In this interview, Awanish Mishra from TE Connectivity unpacks what “connectivity hardware” really means in modern IoT and edge compute: the RF antenna, the interconnect, and the cable assembly all have to behave like one engineered system, from the radio front end to the enclosure. https://www.te.com/en/products/antennas.html
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A good antenna is a three-way trade: small physical volume, clean impedance match to the transceiver (S11/VSWR), and enough realized gain to hit link-budget targets. He points to practical optimization levers like matching networks, aperture and ground-plane tuning, and placement effects (detuning, shadowing), plus coexistence concerns when many radios share the same product footprint, here.
You get a tour of TE’s antenna range across Wi-Fi, Bluetooth, GNSS, cellular 4G/5G and UWB, including internal, external, and board-mount options, and how TE uses pre-qualified antenna designs (including the Linx Technologies antenna portfolio) with radio chipsets/modules to make OEM RF integration more predictable. Examples mentioned include work around Nordic ecosystems and cellular module partners like Sequans, plus programs aimed at satellite and LEO connectivity, and the conversation was filmed at Embedded World North America 2025, today.
The booth demo then shifts to high-speed PCB connectivity for industrial computers and AI-centric SoCs: board-to-board mezzanine, flexible stacking, I/O card connectors, and rugged cable assemblies that carry both data and power. TE highlights STRADA Mesa mezzanine stacking connectors and STRADA Whisper backplane connectors designed around 112G PAM4 signal-integrity needs, plus industrial RJ45 MagJack connectors with integrated magnetics, reflow-compatible assembly, and PoE/PoE+/PoE++ support (IEEE 802.3at and 802.3bt) for single-cable power plus Ethernet in industrial gear at the edge.
A smart-meter reference board ties the story together as a “BOM snapshot”: SoM/carrier connectors, SIM interfaces, USB, and both internal and external antenna paths, showing how many interconnect choices sit behind one deployed radio node. TE is based in Harrisburg, Pennsylvania, ships multi-billion components into devices worldwide, and runs engineering and manufacturing globally (including teams in Switzerland), with the key message being co-design: keep RF performance stable, manage EMI/EMC and interference, and shorten time-to-market through validation, reference designs, and field-application support close to customer now.
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