics that keep physical systems observable, supportable, and patchable wherever they operate in the market.

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This talk dives into “mutator dynamics” in spatial, asexual populations: when do high-mutation-rate lineages win, fix, or get reversed by lower-mutation competitors as population size changes. It uses agent-based digital evolution on a 2D lattice to capture selection, drift, and clonal interference, then connects the patterns to hypermutator observations in oncology, antibiotic resistance, and other fast-evolving settings. https://midas.umich.edu/directory/matthew-andres-moreno/

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The compute core is mapping that biology onto the Cerebras Wafer-Scale Engine (WSE-2): ~850,000 small cores, ~40 GB on-wafer SRAM (about 48 KB per core), a 2D mesh where communication is local to neighbors, and constrained host I/O. The simulation is reshaped to match the hardware: locality-preserving updates, neighbor message passing, and tight memory layouts that sidestep global sync.

To make observability fit the device, the run records the wafer-wide state as a single bit per site (high vs low mutation rate), turning frames into a compact distributed bitfield. A generalized ring-buffer scheme then packs time-series samples into fixed memory while staying flexible about run length, with sampling that can be even across history or biased toward recent dynamics depending on the analysis need.

The visual time series highlights two outcomes: one replicate where high-mutation “dark” types take over and stay fixed, and another where low-mutation pockets survive and later recolonize the grid. Performance numbers in the presentation compare CPU, an NVIDIA A100 GPU, and the wafer-scale run, reporting ~100,000× speedup vs CPU and ~294× vs A100 for this workload, which makes larger population sweeps far more reachable. This interview was recorded at Supercomputing SC25 in St. Louis, Missouri.

The broader takeaway is a recipe for running non-deep-learning HPC on AI/ML accelerators: treat sampling as a first-class design constraint, keep data movement local, and use bit-level compression to stretch on-chip SRAM. The talk also points to PSC’s Neocortex program, which provides supported research access to wafer-scale hardware through NSF ACCESS, helping more scientists experiment with these architectures in open science today.

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This interview dives into NEC ExpEther, a PCIe-over-Ethernet concept that turns GPUs, NVMe, and other PCIe endpoints into a remotely attachable resource pool, so CPUs and accelerators don’t have to live in the same chassis to behave like one machine. It’s basically PCIe fabric disaggregation using Ethernet optics as the physical reach, with an eye on composable AI/HPC infrastructure and on-demand device attachment. https://www.nec.com/en/press/202511/global_20251113_01.html

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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In the demo, PCI Express Gen3 x16 traffic is carried over 100GbE across about 2 km of optical fiber, aiming for “close to PCIe” semantics while pushing the link far beyond normal backplane distances. You see an NVIDIA benchmark running on the remote GPU and the rendered output fed back to the host, which is a simple way to visualize how bandwidth, latency, DMA behavior, and reliability trade off when you tunnel PCIe over an Ethernet fabric here.

The practical motivation is infrastructure hygiene: put dense GPU trays where power delivery, direct liquid cooling, acoustic isolation, and physical access control are easier, while keeping CPU nodes nearer to users and sensitive data. A concrete example discussed is a campus deployment at The University of Osaka, where labs keep their own servers but shift hot, noisy accelerators into a centralized GPU pool (NEC describes NVIDIA H100NVL in the trial setup) and connect over 100Gbps fiber as needed, shown at Supercomputing SC25 in St. Louis, Missouri.

On the roadmap side, the conversation points to scaling the bridge from today’s Gen3 toward PCIe Gen5 x16, with later generations in view, which starts to look like a scheduling problem as much as a hardware one. If you can hot-plug accelerators on demand, you can tie this into cluster orchestration, device plugins, and queue-aware provisioning, so more of the AI pipeline becomes “attach what you need, run, detach” without rewriting the full stack from scratch today.

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Veriest describes itself as a chip design partner for silicon vendors, spanning front-end architecture/RTL, back-end physical design, and low-level software that sits close to the silicon (BSP, drivers, bring-up, validation). The discussion frames “AI in semiconductors” as two parallel tracks: building AI accelerators into SoCs, and using AI to speed up the chip creation pipeline itself. https://www.veriests.com/

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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On the “AI to build chips” side, the interview leans into agentic/autonomous systems that can take on repetitive engineering work: design verification, regression triage, log clustering, test generation, coverage closure, constraint hygiene, and debugging support across evolving codebases. The key caveat is data: useful models typically need large, domain-specific corpora (design histories, bugs, waveforms, assertions, sign-off reports), plus a human-in-the-loop loop to keep results trustworthy and aligned with project intent, not just fast work flow.

On the “building AI chips” side, it connects to the edge-AI reality that most embedded vendors now ship: SoCs with on-chip NPUs/NN accelerators tuned for latency, power, and thermal limits. That pushes practical questions into the foreground—operator placement, quantization, memory bandwidth, real-time scheduling, and which modality dominates (vision pipelines, audio inference, sensor fusion), because each drives a different compute/memory profile at the edge.

Later, recorded on the show floor at Embedded World North America 2025, the conversation also touches security as another dual-use mirror: applying AI to security (finding flaws, prioritizing fixes) while also securing AI (model integrity, update chains, and attack surfaces). In chip terms that can mean secure boot, root-of-trust, TEE isolation, side-channel awareness, and supply-chain discipline that protects both firmware and deployed models once devices are out there.

The overall takeaway is pragmatic: today’s AI won’t let you type “make me a 2 nm chip” and walk away, but it can meaningfully compress iteration cycles and reduce the grind in verification and bring-up as complexity keeps rising. If you’re watching the semiconductor stack converge with LLM tooling, NPUs, and safety/security requirements, this is a compact snapshot of where “agentic EDA” meets real product constraints today.

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From the Dell booth at Supercomputing SC25 in St. Louis, this walkthrough focuses on a compact AI platform labeled “XC9785” on-site (likely the PowerEdge XE9785L naming), pairing dual-socket AMD EPYC CPUs with eight AMD Instinct MI355X accelerators for both training and inference. MI355X targets dense, memory-forward AI/HPC, with up to 288GB HBM3E per GPU, roughly 8TB/s memory bandwidth, and expanded low-precision formats (MXFP6/MXFP4) aimed at better throughput-per-watt when models are memory-bound rather than ALU-bound. https://www.dell.com/en-us/shop/ipovw/poweredge-xe9785l

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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A useful detail is the bare GPU board shown without cold plates or heat sinks, which makes the packaging constraints obvious: power delivery, signal integrity, and coolant routing all sit centimeters apart. Dell frames the XE9785L as a 3U direct-liquid-cooled design intended for OV3 (OCP Open Rack v3) deployments in IR7000/IR9000 racks, where shared manifolds and blind-mate interfaces enable higher rack density while keeping service steps predictable in a packed rack.

Next to the accelerator chassis, they point to storage-heavy compute nodes built around AMD’s latest CPUs: up to 24 direct-attached U.2 NVMe drives, with an on-the-spot claim of roughly 300Gbps of storage throughput, plus PCIe Gen5 full-height expansion for high-speed networking. In practice, that maps to the less glamorous but critical parts of AI: fast local NVMe for checkpoints, data staging, and feature/vector stores, then high-bandwidth I/O for scale-out fabrics and NVMe-oF style data paths.

The clearest spec callout is power: MI355X can run up to about 1.4kW per GPU in a liquid-cooled configuration, which is why rack-level cooling architecture, monitoring, and leak-risk mitigation start to matter as much as raw accelerator count. The takeaway is a rack-ready building block for converged HPC and AI workflows—dense GPU compute, PCIe Gen5 I/O, and NVMe-rich nodes designed to keep data moving as aggressively as matrix math in deployment.

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SiliconCore brings a different take on immersive visualization: a fine-pixel-pitch direct-view LED (dvLED) wall used as a stereoscopic “CAVE-style” display, tuned for high frame-rate scientific and engineering data. Instead of putting each viewer in a headset, the wall renders a shared 3D scene with low latency and high luminance, so teams can review volumetric datasets and simulation outputs together. https://www.silicon-core.com/

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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In the demo, the wall runs 3D at 120Hz (effectively 60Hz per eye), with head-tracking so the image updates to your exact viewpoint in real time. SiliconCore says the platform can reach 240Hz, which opens up dual-viewer modes where two tracked users can see the same dataset from different perspectives on the same screen, with less eye/neck strain than typical headset workflows here.

A practical detail is mobility: fold-in “wings” let the display fit through elevators and doors, and a lift plus flight case makes it shippable between labs, floors, or events. Setup is described as largely plug-and-play on the display side, drawing about 500W from a standard outlet, delivering up to ~1,000 nit brightness (with an option for ~1,800 nit using two power feeds) for bright indoor 3D today.

The tracking stack comes from ART (Germany), using IR cameras and reflective markers mounted on active 3D glasses so the renderer can correct perspective continuously as you move. This kind of tracked stereo display is a good fit for HPC centers like HLRS, where collaborative inspection of complex geometry, CFD, digital twins, or medical/scientific volumes benefits from a large shared canvas rather than isolated VR work.

Under the hood, SiliconCore emphasizes vertical control of the LED pipeline (driver ICs, communication, controller/receiver chain), which helps them push high refresh, low power, and deterministic timing that matter for flicker-free stereo and multi-viewer sync. The transcript also hints at real deployments like a NIST CAVE with matched tiles on floor, wall, and ceiling, where identical spare parts and consistent image characteristics simplify maintenance while keeping the 3D workflow usable at close viewing distance edge.

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Congatec gives a compact tour of how its computer-on-module portfolio is pushing more compute into smaller footprints without losing the I/O you need for real products. The headline is COM-HPC Mini on Intel 13th Gen Raptor Lake-P, aimed at edge systems that need PCIe bandwidth, modern display links, and deterministic Ethernet rather than “embedded = slow”. https://www.congatec.com/

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
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COM-HPC Mini lands at 95 x 70 mm and still exposes a serious platform envelope: onboard LPDDR5x, onboard NVMe, PCIe Gen4 plus additional PCIe, SATA, eDP/DP, USB 3.x and USB4, and dual 2.5GbE with TSN capability depending on the variant. The module plugs into an application carrier (shown on a Connect Tech example) where your RAM, connectors, and domain-specific I/O live, and Congatec frames cooling as a first-class design axis with passive, active, and heat-pipe options here.

The booth walk also touches COM Express Type 6 (including the conga-TC700 family on Intel Core Ultra “Meteor Lake” with an integrated NPU-class accelerator) and ruggedized designs like MA-S10 and TC675R that target industrial temperature, vibration, and long-life deployment. On the low-power side, the SMARC lineup spans Arm-based modules such as TI Jacinto parts and the conga-SMX95 on NXP i.MX95, pairing an eIQ Neutron NPU with EdgeLock security for vision, HMI, and control at the rugged edge.

A practical demo ties the stack together: a two-axis balancing table where each motor is driven by its own module and synchronized in real time over Time-Sensitive Networking, while vision inference tracks the moving ball. On the Core Ultra platform, a real-time hypervisor partitions CPU cores into multiple OS instances so motion control, OpenVINO-based object tracking, and UI tasks can coexist with clean timing boundaries, filmed at Embedded World North America 2025 in Anaheim for this demo.

The broader message is modularity as lifecycle insurance: keep the carrier and software contracts stable, swap compute generations (Raptor Lake-P to Core Ultra), and qualify thermals, security (TPM 2.0), and watchdog/health monitoring once, then iterate. Congatec also notes tighter cooperation with Kontron around the JUMPtec module business, expanding the combined x86/Arm module catalog and manufacturing capacity for OEM roadmaps that need long availability, with room to grow more.

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Kingston’s embedded team walks through what “industrial memory” really means when you’re designing single-board computers and edge devices: choosing the right DRAM + NAND mix for capacity, endurance, cost, and how long a product must survive in the field before a service visit even exists. The conversation stays practical around design-in eMMC and DRAM that ships with controlled hardware (stable part numbers and BOM discipline), so integrators can qualify once and manufacture for years with fewer surprises. https://www.kingston.com/en/solutions/embedded-and-industrial

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HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
—

A big part of that promise is qualification work with partners: validating Kingston DRAM and eMMC on real boards (often alongside NXP and other SoCs), then backing it up with signal-integrity testing and protocol analysis in the lab. That’s where the unglamorous details live—high-speed DDR routing margins, timing closure, interface compliance, and catching edge-case behavior before a device ever leaves the bench for a customer site on a board.

On the packaging side, the video maps the “soldered-down menu” you see in embedded designs: eMMC plus discrete DRAM, integrated eMCP (eMMC + LPDDR in one footprint), and ePoP (package-on-package stacked directly on top of a compatible SoC to save PCB area and shorten interconnect). It also explains why Kingston often leans into legacy-friendly roadmaps—low-capacity eMMC like 4GB/8GB and DDR3/DDR4—because long-term availability and revision control can matter more than chasing peak bandwidth in the field.

Edge AI brings the memory hierarchy question into focus: DDR bandwidth and capacity for fast working sets, and NAND (eMMC today, UFS in some next-step designs) for persistent data, model files, and logs. The nuance is endurance math—program/erase limits, write amplification, wear leveling, and using JEDEC health indicators (like eMMC lifetime estimation fields) to plan maintenance instead of guessing. It also touches on why removable media can be risky in industrial settings (vibration, contact reliability, and inconsistent flash behavior), even if it looks cheaper on a spec sheet at trade.

Filmed at Embedded World North America 2025, it’s essentially a design review disguised as a booth chat: how to size memory for video pipelines, sensor logging, and on-device inference, and how to de-risk it with validation workflows rather than late-stage debugging. If you’re building anything from a BeagleBone-class SBC to an industrial HMI or gateway, this is a compact look at the engineering tradeoffs that decide whether a device stays stable out there.

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3M’s electronics materials story is less about any single component and more about making interconnect and protection behave predictably under real constraints: signal integrity, EMI/EMC, heat, vibration, and long service life. In this booth walk-through, Manuel Sen (business manager, electronics for 3M AMIA) connects the dots between cabling, shielding, insulation, and thermal paths—exactly the stuff that decides whether a system passes compliance, stays stable at bandwidth, and survives the factory. https://www.3m.com/3M/en_US/electronics-components-us/

—
HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
—

On the connectivity side, the focus starts with flat cable families built for different environments: high-temperature constructions, halogen-free options, PVC, and twisted-pair variants to reduce noise coupling. Board-to-board robustness and IDC-based sensor connectivity show up as practical answers to rising sensor counts, where discrete wires must reliably reach multiple sensing points without turning assembly into a failure hotspot. This segment is filmed on the SPS show floor in Nuremberg, with a clear emphasis on industrial automation-grade cabling that stays stable over time, not just at first power-up.

Then the conversation shifts to adhesive and tape engineering for electronics, framed in three electrical/thermal roles. Electrically conductive tapes create a controlled grounding path for shielding, helping dump interference to ground instead of letting it pollute sensitive lines. Electrically insulating tapes (including polyester and polyimide constructions) target high temperature plus dielectric performance, while thermally conductive tapes act as a thermal interface to move heat away from dense electronics where airflow and heatsink geometry hit their limit. Converting rolls into die-cut parts for mass production also matters here, as does surface prep—clean, dust-free application is what keeps adhesion stable under vibration and heat.

For high-speed links, 3M highlights thin, heavily shielded TwinAx-style cabling designed to fold and route through tight mechanical envelopes while keeping signal behavior consistent. That “bend it around corners without losing performance” theme is familiar in hyperscale data centers, but it maps cleanly to industrial systems that now carry higher bandwidth across smaller spaces. It also aligns with modern I/O needs where keeping losses low can reduce dependence on retimers and still target interfaces like PCIe Gen5-class performance over short internal runs.

Fiber and vision cabling round out the picture. Expanded Beam Optical (EBO) shifts the weak point of fiber—contamination at the interface—by using an expanded-beam, dust-tolerant approach suited to rugged or dirty environments, including defense-style deployments. For machine vision, the discussion points to standardized ecosystems like USB3 Vision and CoaXPress 2.0, where cable length, flex life, and torsion resistance decide uptime in moving-camera rigs; 3M’s industrial camera cable assemblies are positioned around repeated-bend durability and stable transmission over longer runs. The through-line stays consistent: material science choices that make cables and tapes behave reliably inside a machine, year after year, with EMI, heat, and motion all accounted for in one stack of tape.

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Kontron walks through how its embedded motherboard roadmap is shifting toward on-board AI acceleration, especially with Intel Core Ultra (Meteor Lake-U) platforms that include an integrated NPU (around 11 TOPS) for edge inference. The core message is practical: keep x86 form factors familiar for industrial OEMs, but move compute-heavy vision and signal-processing workloads away from CPU-only execution when latency and power-per-task start to matter. https://www.kontron.com/

—
HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
—

A key demo point is the software path: Intel OpenVINO running on the chip’s integrated NPU, showing the “same model, different engine” comparison between CPU and NPU. That framing matters for embedded teams because it ties together model deployment, acceleration backends, and real-world UX: smoother real-time inference, fewer dropped frames, and more predictable thermals on compact systems like Mini-STX boards.

Beyond Meteor Lake, they position a broad catalog that scales from cost-focused Intel Celeron SoC designs up through newer “Lake” generations, plus AMD-based options such as Ryzen Embedded V10000 and R2000 families. In the same conversation, they also point to ARM-oriented work, including customer-specific carrier boards around Raspberry Pi/SoM-style modules, which is often the fastest route to tailor I/O, power domains, and mechanical constraints without rebuilding the whole compute stack.

Filmed at Embedded World North America 2025, the booth tour then jumps to the higher end of the lineup: industrial server motherboards with onboard 10GbE and a Kontron-developed BMC for remote management (KVM-style access, monitoring, lifecycle operations) without relying on extra third-party tooling. They also name-check Intel Xeon Scalable “Granite Rapids” as the kind of platform they’re targeting when embedded requirements start to look like edge-cloud density, but still need industrial longevity and controlled BOM strategy.

Finally, there’s a strong manufacturing and logistics angle: production in Europe, expanded with a second factory in Slovenia featuring multiple SMT lines and in-line inspection capabilities, plus work tied to 5G broadband programs. For North American customers, they emphasize local presence via a San Diego office and warehouse, aiming for quick sample turnaround and short lead times for off-the-shelf boards, which is often what makes an evaluation phase actually move.

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Realtek demos how to bring Matter interoperability to existing Android TV set-top boxes: add Thread via a small USB dongle, run a TV-side controller app, and a legacy STB starts behaving like a smart-home control point rather than only a video endpoint. The pitch is architectural, not just a gadget: Matter is the application layer, while transport can be Wi-Fi, Ethernet, or Thread, so OEMs can upgrade an installed base without redesigning the whole platform. https://www.realtek.com/

—
HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
—

Technically, the key move is the Thread path. Thread is an IPv6 mesh over IEEE 802.15.4, and the dongle effectively supplies that radio plus the border-router role so the STB can speak to low-power endpoints. Realtek’s RTL8762G/RTL877xG family is positioned for multi-protocol designs (BLE 5.3, Thread/Matter, Zigbee, plus interfaces like USB 2.0 HS and Ethernet), which is the kind of plumbing you need when a TV box becomes a controller rather than a passive client device.

On the device side, they show a compact endpoint that pairs Matter support with a touch LCD UI on the RTL8772GWP, so an accessory can be both a physical control surface and a networked node. In the booth it just flips LEDs, but the same pattern maps to sensors, locks, and small appliances where you want local state, local interaction, and predictable control even when “cloud first” is not an option.

The tour then pivots into latency-sensitive peripherals: ultra-low-latency wireless audio for TWS earphones, and input devices (mouse, keyboard, joystick) targeting up to an 8K report rate, where 8,000 updates per second implies ~0.125 ms sampling granularity in the best case. Realtek’s ecosystem here is about end-to-end latency budgets across radio, USB scheduling, firmware, and host drivers, and the fast booth-walkthrough style echoes the interview pacing you also see around Web Summit Lisbon 2025.

There’s also a “doorbell camera to smartwatch” concept: a live stream moves over 2.4 GHz Wi-Fi to a server (cloud in production, local PC in the demo) and then to a wearable client, illustrating how Realtek platforms can span capture, transport, and playback. Across the demos, the consistent theme is providing silicon plus SDKs and reference stacks so partners can ship connected products without rebuilding every layer, on a busy show floor.

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This video was filmed using the DJI Pocket 3 ($669 at https://amzn.to/4aMpKIC using the dual wireless DJI Mic 2 microphones with the DJI lapel microphone https://amzn.to/3XIj3l8 ), watch all my DJI Pocket 3 videos here https://www.youtube.com/playlist?list=PL7xXqJFxvYvhDlWIAxm_pR9dp7ArSkhKK

Click the “Super Thanks” button below the video to send a highlighted comment under the video! Brands I film are welcome to support my work in this way 😁

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RIKEN’s FugakuNEXT program is framed as a 2030 deployment that builds on what Fugaku (deployed in 2020) did well for large-scale science: strong FP64 throughput for conventional simulation, and a software ecosystem tuned for production HPC. The pitch here is that the next decade’s workload mix is shifting toward hybrid AI + simulation, so the system architecture needs to treat AI performance as a first-class goal rather than an add-on. https://www.fugaku.riken.jp/

—
HDMI® Technology is the foundation for the worldwide ecosystem of HDMI-connected devices; integrated with displays, set-top boxes, laptops, audio video receivers and other product types. Because of this global usage, manufacturers, resellers, integrators and consumers must be assured that their HDMI® products work seamlessly together and deliver the best possible performance by sourcing products from licensed HDMI Adopters or authorized resellers. For HDMI Cables, consumers can look for the official HDMI® Cable Certification Labels on packaging. Innovation continues with the latest HDMI 2.2 Specification that supports higher 96Gbps bandwidth and next-gen HDMI Fixed Rate Link technology to provide optimal audio and video for a wide range of device applications. Higher resolutions and refresh rates are supported, including up to 12K@120 and 16K@60. Additionally, more high-quality options are supported, including uncompressed full chroma formats such as 8K@60/4:4:4 and 4K@240/4:4:4 at 10-bit and 12-bit color.
—

On the CPU side, the discussion centers on Fujitsu’s ARM-based roadmap (the transcript references the current-generation CPU and its move to leading-edge process nodes) and the idea of a richer SoC that could also integrate an NPU alongside general-purpose cores. The key technical tension is familiar in exascale planning: keep strong FP64 for numerics, while also improving throughput per watt for AI-relevant kernels, memory bandwidth pressure, and node-level balance, without locking the platform into a single workload style.

For accelerators, they explicitly assume GPUs will be in the loop, citing NVIDIA’s recent high-end generations (Blackwell) and the following roadmap (Rubin), with the expectation that FugakuNEXT will land after that point. In practical terms, that implies heavy reliance on mixed precision (FP16/BF16/FP8), tensor-style matrix engines, and high-bandwidth memory, while still keeping a path for double-precision science and deterministic numerics when the application demands it at scale.

A lot hinges on the CPU–GPU connection: PCI Express is named as an option, alongside an “NVLink-class” approach, but the bigger requirement is cache-coherent behavior between CPU memory and GPU memory so programmers can treat the machine less like loosely coupled devices and more like a coherent heterogeneous node. They also point to the program mechanics behind that goal—testbeds, coding and code-design strategy, evaluation loops, and a timeline that aligns facility build-out with system integration and software readiness to make it.

What comes through is an HPC roadmap that assumes AI isn’t separate from simulation anymore: think surrogate models inside solvers, learned preconditioners, data assimilation, and large-scale training/inference running next to classic MPI-heavy workloads. The project is presented as a coordinated effort with leadership and support teams, plus an expanded datacenter footprint to host the next platform, reflecting how much of “supercomputer design” is now co-design across silicon, interconnect, cooling, compilers, and production operations for reliability at scale today.

I’m publishing about 90+ videos from Embedded World North America 2025, I upload about 4 videos per day at 5AM/11AM/5PM/11PM CET/EST. Join https://www.youtube.com/charbax/join for Early Access to all 90 videos (once they’re all queued in next few days) Check out all my Embedded World North America videos in my Embedded World playlist here: https://www.youtube.com/playlist?list=PL7xXqJFxvYvjgUpdNMBkGzEWU6YVxR8Ga

This video was filmed using the DJI Pocket 3 ($669 at https://amzn.to/4aMpKIC using the dual wireless DJI Mic 2 microphones with the DJI lapel microphone https://amzn.to/3XIj3l8 ), watch all my DJI Pocket 3 videos here https://www.youtube.com/playlist?list=PL7xXqJFxvYvhDlWIAxm_pR9dp7ArSkhKK

Click the “Super Thanks” button below the video to send a highlighted comment under the video! Brands I film are welcome to support my work in this way 😁

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source https://www.youtube.com/watch?v=C_lyh2gMTV8