Category: Chip provider

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Toradex shows Deep Learning Accelerators, Edge AI with Gyrfalcon, Xnor.ai, Movidius and More

Posted by Charbax – March 14, 2019

Toradex shows their deep learning inference solutions at Embedded World 2019, using power-efficient, Arm-based System on Modules, as machine learning and deep learning using neural networks progress is accelerating with successful new applications in computer vision for the embedded world. Toradex simplifies the integration of these technologies into products with its System on Modules, training deep learning models on high-performance computers with frameworks like TensorFlow, with optimizations needed to improve performance on low-power embedded Linux devices such as the ones Toradex partners with Au-Zone, Xnor.ai and Antmicro and others to bring to the embedded market. Implementing these dedicated neural network accelerators can boost the performance of embedded devices while keeping power consumption low, as shown in Toradex’s solutions with Intel Movidius Myriad and Gryfalcon Lightspeeur. Toradex partners with Allied Vision to showcase the brand-new Alvium industrial MIPI CSI-2 camera as a crucial component in the pasta detection demo which uses an Apalis System on Module featuring the NXP i.MX 8 QuadMax SoC with Cortex-A72, Cortex-A53 and dual OpenCL-capable GPU. To learn more about the demo, see CNX-Software's blog post. A real-world application example of deep learning is Manta, a camera-based drowning detection system from Coral Detection Systems which is solar-powered, and the video analytics are done on a Toradex Apalis module featuring a Nvidia TK1 SoC with a CUDA-enabled GPU. If a person is at risk of drowning, the system can alert its user acoustically or via smartphone.

Samsung Galaxy S10 teardown, reveals the Samsung Exynos 9820

Posted by Charbax – March 14, 2019

ChipRebel has provided this video of their teardown of the Galaxy S10 (also see their Exynos 9820 photos here: https://www.chiprebel.com/exynos-9820/) which has the 8nm LPP Exynos 9820 with Samsung's dual custom cores, dual ARM Cortex-A75 and quad ARM Cortex-A55 and Mali-G76 MP12 GPU and Samsung's most advanced NPU. With LTE Category 20 for up to 2.0Gbps download speed with 8x carrier aggregation (CA) and up to 316Mbps upload speed support. This phone amazingly can support encoding and decoding of of up to 8K30p.

You can find the High-res images of Samsung's Exynos 9820 SoC inside the Galaxy S10 at https://www.chiprebel.com/galaxy-s10-teardown/ and you can subscribe to ChipRebel on YouTube here

TechNexion shows i.MX8M Mini, Intel Apollo Lake, Qualcomm QCA9377, QCA6174 at Embedded World 2019

Posted by Charbax – March 11, 2019

TechNexion shows their lineup of new devices based on the ultra low-power NXP i.MX8M Mini in their ultra-small PICO form factor combining ARM Cortex-A53 and an M4 microcontroller at embedded world 2019, it supports Android, Linux, Yocto, Ubuntu OS is only 37 x 40 mm and at a low cost. The SoM integrates a fully certified wireless module PIXI-9377 based on Qualcomm QCA9377. They also show their Qualcomm QCA9377, QCA6174 devices and more. TechNexion announces two new SoM families: AXON and FLEX. AXON is a product family of small form factor (58 x 37 mm) modules designed for specialized embedded applications requiring another dimension of I/O flexibility. AXON-IMX8M-MINI is also based on NXP i.MX8M Mini applications processor and features AXON Fabric programmable logic, a specialized IC that provides additional functions including nearly infinite pinmuxing, allowing for true pin-to-pin compatibility between SoC versions. FLEX series, on the other hand, is a low-cost family making use of low-cost LPDDR4 SO-DIMM connector. FLEX-IMX8M-MINI (69.6 x 35 mm) offers HD multimedia streaming and integrated 3D graphics at a price point for the cost sensitive market. TechNexion launches several products based on Intel Apollo Lake processor family (Intel Atom x5-E3930, x5-E3940 or x7-E3950) that can be easily deployed in diverse industrial applications ranging from manufacturing robots and machinery, to radar and sensors on ships, trains and automobiles, to in-vehicle experience, video systems and more. TC-1010-APL and TC-1560-APL Multi Touch HMIs come in 10.1” and 15.6” sizes. On the other hand, TCK3-APL is a ruggedized box PC fully customizable to handle your projects with IoT integration. TechNexion also shows their expanded lineup of fully certified (CE / ETSI / FCC / IC / RCM / TELEC) PIXI and STIX series combo wireless communication modules based on Qualcomm QCA9377 and QCA6174 solutions. The modules are available in several M.2 and in the mini-PCIe form factor.

Microchip Mi-V RISC-V CPU with Microsemi FPGA

Posted by Charbax – March 11, 2019

Microchip acquired Microsemi, and with it comes their new Mi-V RISC-V ecosystem, a suite of tools and design resources developed by Microsemi and third parties to support RISC-V designs using RISC-V Soft IP Cores available for RTG4, IGLOO2 and PolarFire FPGAs, introducing the industry's first RISC-V SoC FPGA Architecture, PolarFire SoC which brings deterministic real-time performance to Linux in a coherent multi-core RISC-V CPU. The RISC-V Mi-V Ecosystem consists of various design tools such as the Libero SoC FPGA Design Suite, Eclipse based IDE SoftConsole enabling quick C and C++ development, a Firmware Catalog consisting of numerous drivers, and third party platforms for development, simulation and debug.

€2299 Huawei Mate X Flexible phone, with keynote

Posted by Charbax – March 10, 2019

Huawei unveiled their Huawei Mate X flexible foldable phone, the best such flexible phone demonstration yet, though they launch it way way too expensive at €2299. On the other hand they were able to position the flexible display based phone as the ultimate phone one would be able to get, pushing the industry towards making this form factor popular sooner rather than later. This might be a flexible display provided to Huawei by BOE, I filmed BOE's flexible displays for phones here and here you can also see all my other flexible display videos that I have been filming for the past several years here

Huawei MateBook 14, 1.49 kg, 15.9 mm

Posted by Charbax – March 10, 2019

At about $500 cheaper than the Huawei MateBook X Pro New with the same 8th generation Intel core processor, 2 GB GDDR5 Nvidia MX250 GPU performance, 1.49 kg, 15.9 mm thick, comes with 90% screen-to-body ratio and wide 3:2 aspect ratio 2160x1440 display with 100% sRGB and Huawei Share OneHop.

€449 Xiaomi Mi 9, Qualcomm Snapdragon 855, €599 Xiaomi Mi Mix 3 5G, MWC 2019 keynote

Posted by Charbax – March 7, 2019

Xiaomi Mi 9 is launched at €449, runs on the 7nm Qualcomm Snapdragon 855, with a 6.39" display, triple cameras including a 2x telephoto optical zoom lens, it can record 4K60 and comes with a 3300 mAh battery. The 5G version of the Xiaomi Mi Mix 3 is also to be available at €599. This video includes my highlights filmed at the Xiaomi Mobile World Congress 2019 keynote which you can also watch the official full video of here.

€299 Archos Diamond bezel-less, Archos Oxygen, Smart Speakers, Smart Lights and 101S Oxygen Tablet

Posted by Charbax – March 7, 2019

Archos Diamond has a 6.39" HD+ 2160x1080 AMOLED display, powered by the MediaTek Helio P70 ARM Cortex-A73/A53 octa-core CPU with an ARM Mali-G72 GPU. Archos Oxygen 68 at 149eur, 63 at 129eur, 57 at 99eur. Archos also shows their Amazon Alexa smart speakers, the 19.90eur Archos Smart LED Lights that work with Google Assistant and Amazon Alexa. Archos 101S Oxygen Tablet based on MediaTek X20 deca-core with 3GB RAM and 32GB Flash, comes with a special charging and speaker dock.

MediaTek Helio P90, dual ARM Cortex-A75, six ARM Cortex-A55

Posted by Charbax – March 6, 2019

MediaTek Helio P90 dual ARM Cortex-A75 with 6 ARM Cortex-A55 in an octa-core cluster, with powerful AI APU 2.0 with 1165GMACs performance, Imagination PowerVR GM 9446 GPU, LPDDR4X memory, supports up to 48MP camera sensors (44.7% larger than 8K), 48MP at up to 30FPS with zero delay (ZSD) or 480FPS in 16MP. Dual camera arrays of up to 24+16MP can do 30fps bokeh live-previews that are 6X faster and 2.25X higher resolution than competitor claims MediaTek. Upgraded triple ISP that’s now capable of 14-bit RAW and 10-bit YUV processing. CorePilot control that supports ACAO (all cores all open), AI-enhanced low-light noise reduction algorithm is 4X faster and is also the first ever AI-feature in CV (computer vision) performance. MediaTek’s latest 4G LTE WorldMode modem introduces 4x4 MIMO, 3CA and 256QAM that provides more reliable connectivity performance even in densely populated spaces such as stadiums, busy shopping districts, offices or at the airport.

$449 Qualcomm Robotics RB3 Platform Snapdragon 845 Development Board, Embedded World 2019 booth tour

Posted by Charbax – March 3, 2019

Qualcomm and Thundercomm launches the Robotics RB3 Platform 96Boards development board (available for $449 at Thundercomm), supports the development of smart, power-efficient, and cost-effective robots, uses heterogeneous computing and Qualcomm Artificial (AI) Engine to support on-device machine learning, computer vision, robust security, multimedia, Wi-Fi, and cellular connectivity capabilities, based on the Qualcomm SDA845/Qualcomm SDM845 SoC. It includes hardware, software, and development tools, the Qualcomm Robotics RB3 platform is designed to help manufacturers and developers create robotic products, ranging from large industrial and enterprise robots to small battery-operated ones with challenging power. This video also features a tour of the Qualcomm booth at Embedded World 2019, featuring all the LTE for IoT modems such as the MDM9206 and the MDM9205 LTE IoT modem, and development boards available from Qualcomm's partners including Geniatech, Intrinsyc, eInfoChips, Altek, Inforce Computing, Keith and Koep, Shiratech, Basler and more.