Octavo Systems, a leader in System-in-Package (SiP) technology, presented its latest high-density integration solutions at Embedded World 2025 in Nuremberg. Their SiP approach integrates microprocessors, DDR memory, power management, and passive components into a compact BGA package, simplifying PCB design while enhancing performance. By eliminating complex DDR routing and power sequencing, Octavo enables engineers to focus on application innovation. Their products span industries from real-time audio processing to robotics and industrial automation. https://octavosystems.com
One standout demo featured Chaos Audio’s digital multi-effects pedal, leveraging Octavo’s SiP for real-time, ultra-low-latency audio processing. The pedal replaces traditional analog effect chains with a software-driven system, controlled via Bluetooth. Octavo’s integration allowed Chaos Audio to focus on DSP algorithms rather than complex hardware, solving long-standing latency issues in digital audio processing.
Olive Robotics showcased a modular robotics kit powered by Octavo’s OSD32MP1, built around the STMicroelectronics STM32MP1 microprocessor. Running the Robot Operating System (ROS) on Linux, the kit distributes processing across multiple compute nodes, optimizing AI-driven motion tracking. Octavo’s SiP enabled Olive Robotics to cut development time from 18 months to three, drastically accelerating time-to-market.
Octavo introduced the OSD62, integrating the Texas Instruments AM62 quad-core ARM Cortex-A53 with 2GB DDR4 into a single SiP. The result is a 70% PCB space reduction, enabling four-layer designs without complex routing. Similarly, the OSDZU3, based on the AMD (formerly Xilinx) Zynq UltraScale+ MPSoC, consolidates 15 power rails into a single 5V input, simplifying FPGA-based system design. Both SiPs reduce cost and complexity while enabling high-performance computing.
Their commitment to accessibility extends to open-source hardware designs, providing full schematics and PCB layouts. Engineers can integrate SiP technology without dealing with DDR complexity or power sequencing. Octavo’s solutions support everything from rapid prototyping to full-scale production, optimizing thermal performance through advanced die stacking and substrate-level heat dissipation.
One demo highlighted an STMicroelectronics-based SiP running Linux on a zero-layer PCB setup, demonstrating how Octavo’s SiP solutions enable ultra-compact embedded systems with minimal external components. Another featured the integration of Octavo’s SiP in an industrial torque wrench, tracking torque application for manufacturing quality control via IoT connectivity.
Octavo’s roots in Texas Instruments are evident in its leadership, including co-founder Gene Frantz, a pioneer in DSP development. His vision for SiP democratization has positioned Octavo as a key enabler of compact, high-performance embedded computing, making previously impractical form factors achievable.
Their SiP solutions transform embedded design, from AI-driven robotics to real-time audio and industrial automation. Octavo’s presence at Embedded World 2025 underscored the growing demand for compact, high-performance, rapidly deployable systems, further cementing SiP as a crucial technology for next-generation computing.
Check out all my Embedded World 2025 videos in this playlist: https://www.youtube.com/playlist?list=PL7xXqJFxvYvjgUpdNMBkGzEWU6YVxR8Ga
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