Discover Seco’s extensive product portfolio from high-tech edge computing to payment systems at embedded world 2023. Also find out how CLEA, their innovative IoT-AI Platform, will also drive business forward. Impressive application demos gives an insight into the power of CLEA. An absolute highlight at their booth: an exclusive foretaste of an innovative new HMI generation.
Some of their product highlights:
– COM Express Module CALLISTO: equipped with Intel Core processors of the 13 generation
– COM Express Module EUPHORIA: powered by Intel® Atom® x6000E series, Intel® Pentium® and Celeron® N and J series processors for high performance in demanding environments
– SMARC Module FINLAY: fitted with Intel® Atom processors of the x7000E series, Intel Core i3 processors and Intel processors of the N series (codename: Alder Lake-N)
– 3.5“ SBC SAYLOR: SBC equipped with Rockchip RK3568 for compact applications in AIoT
This booth tour was recorded as part of my Embedded World 2023 Day 1 Livestream here: https://youtu.be/xrjt_uePrY8?t=2190
