Rittal North America uses this booth tour to show why AI data centers and hyperscale GPU clusters depend on robust physical infrastructure, not just servers and software. The focus is on modular enclosures, Open Compute Project (OCP) racks, DC busbar power distribution and single-phase direct liquid cooling that can remove over one megawatt of thermal load from dense IT footprints, enabling deployment of large language model training and other compute-intensive workloads in production data infrastructure. https://www.rittal.com/com-en/products/Innovations/Direct-Liquid-Cooling
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At the heart of the demo is Rittal’s rack-format Coolant Distribution Unit, a water-based direct-to-chip liquid cooling (DLC) system designed around OCP ORV3 form factors and GPU sleds. Each drawer is rated for roughly 250 kW of heat removal capacity, so operators can deploy 250, 500, 750 or 1 MW per row with an N+1 spare module for service and redundancy. Technology water circulates through supply and return manifolds to cold plates at the processor level, while facility water on the secondary loop carries that heat back toward chiller plants and external heat rejection equipment across the site.
The conversation dives into deployment topics such as growth planning, hydraulic design and power provisioning. A single megawatt CDU can require on the order of 400 gallons per minute of flow, so a 20 MW campus implies several thousand gallons per minute together with matching electrical distribution and grid capacity. Rittal stresses modularity so operators can start with a few OCP racks at 250 or 500 kW of cooling and scale out row by row as AI demand ramps instead of overbuilding a full megawatt cluster on day one.
Beyond direct-to-chip DLC, the video also covers Rittal Liquid Cooling Package (LCP) units that provide roughly 50–60 kW of air-to-water cooling for conventional 19-inch rack deployments. These in-row LCP systems pull hot exhaust air from standard server, storage and networking racks, pass it through coil heat exchangers and return chilled air to the IT aisle, making them suitable for mixed environments where traditional servers coexist with liquid-cooled OCP racks in the same white space. This flexibility lets operators handle both legacy and next-generation workloads in one coherent thermal architecture.
Filmed at Supercomputing 2025 in St Louis, the discussion closes on monitoring and control, with sensors, leak detection and networked logic that allow data center teams to manage coolant distribution and thermal headroom from a central operations console. Instead of simply moving water, the CDU and LCP systems dynamically allocate flow to the hottest cabinets, maintain redundancy at the pump level and support gradual migration from air cooling to liquid cooling as AI, HPC and cloud workloads continue to grow across the industry.
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