Diamond Systems presents its latest generation of rugged managed Ethernet switch modules as building blocks for embedded networks in vehicles, aircraft, drones and satellites. The new 200 Gbit-capable architecture combines 2.5G and 10G ports on a compact module that can be used standalone or on custom carrier boards, scaling toward 64 ports with VLAN, QoS and Layer 2/3 capabilities for deterministic traffic in harsh conditions worldwide. https://www.diamondsystems.com/products/ethernetsw
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The interview shows how OEMs can either adopt Diamond’s off-the-shelf carrier boards or design their own, using detailed design guides that expose all interfaces and layout constraints. Microchip switch silicon is paired with MaxLinear 2.5G PHYs to deliver dense 12+2 port configurations, while plug-in daughterboards add further 10G uplinks and push system throughput into the high hundreds of gigabits per second. The same modular concept powers a compact low-end switch with eight 1G and two 2.5G ports that is already flying in next-generation in-flight entertainment systems with high-resolution seat-back video per passenger.
Recorded at Embedded World North America 2025 in Anaheim, the discussion then moves to the EPS “Epsilon” family, including the EPS-9600 with time-sensitive networking (TSN). By synchronising all nodes in the network to within nanoseconds and implementing IEEE 802.1 TSN profiles, these platforms can guarantee that frames are emitted at precise times, keeping aircraft rows in lockstep or aligning audio and video in concert halls and industrial control. GPS-disciplined clocks and TSN-aware PHYs extend deterministic behaviour across the Ethernet fabric.
Beyond networking, Diamond outlines its NVIDIA Jetson-based embedded computing platforms, including Osbourne carrier boards and JetBox systems built around Jetson Orin NX and AGX Orin. These designs combine multi-gigabit Ethernet including 10GbE, rich camera I/O via CSI or GMSL, and ruggedisation features such as latching I/O connectors, heat spreaders and wide-temperature operation to support AI-at-the-edge workloads in UAVs, ground vehicles, satellites and other constrained form factors. COM Express and Jetson modules allow CPU and GPU upgrades without redesigning the entire board, extending product lifecycles over time.
The final part of the video zooms out to Diamond Systems’ trajectory from PC/104 I/O boards to today’s MIL-grade power supplies and sealed systems, positioning its catalogue as a library of reusable building blocks. Standard product variants and custom form factors reuse validated switch and SBC designs, shortening design cycles while leveraging global manufacturing and test infrastructure. In a landscape of edge AI, high-bandwidth sensing and TSN-based control networks, the company frames its rugged Ethernet and Jetson platforms as a practical foundation for long-life embedded deployments in the field.
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