Media Tek demonstrated a micro-LED optical data transfer technology for data center applications at Computex 2026. This technology, developed as a co-development proof of concept in collaboration with Microsoft, aims to replace copper connections in high-performance computing environments. By integrating micro-LEDs directly onto silicon, the project explores new architectures for high-bandwidth data transmission.
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The proof of concept integrates more than 150 micro-LEDs on a single CMOS-compatible silicon die. Each individual micro-LED operates at a bandwidth of 1 to 2 Gbps. While the single-channel speed is modest, the array allows aggregating hundreds of signals to achieve high total bandwidth, demonstrated at 100 to 200 Gbps, with scaling capability up to 800 Gbps total throughput across eight fibers in the active optical cable module.
Using micro-LEDs as a light source instead of traditional semiconductor lasers offers key advantages in manufacturing cost, reliability, and temperature coefficient. Unlike lasers, these micro-LEDs do not require external light sources and can be embedded directly. However, physical scaling faces constraints from thermal dissipation and electromagnetic signal coupling, requiring careful spatial layout within the module form factor.
This optical engine is designed for co-packaged optics, near-packaged optics, and direct CPU or AI accelerator integration. The setup utilizes standard optical fiber, but requires a specialized, customized fiber attachment technique to couple the fiber array to the micro-LEDs and photodetectors. The design path focuses on scaling SerDes speeds and total bandwidth for future production readiness.
