Category: Development Boards

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Xilinx Ultra96, UltraScale+ FPGA 96Boards development board

Posted by Charbax – March 22, 2018

Ultra96 is an Arm-based, Xilinx Zynq UltraScale+ MPSoC development board based on the Linaro 96Boards specification. The 96Boards’ specifications are open and define a standard board layout for development platforms that can be used by software application, hardware device, kernel, and other system software developers. Ultra96 represents a unique position in the 96Boards community with a wide range of potential peripherals and acceleration engines in the programmable logic that is not available from other offerings.

Ultra96 boots from the provided Delkin 16 GB MicroSD card, pre-loaded with PetaLinux. Engineers have options of connecting to Ultra96 through a Webserver using integrated wireless access point capability or to use the provided PetaLinux desktop environment which can be viewed on the integrated Mini DisplayPort video output. Multiple application examples and on-board development options are provided as examples.

Ultra96 provides four user-controllable LEDs. Engineers may also interact with the board through the 96Boards-compatible low-speed and high-speed expansion connectors by adding peripheral accessories such as those included in Seeed Studio’s Grove Starter Kit for 96Boards.

Micron LPDDR4 memory provides 2 GB of RAM in a 512M x 32 configuration. Wireless options include 802.11b/g/n Wi-Fi and Bluetooth 4.2 (provides both Bluetooth Classic and Low Energy (BLE)). UARTs are accessible on a header as well as through the expansion connector. JTAG is available through a header (external USB-JTAG required). I2C is available through the expansion connector.

Ultra96 provides one upstream (device) and two downstream (host) USB 3.0 connections. A USB 2.0 downstream (host) interface is provided on the high speed expansion bus. Two Microchip USB3320 USB 2.0 ULPI Transceivers and one Microchip USB5744 4-Port SS/HS USB Controller Hub are specified.

The integrated power supply generates all on-board voltages from an external 12V supply (available as an accessory).

Cadence HiFi DSP SDK for Android

Posted by Charbax – March 22, 2018

Raj Pawate, Niranjan Yadla and Sachin Ghanekar presented a low cost SDK for Cadence HiFi 3 DSP. This Hikey960 development board enables software developers to leverage the power of the HiFi 3 DSP and introduce new algorithms for audio and speech processing. With HiFi 3 DSP running at 533 MHz and access to a large shared system memory of 13MB, software developers are no longer constrained to showcase their advanced algorithms. In addition, the HiFi 3 DSP works closely with an App processor hosting Android allowing software developers to integrate DSP functionality within the context of Android Applications.

Open AI Lab interview with Mingfei Huang and 96Boards.ai Yang Zhang

Posted by Charbax – March 20, 2018

OPEN AI Lab aims to promote the industry development of Arm embedded smart machines, build an embedded SoC basic computing framework for smart machine application scenarios, and integrate application scenario service interfaces. Committed to promoting the in-depth collaboration of the entire industry chain of chips, hardware, and algorithm software, artificial intelligence will be available where there is computation. You can also watch Mingfei Huang's keynote about Open AI Lab here.

Toradex at the Qt booth at Embedded World 2018

Posted by Charbax – March 19, 2018

Toradex and The Qt Company highlight their long-standing partnership. Risto Avila from The Qt Company provides an overview of interesting demos using Toradex such as the fast boot demo which boots in 1.2 seconds based on the Apalis iMX6Q SoM and Qt 5.7 with support for 3D GPU with OpenGL ES 3.0; the fact that the Toradex SoM won Qt’s battle of the boards; Qt’s readymade images for Toradex, and much more. Toradex Partner Atechnology emphasizes Toradex’s focus on its partner network.

Toradex also showcased its demo showcasing its new Apalis iMX8 SoM running Qt 3D Studio - the SoM based on NXP’s i.MX 8QuadMax processor. The Apalis iMX8QM offers one click OS installation via the Toradex Easy Installer and offers dual Arm Cortex-A72, quad Arm Cortex-A53, and dual Arm Cortex-M4. The Apalis iMX8QM also contains on-board dual-band 802.11ac 2x2 MU-MIMO Wi-Fi and is Bluetooth 5 ready. This SoM offers advanced hardware security and safety features, and is ideal for signal processing, computer vision and HMI applications. You can sign up for early access for the Apalis iMX8QM here.

HiKey970 development board for AI

Posted by Charbax – March 19, 2018

HiSilicon and Hoperun introduces their new HiKey 970 development board, 10nm HiSilicon Kirin 970 based (same chipset that is in the recent Huawei Mate 10) quad ARM Cortex-A73 at 2.36GHz with quad ARM Cortex-A53 at 1.8GHz with Mali-G72MP12 and their new Dedicated Neural-network Processing Unit (NPU) with 256MAC/cycle @ 960MHz performance. To be available next month for $299 on Amazon and at http://hihope.org this is their Super Edge AI Computing Platform with Huawei HiAI SDK that can provide up to 25X Performance and 50X better Power Efficiency compared with doing the AI tasks by CPU or GPU. This enables the Heterogeneous multi processing Resource Management for use in applications such as Deep Learning, Robots, Automobile, Smart City. The NPU provides frequently used artificial intelligence function APIs, model management APIs and basic operator computing APIs, so developers can focus on developing new AI applications instead of focusing on performance tuning. The HiKey970’s dedicated AI processor has a rich set of imaging and I/Os that enables developers to build highly integrated flexible products for AI-based intelligent cameras in smart cities.

Features include:
UEFI + ARM Trusted Firmware
Kernel 4.9
CAN driver
CSI/CSI-2 driver
WiFi enable
Video Codec enable
PCIe enable for storage and LTE connect

4 lanes CSI + 2 lanes CSI
CAN V2.0B up to 1Mbps
Video Dec up to H.265 3840x2160@60fps
6GB 1866MHz, 4 Channel LPDDR4x
GPS, GLONASS, and BeiDou

OS Choices
Ubuntu
Debian
Android Master

Stacks
Huawei HiAI
Android NN
OpenGL ES
OpenCL

wolfSSL Embedded SSL/TLS Library, wolfCrypt STM32F7 hardware crypto performance

Posted by Charbax – March 13, 2018

wolfSSL is a commercial grade TLS library available in open-source GPL form on GitHub (http://github.com/wolfSSL/wolfssl) written in C and designed for Embedded use because its modular design. They provide build-time options for enabling and disabling all algorithms and TLS features. They support progressive algorithms such as Ed25519/Curve25519, ChaCha20/Poly1035 and SHA-3 using TLS 1.2/TLS 1.3. The part used for the demo is an STM32F777ZI. They are going to add support for ARMv8-M TrustZone-M hardware security when chipsets become available in the near future.

ST booth tour: STM32WB, STM32C2C, ST25DVW, startups, students at Embedded World 2018

Posted by Charbax – March 10, 2018

ST Microelectronics Booth Tour at Embedded World 2018 featuring their major new product announcements (STM32WB, STM32C2C and ST25DVW), featuring ST partners in the ST fanzone with Photon with ToF (Time-of-flight), Conrad robotics, Style spinner, universities and research organisations that ST collaborates with: the CEA-leti for self-flying drones (360 sensor fusion), INSA from Toulouse France for some gameboy projects to teach students about system integration, software defined instrumentation with the CTU university from Prague.

STM32WB is a dual-core MCU with wireless support based on an Arm Cortex‐M4 core running at 64 MHz (application processor) and an Arm Cortex‐M0+ core at 32 MHz (network processor). With two totally independent cores, this innovative architecture is optimized for real‑time execution (radio‑related software processing), resource use flexibility, power management, and a low BOM cost, to bring better user experience. The STM32WB platform is an evolution of the well‐known market-leading STM32L4 ultra‑low‑power series of MCUs. It provides the same digital and analog peripherals suitable for applications requiring extended battery life and complex functionalities. STM32WB proposes a variety of communication assets, a practical crystal-less USB2.0 FS interface, audio support, an LCD driver, up to 72 GPIOs, an integrated SMPS for power consumption optimization, and multiple low-power modes to maximize battery life. On top of wireless and ultra‐low‐power aspects, a particular focus was placed on embedding security hardware functions such as a 256‐bit AES, PCROP, JTAG Fuse, PKA (elliptic curve encryption engine), and Root Secure Services (RSS). The RSS allows authenticating OTA communications, regardless of the radio stack or application.

The STM32WB55 Bluetooth 5 -certified device offers Mesh 1.0 software support, multiple profiles and flexibility to integrate proprietary BLE stacks.

ST25DV-W series of dynamic NFC/RFID tags offers a 13.56 MHz long-range interface compatible with NFC phones and readers. Based on an ISO/IEC 15693 and NFC Forum Type 5 tag, ST25DV tag ICs can be operated from an RFID reader or an NFC phone. They also include an I²C interface that lets them connect to a host (MCU, MPU, etc.). These tags feature an innovative fast transfer mode between an embedded host and an NFC phone or reader thanks to their half-duplex 256-byte buffer. ST25DV dynamic NFC/RFID tags can be used in a wide variety of applications including consumer electronics, industrial, metering, electronic shelf labels, IoT objects and more.

STM32C2C P-L496G-CELL01 STM32 discovery pack for 2G/3G cellular to cloud (STM32-C2C/2G-3G) is a turnkey development platform for cellular and cloud technology based solutions. The pack is composed of an STM32L496AGI6-based low-power discovery mother board with preloaded firmware, and an STMod+ cellular expansion board with antenna. The P-L496G-CELL02 discovery pack for LTE IoT cellular to cloud (STM32-C2C/LTE IoT) is a turnkey development platform for cellular and cloud technology based solutions. The pack is composed of an STM32L496AGI6-based low-power discovery mother board with preloaded firmware, and an STMod+ cellular expansion board with antenna.

TechNexion Android Things dev kits, modules, embedded systems at the Embedded World 2018

Posted by Charbax – March 7, 2018

TechNexion shows off its Android Things development kits, modules, embedded systems and more new products at the Embedded World 2018. The TechNexion product lineup has grown once again in size. The company is showcasing Android Things development kits based on PICO-PI-IMX7 Low-cost system on modules that are modular, scalable and versatile. The Android Things development boards are based on the NXP i.MX7 applications processor. TechNexion is also launching several wireless communication modules, including PIXI-41Z and the PIXI-9377 low-cost, certified, 1x1 802.11 AC/BT4.1 module that deliver high transmission rates, low latency and improved range.

TechNexion is a provider of embedded systems and system-on-modules, in 2017, TechNexion was chosen by Google as a partner to develop the reference design for its Android Things development kit. That kit based on the PICO-PI-IMX7 board has been the go-to development kit distributed at developer shows and used for demoing the potential of Android Things.

The New TechNexion PIXI series is a communication module that delivers all IoT multi-mode communication needs in one ultra-compact and secure module series. It is specifically designed to enable better transmission rates, lower latency, better range and higher resistance to interference when two or more communication protocols – for example, Wi-Fi, Bluetooth or Thread - are needed to run concurrently on one system-on-chip. Multiple communication protocols in one chip means users can collect more data from disparate communication protocols, while also having the flexibility to use the right protocol to suit the type of data and distance from your hub.

Panel PCs – TechNexion has three human-machine-interface (HMI) panel computing series: TC, TEP and TWP. The TEP Series is available with either ARM or x86 architecture and has an IP65 anodized aluminum enclosure and a flux mounted projective capacitive touch, high brightness LCD display - ranging from 5 to 15.6 inches. The TWP Series is a fully waterproof, IP69K, panel PC designed to withstand extreme temperatures, high vibration, and cleaning with a jet spray. It is also available with either ARM or x86 architecture – ranging from 10 to 15.6 inches. The TEP-1560-IMX6 is their 15” panel computer based on i.MX6 and the TWP-1560-IMX6 is their NEW model that is waterproof, stainless steel, panel computer.

Fanless Box PCs - The TEK Series fanless computing systems are enclosed in a compact, fully ruggedized enclosure, and are perfect for controlling versatile end-equipment.

System-on-Modules – TechNexion continues to expand its SoM options through its two series, EDM and PICO. These series have an exhaustive range of options around size, processor capability and connector type enabling the creation of almost any kind of embedded device. They are designed to be scalable and come with fully open source software – Linux and Android - and schematics.

WandPi-8M community board – TechNexion were also showing the latest version of their community development board. It is based on NXP’s i.MX8M Quad application processor with ARM Cortex-A53 + M4 architecture to deliver 4K UltraHD with HDR video quality with pro audio fidelity. The WandPi-8M is available for pre-order and is expected to ship in Spring of this year.

Diamond Systems Zeta SBC, Ethernet switch solutions, Sabre enclosures at Embedded World 2018

Posted by Charbax – March 7, 2018

Diamond Systems founder Jonathan Miller shows the company’s newest products at Embedded World 2018 including the COM-based Zeta SBC, EPSM-10GX (used to connect to a carrier board) and EPS-24G2X Ethernet switch solutions. As Miller explains, the EPS-24G2X brings out all the signals including those for the two 10G SFI ports. There is a lot of Ethernet available via this solution. It’s all about communication, sharing information and so some people want more ports. The switches discussed are examples of those found in unmanned vehicles as well as many other rugged applications. Included in these new products is the EPS-12GMini, one of the world’s smallest 12-port Ethernet switches is a two-board design enabling its small form factor for on-board vehicle use (military and industrial).

The rugged enclosure called SABRE is the newest of Diamond Systems’ enclosures, this rugged box provides protection in the harshest environments and enables complete solutions for their customers. The one on display, Sabre, at this show is for the COM Express Mini form factor and it accommodates the 12-port switch. On the front is a set of three military connectors. Next is a an Industrial MIDI enclosure with a variety of I/O brought out to the front which accommodates an Eagle SBC which uses Toradex Apalis ARM modules and Diamond Eagle carrier board that goes inside along with a variety of I/O (serial ports, CAN ports, connectors, display, analog). Diamond has an ongoing relationship with partner Toradex who I also filmed at EW2018 here

More boards on display in their booth includes the Analog I/O modules: DMM-16-AT along with DMM-16RP-AT which is bus agnostic. Eaglet, a more compact version of the earlier noted Eagle SBC. The discussion turns to PC/104 where Miller notes the longevity of the product and long value it has had as a form factor. A little later, PCIe MiniCards are shown and discussed as used: I/O; CAN module, Analog I/O module; Ethernet and digital I/O.

Pandora box with connectors on the board for connecting directly into the box. Plug in and go. Typically used on a controller.

Products shown on the right half of the booth are proven designs that they have had on the market now already for a while. A large part of the sales are based on these designs and are custom in some fashion depending on customer's request.

Next for Diamond are more small things, COM Express, small form factors and more. You can read more about their solutions at http://diamondsystems.com

Toradex Apalis iMX8QM, NXP i.MX 8QM, and more demos at EW2018

Posted by Charbax – March 7, 2018

Toradex booth tour at Embedded World 2018 featuring their new Toradex Apalis iMX8 QM System on Module (SoM) based on the NXP’s i.MX 8QuadMax processor. Toradex’s demos featuring the Apalis iMX8QM includes one with Qt 3D Studio. The Apalis iMX8QM offers one click OS installation via the Toradex Easy Installer and offers 2x Arm Cortex-A72 cores, 4x Cortex-A53 cores, and 2x Cortex-M4 cores. The Apalis iMX8QM also contains on-board dual-band 802.11ac 2x2 MU-MIMO Wi-Fi and is Bluetooth 5 ready. This SoM offers advanced hardware security and safety features, and is ideal for signal processing, computer vision and HMI applications. Interested third parties can sign up for early access for the Apalis iMX8QM here

In addition, Toradex is also showing their soon to be available Toradex Colibri iMX8X SoM, based on NXP’s i.MX 8X processor. With 2-4x Arm Cortex-A35 cores and 1x Cortex-M4 core, the SoM is ideal for industrial automation, HMI, robotics, building applications and healthcare. The Colibri iMX8X also contains on-board dual-band 802.11ac 2x2 MU-MIMO Wi-Fi and is Bluetooth 5 ready.

Toradex also showcases some of their other demos such as a Deep Learning demo featuring its Toradex Apalis TK1 SoM in collaboration with its partner Vertex.AI, the demo highlights Vertex.AI’s Vision deep learning and object detection software, and is a complete end-to-end deep learning demo, showcasing pasta detection. Additionally, Toradex has a demo in collaboration with its partner, Roboception, which integrates Toradex’s Apalis TK1 SoM for high-performance onboard processing, the demo has onboard SLAM for indoor and outdoor navigation, accurate visual-intertial motion estimation, and standard interfaces for an intuitive WEB-GUI.

Toradex also has a range of demos highlighting its Toradex partner ecosystem. From CODESYS’ real-time SoftPLC with EtherCAT, Crank’s low- and high-end UI, DiSTI’s safety focused HMI, Green Hills’ INTEGRITY RTOS on Colibri iMX6, Antmicro’s Android on Vision Kit, Acontis’ optimized EtherCAT, TES’ 3D Surround View/Guiliani, Mender.io’s over-the-air updates, Christmann’s Apalis computer cluster, Gumstix’s voice control carrier board, MVTec’s HPeek and more.

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