Category: Internet of Things

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$300 Sunchip All-in-one AR on RK3288 (like Hololens), $7 Wi-Fi power plug

Posted by Charbax – April 20, 2018

Sunchip shows some of their latest products including their all-in-one AR system based on Rockchip RK3288, RK3399 board for digital signage. $58 Amlogic S912 TV box, $26 RK3126 HDMI Stick, $200 Apollo Lake Box. 360 panoramic camera. $7 single Smart Wi-Fi Plug, $11 for dual Wi-Fi plug.

Actions S900 in Cubiedboard9 dev board, ATB1103/ATB1109 ARM Cortex-M0

Posted by Charbax – April 20, 2018

Actions S900 is a Quad-core ARM Cortex-A53, the Actions S500 is a Quad-core Cortex-A9. Actions also shows some other products for video smart speaker, smart door bell, smart kids robots, Actions also provides their MIPS based chipset for Bluetooth speakers, here also they are launching their new ATB1103/ATB1109 ARM Cortex-M0 system for their upcoming Bluetooth and perhaps also low cost smart speakers platform.

Allwinner R18, R16, R6 for Amazon Alexa and other smart speaker systems, B288 for E Ink e-reader

Posted by Charbax – April 19, 2018

Allwinner Smart Home solutions including their chipsets and development kit for the R18 which I also filmed here the $26 (169rmb) Allwinner R16 powered Xiao' ai Classmate Smart Speaker Mini by Xiaomi to be delivered in over 5 million units quantity, smart speakers by DIngDong. The Allwinner R6 enables even lower priced smart speakers with a maximum of 2 microphone in the microphone array for devices that will be closer to the user. The Allwinner B288 enables E Ink e-reader supported by DongDong which is China's leading online book store. The Allwinner MR100 powers the fully open source drone project by Kudrone. The Xiaomi Drone uses the Allwinner R16 too. The Allwinner FC1600 powers the Niutingting Early Learning Machine by Benew which reads stories for kids for 2-6 years old. Allwinner T3 for car dashboard and smart mirror, T8 for in-car entertainment. The Xiaomi Robot Vaccum Cleaner uses the Allwinner R16 and uses lasers to calculate distance to walls and navigate to vaccum and mop the floor.

Keynote: Mark Hambleton: The Fog at Linaro Connect Hong Kong 2018

Posted by Charbax – March 20, 2018

HKG18-200K1 – Keynote: Mark Hambleton: The Fog

Today’s world of devices connected to clouds looks set to evolve with more intelligence and processing being pushed to the edge or migrating between the cloud and the edge. The very definition of edge is evolving too. In this presentation we will look at some potential futures made possible by the emergence of the fog and its implications for the segments that it embraces.

Mark Hambleton / ARM
Approaching 20 years of experience in embedded systems ranging from real time control of wind tunnels in his early career to a more recently on mobile devices. Mark has been working with the Linux kernel for approaching 15 years, initially creating networking products focussing on traffic classification and shaping for core and edge routers to more recently on mobile devices. Working as a Chief Architect for at Symbian (and Nokia), Mark established himself within the ARM community, he then joined Broadcom in 2012 to refocus on Linux on ARM working on their leading edge mobile SOCs and then on to ARM in 2014.

http://connect.linaro.org/resource/hkg18/hkg18-200k1/

Learn More at http://connect.linaro.org

wolfSSL Embedded SSL/TLS Library, wolfCrypt STM32F7 hardware crypto performance

Posted by Charbax – March 13, 2018

wolfSSL is a commercial grade TLS library available in open-source GPL form on GitHub (http://github.com/wolfSSL/wolfssl) written in C and designed for Embedded use because its modular design. They provide build-time options for enabling and disabling all algorithms and TLS features. They support progressive algorithms such as Ed25519/Curve25519, ChaCha20/Poly1035 and SHA-3 using TLS 1.2/TLS 1.3. The part used for the demo is an STM32F777ZI. They are going to add support for ARMv8-M TrustZone-M hardware security when chipsets become available in the near future.

ST booth tour: STM32WB, STM32C2C, ST25DVW, startups, students at Embedded World 2018

Posted by Charbax – March 10, 2018

ST Microelectronics Booth Tour at Embedded World 2018 featuring their major new product announcements (STM32WB, STM32C2C and ST25DVW), featuring ST partners in the ST fanzone with Photon with ToF (Time-of-flight), Conrad robotics, Style spinner, universities and research organisations that ST collaborates with: the CEA-leti for self-flying drones (360 sensor fusion), INSA from Toulouse France for some gameboy projects to teach students about system integration, software defined instrumentation with the CTU university from Prague.

STM32WB is a dual-core MCU with wireless support based on an Arm Cortex‐M4 core running at 64 MHz (application processor) and an Arm Cortex‐M0+ core at 32 MHz (network processor). With two totally independent cores, this innovative architecture is optimized for real‑time execution (radio‑related software processing), resource use flexibility, power management, and a low BOM cost, to bring better user experience. The STM32WB platform is an evolution of the well‐known market-leading STM32L4 ultra‑low‑power series of MCUs. It provides the same digital and analog peripherals suitable for applications requiring extended battery life and complex functionalities. STM32WB proposes a variety of communication assets, a practical crystal-less USB2.0 FS interface, audio support, an LCD driver, up to 72 GPIOs, an integrated SMPS for power consumption optimization, and multiple low-power modes to maximize battery life. On top of wireless and ultra‐low‐power aspects, a particular focus was placed on embedding security hardware functions such as a 256‐bit AES, PCROP, JTAG Fuse, PKA (elliptic curve encryption engine), and Root Secure Services (RSS). The RSS allows authenticating OTA communications, regardless of the radio stack or application.

The STM32WB55 Bluetooth 5 -certified device offers Mesh 1.0 software support, multiple profiles and flexibility to integrate proprietary BLE stacks.

ST25DV-W series of dynamic NFC/RFID tags offers a 13.56 MHz long-range interface compatible with NFC phones and readers. Based on an ISO/IEC 15693 and NFC Forum Type 5 tag, ST25DV tag ICs can be operated from an RFID reader or an NFC phone. They also include an I²C interface that lets them connect to a host (MCU, MPU, etc.). These tags feature an innovative fast transfer mode between an embedded host and an NFC phone or reader thanks to their half-duplex 256-byte buffer. ST25DV dynamic NFC/RFID tags can be used in a wide variety of applications including consumer electronics, industrial, metering, electronic shelf labels, IoT objects and more.

STM32C2C P-L496G-CELL01 STM32 discovery pack for 2G/3G cellular to cloud (STM32-C2C/2G-3G) is a turnkey development platform for cellular and cloud technology based solutions. The pack is composed of an STM32L496AGI6-based low-power discovery mother board with preloaded firmware, and an STMod+ cellular expansion board with antenna. The P-L496G-CELL02 discovery pack for LTE IoT cellular to cloud (STM32-C2C/LTE IoT) is a turnkey development platform for cellular and cloud technology based solutions. The pack is composed of an STM32L496AGI6-based low-power discovery mother board with preloaded firmware, and an STMod+ cellular expansion board with antenna.

Zephyr Project with Linaro, Open Source Foundries, Nordic, Intel, Bluetooth Mesh demos

Posted by Charbax – March 8, 2018

The Zephyr Project is a scalable real-time operating system (RTOS) supporting multiple hardware architectures with more than 82 development boards supported already, with additional hardware support being added regularly, optimized for resource constrained devices, and built with security in mind. The Zephyr Project wants to be the open source "Linux of Embedded". Zephyr Project members include Linaro and the Open Source Foundries, Intel, NXP, Synopsys, Nordic Semiconductor, DeviceTone, runtime.io, Texas Instruments, Oticon and more. This video features functional prototype devices using the Zephyr kernel, including a functional Bluetooth Mesh network, a low energy Bluetooth controller, and an OpenThread demo. Other demos include the World’s first Bluetooth 5.0 qualified, open source low energy Bluetooth Controller that features open source code from Application to Radio, a BlueZ Bluetooth Host stack, a Zephyr kernel, low energy link layer, OS Host Controller Interface, the Nordic Semiconductor nRF52, and the Arm Cortex M4F + Bluetooth 5 and Radio SoC. This demo will take a closer look at the different layers that make up a full BLE protocol stack helps explain this capability. Bluetooth Mesh in action on BBC micro:bit boards available since Zephyr OS v1.9 showcases the many-to-many BLE communication, how every node can be a relay and the user interface. A functional Bluetooth Mesh Network with Lightweight Machine to Machine Device Management showcases the Cloud Device Management System using Linux-based IoT gateways and Zephyr-based IoT devices for real-world project prototypes and smart objects. A demonstration of OpenThread integration, benefits from the Zephyr infrastructure and how it works with Nordic nRF52840 and OpenThread 6loWPAN Thread Stack. The flow of IP traffic is handled seamlessly by both the Zephyr native IP stack and OpenThread: 802.15.4 traffic received by radio driver is forwarded to the OpenThread stack, where it is processed by the 802.15.4 MAC, 6loWPAN and IPv6 layers implemented in OpenThread.

Arm RTX5 RTOS for safety-critical systems development on ARM Cortex-M

Posted by Charbax – March 8, 2018

Reinhard Keil, Senior Director Embedded Tools, Arm talks about the Arm Keil MDK which is a complete development environment and supports over 5000 microcontrollers. At Embedded World, Arm introduced the TrustZone-M firmware project for security and a runtime software system for safety applications that accelerates software development for Cortex-M press release The certification enables the use of the runtime system in projects that run on Arm Cortex-M0, Cortex-M0+, Cortex-M3, Cortex-M4 and Cortex-M7, and target certification according to ISO 26262 and IEC 61508 up to ASIL D and SIL 3, respectively. Certification for Cortex-M23 and Cortex-M33 is planned for 2019.

TechNexion Android Things dev kits, modules, embedded systems at the Embedded World 2018

Posted by Charbax – March 7, 2018

TechNexion shows off its Android Things development kits, modules, embedded systems and more new products at the Embedded World 2018. The TechNexion product lineup has grown once again in size. The company is showcasing Android Things development kits based on PICO-PI-IMX7 Low-cost system on modules that are modular, scalable and versatile. The Android Things development boards are based on the NXP i.MX7 applications processor. TechNexion is also launching several wireless communication modules, including PIXI-41Z and the PIXI-9377 low-cost, certified, 1x1 802.11 AC/BT4.1 module that deliver high transmission rates, low latency and improved range.

TechNexion is a provider of embedded systems and system-on-modules, in 2017, TechNexion was chosen by Google as a partner to develop the reference design for its Android Things development kit. That kit based on the PICO-PI-IMX7 board has been the go-to development kit distributed at developer shows and used for demoing the potential of Android Things.

The New TechNexion PIXI series is a communication module that delivers all IoT multi-mode communication needs in one ultra-compact and secure module series. It is specifically designed to enable better transmission rates, lower latency, better range and higher resistance to interference when two or more communication protocols – for example, Wi-Fi, Bluetooth or Thread - are needed to run concurrently on one system-on-chip. Multiple communication protocols in one chip means users can collect more data from disparate communication protocols, while also having the flexibility to use the right protocol to suit the type of data and distance from your hub.

Panel PCs – TechNexion has three human-machine-interface (HMI) panel computing series: TC, TEP and TWP. The TEP Series is available with either ARM or x86 architecture and has an IP65 anodized aluminum enclosure and a flux mounted projective capacitive touch, high brightness LCD display - ranging from 5 to 15.6 inches. The TWP Series is a fully waterproof, IP69K, panel PC designed to withstand extreme temperatures, high vibration, and cleaning with a jet spray. It is also available with either ARM or x86 architecture – ranging from 10 to 15.6 inches. The TEP-1560-IMX6 is their 15” panel computer based on i.MX6 and the TWP-1560-IMX6 is their NEW model that is waterproof, stainless steel, panel computer.

Fanless Box PCs - The TEK Series fanless computing systems are enclosed in a compact, fully ruggedized enclosure, and are perfect for controlling versatile end-equipment.

System-on-Modules – TechNexion continues to expand its SoM options through its two series, EDM and PICO. These series have an exhaustive range of options around size, processor capability and connector type enabling the creation of almost any kind of embedded device. They are designed to be scalable and come with fully open source software – Linux and Android - and schematics.

WandPi-8M community board – TechNexion were also showing the latest version of their community development board. It is based on NXP’s i.MX8M Quad application processor with ARM Cortex-A53 + M4 architecture to deliver 4K UltraHD with HDR video quality with pro audio fidelity. The WandPi-8M is available for pre-order and is expected to ship in Spring of this year.

Philips Smart Mirror with Smart Toothbrush, Smart Shaver, Skincare

Posted by Charbax – January 23, 2018

Philips shows their newest range of Bluetooth smart connected devices that are on the market connecting to their prototype Smart Mirror that helps guide the toothbrushing, shaving and skin care hydration level sensor, as well as a balance weight and blood pressure monitor.