Category: TechNexion

TechNexion shows worldwide pre-certified IoT modules at Computex 2018

Posted by Charbax – June 13, 2018

TechNexion shows off their new products at Computex 2018: pre-certified IoT modules, Android Things development kits, IP69K embedded systems and more. The booth tour starts with Android Things development kit PICO-PI-IMX7 live demo, based on NXP i.MX7 Dual applications processor and ARM Cortex-A7 architecture has been the go-to development kit since the official Android Things launch at Google I/O in May. The company also demonstrates PICO-IMX8M SoM based on NXP i.MX8M processor and Cortex-A53 + M4 architectures that delivers a whooping 4K UltraHD video performance with HDR and pro audio fidelity for multimedia applications. TechNexion is also launching CE, ETSI, FCC, IC, RCM and TELEC pre-certified IoT wireless communication modules and development kits: PIXI-9377 based on Qualcomm QCA9377, PIXI-6174 based on Qualcomm QCA6174 that deliver high transmission rates, low latency and improved range in noisy industrial environments. The company is showcasing a fully waterproof TWP-1010-IMX6 HMI based on NXP i.MX6 ARM Cortex-A9 processor that was specially designed to withstand extreme environments and cleaning with a jet spray. TWP series likewise includes models based on Intel Braswell architecture. TEK5-APL box PC based on Intel Atom x5-E3930, x5-E3940, x7-E3950 and Apollo Lake architecture, enclosed in a fully ruggedized enclosure for use in a vehicle.

TechNexion Android Things dev kits, modules, embedded systems at the Embedded World 2018

Posted by Charbax – March 7, 2018

TechNexion shows off its Android Things development kits, modules, embedded systems and more new products at the Embedded World 2018. The TechNexion product lineup has grown once again in size. The company is showcasing Android Things development kits based on PICO-PI-IMX7 Low-cost system on modules that are modular, scalable and versatile. The Android Things development boards are based on the NXP i.MX7 applications processor. TechNexion is also launching several wireless communication modules, including PIXI-41Z and the PIXI-9377 low-cost, certified, 1x1 802.11 AC/BT4.1 module that deliver high transmission rates, low latency and improved range.

TechNexion is a provider of embedded systems and system-on-modules, in 2017, TechNexion was chosen by Google as a partner to develop the reference design for its Android Things development kit. That kit based on the PICO-PI-IMX7 board has been the go-to development kit distributed at developer shows and used for demoing the potential of Android Things.

The New TechNexion PIXI series is a communication module that delivers all IoT multi-mode communication needs in one ultra-compact and secure module series. It is specifically designed to enable better transmission rates, lower latency, better range and higher resistance to interference when two or more communication protocols – for example, Wi-Fi, Bluetooth or Thread - are needed to run concurrently on one system-on-chip. Multiple communication protocols in one chip means users can collect more data from disparate communication protocols, while also having the flexibility to use the right protocol to suit the type of data and distance from your hub.

Panel PCs – TechNexion has three human-machine-interface (HMI) panel computing series: TC, TEP and TWP. The TEP Series is available with either ARM or x86 architecture and has an IP65 anodized aluminum enclosure and a flux mounted projective capacitive touch, high brightness LCD display - ranging from 5 to 15.6 inches. The TWP Series is a fully waterproof, IP69K, panel PC designed to withstand extreme temperatures, high vibration, and cleaning with a jet spray. It is also available with either ARM or x86 architecture – ranging from 10 to 15.6 inches. The TEP-1560-IMX6 is their 15” panel computer based on i.MX6 and the TWP-1560-IMX6 is their NEW model that is waterproof, stainless steel, panel computer.

Fanless Box PCs - The TEK Series fanless computing systems are enclosed in a compact, fully ruggedized enclosure, and are perfect for controlling versatile end-equipment.

System-on-Modules – TechNexion continues to expand its SoM options through its two series, EDM and PICO. These series have an exhaustive range of options around size, processor capability and connector type enabling the creation of almost any kind of embedded device. They are designed to be scalable and come with fully open source software – Linux and Android - and schematics.

WandPi-8M community board – TechNexion were also showing the latest version of their community development board. It is based on NXP’s i.MX8M Quad application processor with ARM Cortex-A53 + M4 architecture to deliver 4K UltraHD with HDR video quality with pro audio fidelity. The WandPi-8M is available for pre-order and is expected to ship in Spring of this year.

TechNexion Factory Tour

Posted by Charbax – June 16, 2017

TechNexion is a design and manufacturing company showing in this video its engineering team, that designs IoT smart devices, development boards for the needs of projects like the ARM powered Android Things ecosystem by Google or Amazon Alexa Voice-Recognition development platform and its advanced manufacturing capabilities. In the video, we get a direct glimpse of how ARM modules and systems are designed and how much automation is being utilized in a smart SMT factory. The video tour takes you through all production stages from the module design to SMT manufacturing to post production functional testing. The factory churns out up to 250K PCBA per month. Filmed on location at the TechNexion factory in Taipei, Taiwan in June 2017.

Android Things Development Board by TechNexion

Posted by Charbax – June 4, 2017

TechNexion shows the Android Things ARM Powered development platform designed to enable energy-efficient, secure and portable applications for Google's Internet of Things ecosystem strategy. The development platforms provide hardware that developers need to speed up their IoT projects on the Android Things platform as well as onto other supported platforms such as Ubuntu, Debian, Yocto Project, regular Android and more. TechNexion also continues to build on its complete lineup of System on Modules designed for modular, versatile, scalable and low-power applications that can be easily integrated into other devices for all types of IoT development.

Android Things on TechNexion Pico i.MX7D, i.MX6UL and soon i.MX8M

Posted by Charbax – May 20, 2017

Google Android Things launch partner, TechNexion Pico Pi SoM is an ARM Powered Google Android Things IoT development System on Module, the NXP Pico i.MX7D Dual Core ARM Cortex-A7 with ARM Cortex-M4, NXP Pico i.MX6UL and soon also it will be with 64bit i.MX8M Quad Core ARM Cortex-A53 and ARM Cortex-M4. These TechNexion Android Things System on Modules can dock into a Raspberry Pi form factor for development and expansion of advanced IoT projects using Android Things, you can read more about Android Things at http://iot.google.com and https://developer.android.com/things/hardware/developer-kits.html

you can see the TechNexion Android Things SoM at the Google I/O keynote about Android Things 19 minutes, 50 seconds into the video here:

TechNexion ARM industrial modules, NXP i.MX7D dual-core ARM Cortex-A7 with ARM Cortex-M4

Posted by Charbax – June 8, 2016

TechNexion is a Taiwanese company under European Management with own manufacturing facilities in Taipei, Taiwan. Florian Wohlrab, Marketing manager at TechNexion shows us around their booth at COMPUTEX 2016. The first thing to see is their tiny Modules which pack an ARM based NXP i.MX6/7 CPU (UltraLite/Solo/DualLite/Dual/Quad) with RAM, Memory and WiFi on just 36mm x 40mm. They are also the only one running a NXP i.MX7 live demo at their booth. The NXP i.MX7D is with 2x Cortex-A7 and a Cortex-M4 this a tiny, ultralow power, that can be used for vending machines, industrial applications or generic headless systems. TechNexion is also committed to the open source EDM standard for ARM Modules. Their boards are fit for Digital Signage, rugged industrial Applications and many more. Technexion can scale up to the NXP i.MX6 QUAD Plus, which will be available shortly. They also have some cool ARM bassed systems like their BoxPC the TEK Series. This Box PC’s have MiniPCIe slots with SIM-Card holder inside and also M.2 Slots for memory upgrade. Technexion also supports USB Type-C and for automation a VGA connector as well a HDMI to fit it for Digital Signage as well. Inside is a modular system which allows you to switch e.g. Power input between 12V/24V/10~30V/PoE (Power over Ethernet). TechNexion HMI series ranges from 7” to 10” and 15” again with NXP processors. All the Software is freely available on their website with no need to register.

You can Contact TechNexion here: sales@technexion.com
TechNexion Website: http://www.TechNexion.com

TechNexion ARM modules

Posted by Charbax – June 8, 2012


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TechNexion announces Freescale i.MX 536 System on Module

Posted by tdomf_6f838 – December 31, 2011

TechNexion announces their upcoming Freescale i.MX 53 based TMX-536 System on Module together with Bachata carrier board.

Development kits will become available in the first quarter of 2012 that will come as all previous TechNexion development kits with source code linux, android and windows embedded compact 7 support backed up with unbeatable documentation to give people all the information that they need to successfully implement TechNexion SoM's in their project.