Frore Systems walks through a Qualcomm 2-in-1 reference design that pushes thin-and-quiet device engineering by treating thermal design as the limiter, not raw compute. The prototype is about 6 mm thick and uses three solid-state AirJet modules to sustain roughly 18 W of TDP, positioned as a meaningful thickness drop versus a 10 mm class tablet while targeting similar sustained performance behavior. https://www.froresystems.com/
The interesting part is how AirJet changes the usual airflow constraints inside sealed or semi-sealed chassis. AirJet Mini G2 is a thin, solid-state active cooling module (roughly a few millimeters thick) that’s designed to move air with relatively high back pressure, which matters when you add restrictive inlet/outlet paths, gaskets, or fine filtration. Frore’s published figures for Mini G2 commonly reference around 7.5 W heat removal per module in a compact footprint, so scaling to multiple modules becomes a practical way to keep clocks up without resorting to thicker heatsinks or small, fast fans that become the bottleneck under load and dust.
In this demo, the airflow path is also treated like an industrial reliability problem: the design is shown with dust-proof and water-resistant filtration on both intake and exhaust while still maintaining cooling flow, and the filter concept is meant to be replaceable rather than “clean it later with compressed air.” That framing makes more sense once you remember this was filmed at CES Las Vegas 2026, where a lot of “thin device” demos ignore what happens after months in a backpack, workshop, or fleet deployment, and servicing matters as much as peak wattage when the device must stay consistent and serviceable.
Zooming out, Qualcomm reference designs like this are effectively templates for OEMs: they show that a Snapdragon-class 2-in-1 can target sustained performance at higher power budgets inside a very slim chassis, without the acoustic and maintenance tradeoffs that come with conventional active cooling. For AI-leaning workloads that mix CPU, GPU, and NPU utilization—plus continuous video, conferencing, or on-device inference—the payoff is less thermal throttling and more predictable performance per watt, which is ultimately what users notice when a thin system is supposed to behave like a thicker one during real compute.
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