Category: NXP

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TechNexion Android Things dev kits, modules, embedded systems at the Embedded World 2018

Posted by Charbax – March 7, 2018

TechNexion shows off its Android Things development kits, modules, embedded systems and more new products at the Embedded World 2018. The TechNexion product lineup has grown once again in size. The company is showcasing Android Things development kits based on PICO-PI-IMX7 Low-cost system on modules that are modular, scalable and versatile. The Android Things development boards are based on the NXP i.MX7 applications processor. TechNexion is also launching several wireless communication modules, including PIXI-41Z and the PIXI-9377 low-cost, certified, 1x1 802.11 AC/BT4.1 module that deliver high transmission rates, low latency and improved range.

TechNexion is a provider of embedded systems and system-on-modules, in 2017, TechNexion was chosen by Google as a partner to develop the reference design for its Android Things development kit. That kit based on the PICO-PI-IMX7 board has been the go-to development kit distributed at developer shows and used for demoing the potential of Android Things.

The New TechNexion PIXI series is a communication module that delivers all IoT multi-mode communication needs in one ultra-compact and secure module series. It is specifically designed to enable better transmission rates, lower latency, better range and higher resistance to interference when two or more communication protocols – for example, Wi-Fi, Bluetooth or Thread - are needed to run concurrently on one system-on-chip. Multiple communication protocols in one chip means users can collect more data from disparate communication protocols, while also having the flexibility to use the right protocol to suit the type of data and distance from your hub.

Panel PCs – TechNexion has three human-machine-interface (HMI) panel computing series: TC, TEP and TWP. The TEP Series is available with either ARM or x86 architecture and has an IP65 anodized aluminum enclosure and a flux mounted projective capacitive touch, high brightness LCD display - ranging from 5 to 15.6 inches. The TWP Series is a fully waterproof, IP69K, panel PC designed to withstand extreme temperatures, high vibration, and cleaning with a jet spray. It is also available with either ARM or x86 architecture – ranging from 10 to 15.6 inches. The TEP-1560-IMX6 is their 15” panel computer based on i.MX6 and the TWP-1560-IMX6 is their NEW model that is waterproof, stainless steel, panel computer.

Fanless Box PCs - The TEK Series fanless computing systems are enclosed in a compact, fully ruggedized enclosure, and are perfect for controlling versatile end-equipment.

System-on-Modules – TechNexion continues to expand its SoM options through its two series, EDM and PICO. These series have an exhaustive range of options around size, processor capability and connector type enabling the creation of almost any kind of embedded device. They are designed to be scalable and come with fully open source software – Linux and Android - and schematics.

WandPi-8M community board – TechNexion were also showing the latest version of their community development board. It is based on NXP’s i.MX8M Quad application processor with ARM Cortex-A53 + M4 architecture to deliver 4K UltraHD with HDR video quality with pro audio fidelity. The WandPi-8M is available for pre-order and is expected to ship in Spring of this year.

Diamond Systems Zeta SBC, Ethernet switch solutions, Sabre enclosures at Embedded World 2018

Posted by Charbax – March 7, 2018

Diamond Systems founder Jonathan Miller shows the company’s newest products at Embedded World 2018 including the COM-based Zeta SBC, EPSM-10GX (used to connect to a carrier board) and EPS-24G2X Ethernet switch solutions. As Miller explains, the EPS-24G2X brings out all the signals including those for the two 10G SFI ports. There is a lot of Ethernet available via this solution. It’s all about communication, sharing information and so some people want more ports. The switches discussed are examples of those found in unmanned vehicles as well as many other rugged applications. Included in these new products is the EPS-12GMini, one of the world’s smallest 12-port Ethernet switches is a two-board design enabling its small form factor for on-board vehicle use (military and industrial).

The rugged enclosure called SABRE is the newest of Diamond Systems’ enclosures, this rugged box provides protection in the harshest environments and enables complete solutions for their customers. The one on display, Sabre, at this show is for the COM Express Mini form factor and it accommodates the 12-port switch. On the front is a set of three military connectors. Next is a an Industrial MIDI enclosure with a variety of I/O brought out to the front which accommodates an Eagle SBC which uses Toradex Apalis ARM modules and Diamond Eagle carrier board that goes inside along with a variety of I/O (serial ports, CAN ports, connectors, display, analog). Diamond has an ongoing relationship with partner Toradex who I also filmed at EW2018 here

More boards on display in their booth includes the Analog I/O modules: DMM-16-AT along with DMM-16RP-AT which is bus agnostic. Eaglet, a more compact version of the earlier noted Eagle SBC. The discussion turns to PC/104 where Miller notes the longevity of the product and long value it has had as a form factor. A little later, PCIe MiniCards are shown and discussed as used: I/O; CAN module, Analog I/O module; Ethernet and digital I/O.

Pandora box with connectors on the board for connecting directly into the box. Plug in and go. Typically used on a controller.

Products shown on the right half of the booth are proven designs that they have had on the market now already for a while. A large part of the sales are based on these designs and are custom in some fashion depending on customer's request.

Next for Diamond are more small things, COM Express, small form factors and more. You can read more about their solutions at http://diamondsystems.com

Toradex Apalis iMX8QM, NXP i.MX 8QM, and more demos at EW2018

Posted by Charbax – March 7, 2018

Toradex booth tour at Embedded World 2018 featuring their new Toradex Apalis iMX8 QM System on Module (SoM) based on the NXP’s i.MX 8QuadMax processor. Toradex’s demos featuring the Apalis iMX8QM includes one with Qt 3D Studio. The Apalis iMX8QM offers one click OS installation via the Toradex Easy Installer and offers 2x Arm Cortex-A72 cores, 4x Cortex-A53 cores, and 2x Cortex-M4 cores. The Apalis iMX8QM also contains on-board dual-band 802.11ac 2x2 MU-MIMO Wi-Fi and is Bluetooth 5 ready. This SoM offers advanced hardware security and safety features, and is ideal for signal processing, computer vision and HMI applications. Interested third parties can sign up for early access for the Apalis iMX8QM here

In addition, Toradex is also showing their soon to be available Toradex Colibri iMX8X SoM, based on NXP’s i.MX 8X processor. With 2-4x Arm Cortex-A35 cores and 1x Cortex-M4 core, the SoM is ideal for industrial automation, HMI, robotics, building applications and healthcare. The Colibri iMX8X also contains on-board dual-band 802.11ac 2x2 MU-MIMO Wi-Fi and is Bluetooth 5 ready.

Toradex also showcases some of their other demos such as a Deep Learning demo featuring its Toradex Apalis TK1 SoM in collaboration with its partner Vertex.AI, the demo highlights Vertex.AI’s Vision deep learning and object detection software, and is a complete end-to-end deep learning demo, showcasing pasta detection. Additionally, Toradex has a demo in collaboration with its partner, Roboception, which integrates Toradex’s Apalis TK1 SoM for high-performance onboard processing, the demo has onboard SLAM for indoor and outdoor navigation, accurate visual-intertial motion estimation, and standard interfaces for an intuitive WEB-GUI.

Toradex also has a range of demos highlighting its Toradex partner ecosystem. From CODESYS’ real-time SoftPLC with EtherCAT, Crank’s low- and high-end UI, DiSTI’s safety focused HMI, Green Hills’ INTEGRITY RTOS on Colibri iMX6, Antmicro’s Android on Vision Kit, Acontis’ optimized EtherCAT, TES’ 3D Surround View/Guiliani, Mender.io’s over-the-air updates, Christmann’s Apalis computer cluster, Gumstix’s voice control carrier board, MVTec’s HPeek and more.

To stay up-to-date with news from Toradex, you can sign up to their newsletter here.

Latest from the Linaro Digital Home Group at Linaro Connect San Francisco 2017

Posted by Charbax – October 3, 2017

Mark Gregotski, DIrector of the Linaro Digital Home Group, provides an update on the latest work in open source for the Digital Home Group that LHG is working on including the adoption of OP-TEE (Open Portable Trusted Execution Environment) with DRM integrations including PlayReady DRM PK v3.3 on AOSP 8.0 on the HiKey960 development board and Widevine for Linux and for Android AOSP. NXP demonstrates some of their work, NXP has recently joined the Linaro Digital Home Group. The LHG group has worked to integrate V4L2 with gstreamer and ffmpeg to improve media playback on ARM offloading all the computation onto the video codec hardware of the SoC.

Purism Librem Debian phone, fully open source, Librem 11, 13, 15 Laptops

Posted by Charbax – September 29, 2017

Purism Phone is crowdfunding at https://puri.sm/shop/librem-5/ ($847'454 raised thus far) runs PureOS based on Debian Free/Libre and Open Source software and a GNU+Linux Operating System, it can run most GNU+Linux distributions, it's runs many other upstream projects, it's world’s first ever IP-native mobile handset with end-to-end decentralized communications via Matrix, with a 5″ display, Security focused by design, Privacy protection by default, works with 2G/3G/4G, GSM, UMTS, and LTE networks with an i.MX8 or i.MX6 CPU separate from Baseband with open-source GPU drivers, Hardware Kill Switches for Camera, Microphone, WiFi/Bluetooth, and Baseband. Purism also has a track record of delivering fully open source Intel powered laptops the Librem 11 2-in-1, the Librem 13 and the Librem 15.

TechNexion Factory Tour

Posted by Charbax – June 16, 2017

TechNexion is a design and manufacturing company showing in this video its engineering team, that designs IoT smart devices, development boards for the needs of projects like the ARM powered Android Things ecosystem by Google or Amazon Alexa Voice-Recognition development platform and its advanced manufacturing capabilities. In the video, we get a direct glimpse of how ARM modules and systems are designed and how much automation is being utilized in a smart SMT factory. The video tour takes you through all production stages from the module design to SMT manufacturing to post production functional testing. The factory churns out up to 250K PCBA per month. Filmed on location at the TechNexion factory in Taipei, Taiwan in June 2017.

Android Things Development Board by TechNexion

Posted by Charbax – June 4, 2017

TechNexion shows the Android Things ARM Powered development platform designed to enable energy-efficient, secure and portable applications for Google's Internet of Things ecosystem strategy. The development platforms provide hardware that developers need to speed up their IoT projects on the Android Things platform as well as onto other supported platforms such as Ubuntu, Debian, Yocto Project, regular Android and more. TechNexion also continues to build on its complete lineup of System on Modules designed for modular, versatile, scalable and low-power applications that can be easily integrated into other devices for all types of IoT development.

Netronix solar E Ink Bus Timetable, 13.3″ Mobius e-reader, 6.8″, Shelf Labels, 32″ color

Posted by Charbax – June 4, 2017

Netronix shows some of their latest E Ink devices, including color E Ink, ePaper Bus Stop that can be solar powered, electronic shelf labels and the 13.3" Flexible Mobius e-reader and the 6.8" E Ink device with digitizer.

Android Things on TechNexion Pico i.MX7D, i.MX6UL and soon i.MX8M

Posted by Charbax – May 20, 2017

Google Android Things launch partner, TechNexion Pico Pi SoM is an ARM Powered Google Android Things IoT development System on Module, the NXP Pico i.MX7D Dual Core ARM Cortex-A7 with ARM Cortex-M4, NXP Pico i.MX6UL and soon also it will be with 64bit i.MX8M Quad Core ARM Cortex-A53 and ARM Cortex-M4. These TechNexion Android Things System on Modules can dock into a Raspberry Pi form factor for development and expansion of advanced IoT projects using Android Things, you can read more about Android Things at http://iot.google.com and https://developer.android.com/things/hardware/developer-kits.html

you can see the TechNexion Android Things SoM at the Google I/O keynote about Android Things 19 minutes, 50 seconds into the video here:

Toradex at Microsoft Booth with Azure IoT Hub, Windows 10 IoT Core and Windows Embedded Compact

Posted by Charbax – May 19, 2017

At the Microsoft booth, Toradex demonstrated its multiplatform system connected to the Microsoft Azure IoT Hub – the Cloud Parking demo. Toradex System on Modules (SoMs) were employed in the access control, license plate recognition and the payment system, the communication between them made only through the internet, using only the Azure services. Linux, Windows 10 IoT Core, and Windows Embedded Compact are used as Operating Systems on the modules. Additionally, an interesting Toradex showcase included their new Heterogeneous Multicore Low Power demo featuring the Colibri iMX7D based on the NXP i.MX 7 Dual Core SoC.