Category: NXP

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Bero shows AOSP TV 8.1, Gemini PDA, Android with newer kernels at Linaro LMG/LHG hacking room

Posted by Charbax – March 24, 2018

Bero (Bernhard Rosenkränzer) and his colleagues from the Linaro Mobile Group (Android) and the Linaro Home Group (TV Boxes) are working in the hacking room at Linaro Connect to prepare some demos for Demo Friday including AOSP TV on 8.1 (while most Android TV runs on 7.1), updating the Linux kernel on Android phones to some newer kernel version, and Bero also gives his opinions on the multi-Linux booting Gemini PDA amazing keyboard phone which he has purchased (see my video on Gemini PDA Linux support here)

Toradex at the Qt booth at Embedded World 2018

Posted by Charbax – March 19, 2018

Toradex and The Qt Company highlight their long-standing partnership. Risto Avila from The Qt Company provides an overview of interesting demos using Toradex such as the fast boot demo which boots in 1.2 seconds based on the Apalis iMX6Q SoM and Qt 5.7 with support for 3D GPU with OpenGL ES 3.0; the fact that the Toradex SoM won Qt’s battle of the boards; Qt’s readymade images for Toradex, and much more. Toradex Partner Atechnology emphasizes Toradex’s focus on its partner network.

Toradex also showcased its demo showcasing its new Apalis iMX8 SoM running Qt 3D Studio - the SoM based on NXP’s i.MX 8QuadMax processor. The Apalis iMX8QM offers one click OS installation via the Toradex Easy Installer and offers dual Arm Cortex-A72, quad Arm Cortex-A53, and dual Arm Cortex-M4. The Apalis iMX8QM also contains on-board dual-band 802.11ac 2x2 MU-MIMO Wi-Fi and is Bluetooth 5 ready. This SoM offers advanced hardware security and safety features, and is ideal for signal processing, computer vision and HMI applications. You can sign up for early access for the Apalis iMX8QM here.

E Ink booth tour at CES 2018

Posted by Charbax – March 15, 2018

E Ink shows and talks about its latest innovations in consumer electronics, architecture, healthcare, retail and fashion at CES 2018, to bring dynamic elements to generally static environments such as architecture and design, as well as discuss how its ePaper technology is being integrated into smart cities and connected devices, famous for eReaders, also revolutionizing the digital signage, healthcare and retail industries as well. Bus signs, electronic shelf labels, medical devices, products featured include the E Ink DAZZLE wall, the world’s largest media façade on the San Diego International Airport parking garage, featuring 2,100 tiles of E Ink’s Prism technology. A dress designed by Bergmeyer featuring E Ink Prism which won Best in Show at IIDA Fashion Show in October, 2017. A reconfigurable Retail Price Tag, a thin, batteryless price tag containing Powercast’s power harvesting technology that enables quick price changes using a typical handheld UHF RFID reader for wirelessly updating the display, the LTS Smart Patch transdermal therapeutic system that delivers medication to patients in a convenient and controlled manner, ReMarkable E Ink tablet offering paper-like reading, pen input writing and sketching, Onyx Boox Note, Onyx Boox Max2 (which I filmed here), Sony Digital Paper and more.

NXP i.MX8M now available, i.MX 8M Mini announced on 14nm

Posted by Charbax – March 13, 2018

NXP launches the i.MX 8M Quad-core ARM Cortex-A53 with ARM Cortex-M4 for audio (pro audio fidelity with more than 20 audio channels each @384KHz and DSD512 audio), voice and video (4K with HDR (Dolby Vision, HDR10, and HLG)), fully supported on NXP’s 10 and 15-year Longevity Program. At Embedded World 2018, NXP partnered with 8 development board providers who all launched their boards with i.MX8M support.

NXP also announced their new i.MX 8M Mini, their first embedded multi-core heterogeneous applications processors built using advanced 14LPC FinFET process technology. The i.MX 8M Mini family of processors features up to four Arm Cortex-A53 cores running at up to 2GHz and an ARM Cortex-M4 based real-time processing domain at 400+MHz.

Zephyr Project with Linaro, Open Source Foundries, Nordic, Intel, Bluetooth Mesh demos

Posted by Charbax – March 8, 2018

The Zephyr Project is a scalable real-time operating system (RTOS) supporting multiple hardware architectures with more than 82 development boards supported already, with additional hardware support being added regularly, optimized for resource constrained devices, and built with security in mind. The Zephyr Project wants to be the open source "Linux of Embedded". Zephyr Project members include Linaro and the Open Source Foundries, Intel, NXP, Synopsys, Nordic Semiconductor, DeviceTone, runtime.io, Texas Instruments, Oticon and more. This video features functional prototype devices using the Zephyr kernel, including a functional Bluetooth Mesh network, a low energy Bluetooth controller, and an OpenThread demo. Other demos include the World’s first Bluetooth 5.0 qualified, open source low energy Bluetooth Controller that features open source code from Application to Radio, a BlueZ Bluetooth Host stack, a Zephyr kernel, low energy link layer, OS Host Controller Interface, the Nordic Semiconductor nRF52, and the Arm Cortex M4F + Bluetooth 5 and Radio SoC. This demo will take a closer look at the different layers that make up a full BLE protocol stack helps explain this capability. Bluetooth Mesh in action on BBC micro:bit boards available since Zephyr OS v1.9 showcases the many-to-many BLE communication, how every node can be a relay and the user interface. A functional Bluetooth Mesh Network with Lightweight Machine to Machine Device Management showcases the Cloud Device Management System using Linux-based IoT gateways and Zephyr-based IoT devices for real-world project prototypes and smart objects. A demonstration of OpenThread integration, benefits from the Zephyr infrastructure and how it works with Nordic nRF52840 and OpenThread 6loWPAN Thread Stack. The flow of IP traffic is handled seamlessly by both the Zephyr native IP stack and OpenThread: 802.15.4 traffic received by radio driver is forwarded to the OpenThread stack, where it is processed by the 802.15.4 MAC, 6loWPAN and IPv6 layers implemented in OpenThread.

TechNexion Android Things dev kits, modules, embedded systems at the Embedded World 2018

Posted by Charbax – March 7, 2018

TechNexion shows off its Android Things development kits, modules, embedded systems and more new products at the Embedded World 2018. The TechNexion product lineup has grown once again in size. The company is showcasing Android Things development kits based on PICO-PI-IMX7 Low-cost system on modules that are modular, scalable and versatile. The Android Things development boards are based on the NXP i.MX7 applications processor. TechNexion is also launching several wireless communication modules, including PIXI-41Z and the PIXI-9377 low-cost, certified, 1x1 802.11 AC/BT4.1 module that deliver high transmission rates, low latency and improved range.

TechNexion is a provider of embedded systems and system-on-modules, in 2017, TechNexion was chosen by Google as a partner to develop the reference design for its Android Things development kit. That kit based on the PICO-PI-IMX7 board has been the go-to development kit distributed at developer shows and used for demoing the potential of Android Things.

The New TechNexion PIXI series is a communication module that delivers all IoT multi-mode communication needs in one ultra-compact and secure module series. It is specifically designed to enable better transmission rates, lower latency, better range and higher resistance to interference when two or more communication protocols – for example, Wi-Fi, Bluetooth or Thread - are needed to run concurrently on one system-on-chip. Multiple communication protocols in one chip means users can collect more data from disparate communication protocols, while also having the flexibility to use the right protocol to suit the type of data and distance from your hub.

Panel PCs – TechNexion has three human-machine-interface (HMI) panel computing series: TC, TEP and TWP. The TEP Series is available with either ARM or x86 architecture and has an IP65 anodized aluminum enclosure and a flux mounted projective capacitive touch, high brightness LCD display - ranging from 5 to 15.6 inches. The TWP Series is a fully waterproof, IP69K, panel PC designed to withstand extreme temperatures, high vibration, and cleaning with a jet spray. It is also available with either ARM or x86 architecture – ranging from 10 to 15.6 inches. The TEP-1560-IMX6 is their 15” panel computer based on i.MX6 and the TWP-1560-IMX6 is their NEW model that is waterproof, stainless steel, panel computer.

Fanless Box PCs - The TEK Series fanless computing systems are enclosed in a compact, fully ruggedized enclosure, and are perfect for controlling versatile end-equipment.

System-on-Modules – TechNexion continues to expand its SoM options through its two series, EDM and PICO. These series have an exhaustive range of options around size, processor capability and connector type enabling the creation of almost any kind of embedded device. They are designed to be scalable and come with fully open source software – Linux and Android - and schematics.

WandPi-8M community board – TechNexion were also showing the latest version of their community development board. It is based on NXP’s i.MX8M Quad application processor with ARM Cortex-A53 + M4 architecture to deliver 4K UltraHD with HDR video quality with pro audio fidelity. The WandPi-8M is available for pre-order and is expected to ship in Spring of this year.

Diamond Systems Zeta SBC, Ethernet switch solutions, Sabre enclosures at Embedded World 2018

Posted by Charbax – March 7, 2018

Diamond Systems founder Jonathan Miller shows the company’s newest products at Embedded World 2018 including the COM-based Zeta SBC, EPSM-10GX (used to connect to a carrier board) and EPS-24G2X Ethernet switch solutions. As Miller explains, the EPS-24G2X brings out all the signals including those for the two 10G SFI ports. There is a lot of Ethernet available via this solution. It’s all about communication, sharing information and so some people want more ports. The switches discussed are examples of those found in unmanned vehicles as well as many other rugged applications. Included in these new products is the EPS-12GMini, one of the world’s smallest 12-port Ethernet switches is a two-board design enabling its small form factor for on-board vehicle use (military and industrial).

The rugged enclosure called SABRE is the newest of Diamond Systems’ enclosures, this rugged box provides protection in the harshest environments and enables complete solutions for their customers. The one on display, Sabre, at this show is for the COM Express Mini form factor and it accommodates the 12-port switch. On the front is a set of three military connectors. Next is a an Industrial MIDI enclosure with a variety of I/O brought out to the front which accommodates an Eagle SBC which uses Toradex Apalis ARM modules and Diamond Eagle carrier board that goes inside along with a variety of I/O (serial ports, CAN ports, connectors, display, analog). Diamond has an ongoing relationship with partner Toradex who I also filmed at EW2018 here

More boards on display in their booth includes the Analog I/O modules: DMM-16-AT along with DMM-16RP-AT which is bus agnostic. Eaglet, a more compact version of the earlier noted Eagle SBC. The discussion turns to PC/104 where Miller notes the longevity of the product and long value it has had as a form factor. A little later, PCIe MiniCards are shown and discussed as used: I/O; CAN module, Analog I/O module; Ethernet and digital I/O.

Pandora box with connectors on the board for connecting directly into the box. Plug in and go. Typically used on a controller.

Products shown on the right half of the booth are proven designs that they have had on the market now already for a while. A large part of the sales are based on these designs and are custom in some fashion depending on customer's request.

Next for Diamond are more small things, COM Express, small form factors and more. You can read more about their solutions at http://diamondsystems.com

Toradex Apalis iMX8QM, NXP i.MX 8QM, and more demos at EW2018

Posted by Charbax – March 7, 2018

Toradex booth tour at Embedded World 2018 featuring their new Toradex Apalis iMX8 QM System on Module (SoM) based on the NXP’s i.MX 8QuadMax processor. Toradex’s demos featuring the Apalis iMX8QM includes one with Qt 3D Studio. The Apalis iMX8QM offers one click OS installation via the Toradex Easy Installer and offers 2x Arm Cortex-A72 cores, 4x Cortex-A53 cores, and 2x Cortex-M4 cores. The Apalis iMX8QM also contains on-board dual-band 802.11ac 2x2 MU-MIMO Wi-Fi and is Bluetooth 5 ready. This SoM offers advanced hardware security and safety features, and is ideal for signal processing, computer vision and HMI applications. Interested third parties can sign up for early access for the Apalis iMX8QM here

In addition, Toradex is also showing their soon to be available Toradex Colibri iMX8X SoM, based on NXP’s i.MX 8X processor. With 2-4x Arm Cortex-A35 cores and 1x Cortex-M4 core, the SoM is ideal for industrial automation, HMI, robotics, building applications and healthcare. The Colibri iMX8X also contains on-board dual-band 802.11ac 2x2 MU-MIMO Wi-Fi and is Bluetooth 5 ready.

Toradex also showcases some of their other demos such as a Deep Learning demo featuring its Toradex Apalis TK1 SoM in collaboration with its partner Vertex.AI, the demo highlights Vertex.AI’s Vision deep learning and object detection software, and is a complete end-to-end deep learning demo, showcasing pasta detection. Additionally, Toradex has a demo in collaboration with its partner, Roboception, which integrates Toradex’s Apalis TK1 SoM for high-performance onboard processing, the demo has onboard SLAM for indoor and outdoor navigation, accurate visual-intertial motion estimation, and standard interfaces for an intuitive WEB-GUI.

Toradex also has a range of demos highlighting its Toradex partner ecosystem. From CODESYS’ real-time SoftPLC with EtherCAT, Crank’s low- and high-end UI, DiSTI’s safety focused HMI, Green Hills’ INTEGRITY RTOS on Colibri iMX6, Antmicro’s Android on Vision Kit, Acontis’ optimized EtherCAT, TES’ 3D Surround View/Guiliani, Mender.io’s over-the-air updates, Christmann’s Apalis computer cluster, Gumstix’s voice control carrier board, MVTec’s HPeek and more.

To stay up-to-date with news from Toradex, you can sign up to their newsletter here.

Latest from the Linaro Digital Home Group at Linaro Connect San Francisco 2017

Posted by Charbax – October 3, 2017

Mark Gregotski, DIrector of the Linaro Digital Home Group, provides an update on the latest work in open source for the Digital Home Group that LHG is working on including the adoption of OP-TEE (Open Portable Trusted Execution Environment) with DRM integrations including PlayReady DRM PK v3.3 on AOSP 8.0 on the HiKey960 development board and Widevine for Linux and for Android AOSP. NXP demonstrates some of their work, NXP has recently joined the Linaro Digital Home Group. The LHG group has worked to integrate V4L2 with gstreamer and ffmpeg to improve media playback on ARM offloading all the computation onto the video codec hardware of the SoC.

Purism Librem Debian phone, fully open source, Librem 11, 13, 15 Laptops

Posted by Charbax – September 29, 2017

Purism Phone is crowdfunding at https://puri.sm/shop/librem-5/ ($847'454 raised thus far) runs PureOS based on Debian Free/Libre and Open Source software and a GNU+Linux Operating System, it can run most GNU+Linux distributions, it's runs many other upstream projects, it's world’s first ever IP-native mobile handset with end-to-end decentralized communications via Matrix, with a 5″ display, Security focused by design, Privacy protection by default, works with 2G/3G/4G, GSM, UMTS, and LTE networks with an i.MX8 or i.MX6 CPU separate from Baseband with open-source GPU drivers, Hardware Kill Switches for Camera, Microphone, WiFi/Bluetooth, and Baseband. Purism also has a track record of delivering fully open source Intel powered laptops the Librem 11 2-in-1, the Librem 13 and the Librem 15.