Congatec gives a compact tour of how its computer-on-module portfolio is pushing more compute into smaller footprints without losing the I/O you need for real products. The headline is COM-HPC Mini on Intel 13th Gen Raptor Lake-P, aimed at edge systems that need PCIe bandwidth, modern display links, and deterministic Ethernet rather than “embedded = slow”. https://www.congatec.com/
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COM-HPC Mini lands at 95 x 70 mm and still exposes a serious platform envelope: onboard LPDDR5x, onboard NVMe, PCIe Gen4 plus additional PCIe, SATA, eDP/DP, USB 3.x and USB4, and dual 2.5GbE with TSN capability depending on the variant. The module plugs into an application carrier (shown on a Connect Tech example) where your RAM, connectors, and domain-specific I/O live, and Congatec frames cooling as a first-class design axis with passive, active, and heat-pipe options here.
The booth walk also touches COM Express Type 6 (including the conga-TC700 family on Intel Core Ultra “Meteor Lake” with an integrated NPU-class accelerator) and ruggedized designs like MA-S10 and TC675R that target industrial temperature, vibration, and long-life deployment. On the low-power side, the SMARC lineup spans Arm-based modules such as TI Jacinto parts and the conga-SMX95 on NXP i.MX95, pairing an eIQ Neutron NPU with EdgeLock security for vision, HMI, and control at the rugged edge.
A practical demo ties the stack together: a two-axis balancing table where each motor is driven by its own module and synchronized in real time over Time-Sensitive Networking, while vision inference tracks the moving ball. On the Core Ultra platform, a real-time hypervisor partitions CPU cores into multiple OS instances so motion control, OpenVINO-based object tracking, and UI tasks can coexist with clean timing boundaries, filmed at Embedded World North America 2025 in Anaheim for this demo.
The broader message is modularity as lifecycle insurance: keep the carrier and software contracts stable, swap compute generations (Raptor Lake-P to Core Ultra), and qualify thermals, security (TPM 2.0), and watchdog/health monitoring once, then iterate. Congatec also notes tighter cooperation with Kontron around the JUMPtec module business, expanding the combined x86/Arm module catalog and manufacturing capacity for OEM roadmaps that need long availability, with room to grow more.
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