The DragonBoard includes:
- The OPEN-Q™ main board with the Qualcomm Snapdragon S4 Plus APQ8060A processor with dual-core CPUs, Android 4.0 operating system, WLAN/Bluetooth®/FM (WCN3660), GPS (WGR7640), 1GB SDRAM, 16GB eMMC, Connectors: micro SD, Micro HDMI, mini-USB.
- A carrier board with SIM slot, Audio codec (WCD9310), USB, Dual SATA, Dual USB & Ethernet, JTAG & RS 232, 5.1 Audio Surround, Expansion Connectors.
- A peripheral kit which includes a battery, a 4” MIPI Display Capacitive MultiTouch screen Daughter Board, and a MIPI 8MP Camera Daughter Board
ARM provides simulation models a year or more before the first silicon can be made for upcoming ARM Processors, here demonstrating how developers can work today to prepare software for upcoming ARM Processors such as the ARM Cortex-A57 64bit ARMv8 processors that are to be manufactured next year.
Presentation Title: Low-Power Leadership for a Smarter Future
Abstract: Innovation throughout the ARM partnership has resulted in products which have shaped our lives, transforming the way we work, our recreation and how we interact with society.
The future shows little sign of this rate of embedded innovation slowing. Faced with the massive growth in global energy consumption, expected to grow by about 70% in the next 25 years, consumers and commerce alike are looking to the electronics industry for solutions to help save energy and cost. This demand is creating opportunities for ‘smart energy’ innovation throughout the ARM partnership in three key areas: the smart grid, smart meters and, lastly, the connected appliances and systems (including sensors) – that are so important for the Internet of Things. The ability for these appliances to communicate through distributed sensor and control nodes will enable efficient performance, management and maintenance of a wide array of wirelessly connected devices, providing consumers and commerce with greater control over their lives and their energy consumption.
This keynote will track the growth of the ARM ecosystem and examine how, together, the partnership can continue to address the energy efficiency challenges and opportunities that lie ahead.
Speaker Bio: Warren East joined ARM in 1994 to set up ARM’s consulting business. He was Vice President, Business Operations from February 1998. In October 2000, he was appointed to the Board as Chief Operating Officer and in October 2001 was appointed Chief Executive Officer. Before joining ARM, he was with Texas Instruments. He is a chartered engineer, Fellow of the Institution of Engineering and Technology, Fellow of the Royal Academy of Engineering and a Companion of the Chartered Management Institute. He has an honorary doctorate from Cranfield University and is a member of the UK Trade and Investment Executive Board for Technology, responsible for driving the UK’s trade and investment objectives in the telecoms and IT sectors. He is a non-executive director and Chairman of the Audit Committee of De La Rue plc.
Followed by the Executive Roundtable Panel (ARM, GLOBALFOUNDRIES, Samsung, TSMC)
John Kalkman, Vice President, System LSI, Samsung Semiconductor Inc.
Abstract: Mobile computing devices are evolving faster than today’s process technology can support. The solution is in the total system design. By employing a wide range of innovative system centric technologies, we can enable tomorrows workloads today.
Speaker Bio: John Kalkman is Vice President of Marketing for Samsung Semiconductor Inc’s business in the Americas. As a senior member of the development team, John is responsible for setting the strategic direction for Samsung Semiconductor overall System LSI business which includes all logic business including application processor, image sensor and several other contributing silicon. With key target markets such as smartphones, tablets and notebooks, this division is gaining attention throughout the industry for its award-winning Exynos application processors as well as market-leading CMOS image sensor products.
The FRDM-KL25Z is an ultra-low-cost development platform enabled by Kinetis L Series KL1 and KL2 MCUs families built on ARM® Cortex™-M0+ processor. Features include easy access to MCU I/O, battery-ready, low-power operation, a standard-based form factor with expansion board options and a built-in debug interface for flash programming and run-control. The FRDM-KL25Z is supported by a range of Freescale and third-party development software.
Features:
- MKL25Z128VLK4 MCU — 48 MHz, 128 KB flash, 16 KB SRAM, USB OTG (FS), 80LQFP
- Capacitive touch “slider,” MMA8451Q accelerometer, tri-color LED
- Easy access to MCU I/O
- Sophisticated OpenSDA debug interface
- Mass storage device flash programming interface (default) — no tool installation required to evaluate demo apps
- P&E Multilink interface provides run-control debugging and compatibility with IDE tools
- Open-source data logging application provides an example for customer, partner and enthusiast development on the OpenSDA circuit
The K70 MCU family includes 512KB-1MB of flash memory, a single precision floating point unit, Graphic LCD Controller, IEEE 1588 Ethernet, full- and high-speed USB 2.0 On-The-Go with device charge detect, hardware encryption, tamper detection capabilities and a NAND flash controller.
256-pin devices include a DRAM controller for system expansion. The Kinetis K70 family is available in 196 and 256 pin MAPBGA packages.
Check out this cool looking ball that rolls around for an hour on a battery, can be remote controlled using any Android/iOS smartphone and tablet using Bluetooth.
