TechNexion shows off their new products at Computex 2018: pre-certified IoT modules, Android Things development kits, IP69K embedded systems and more. The booth tour starts with Android Things development kit PICO-PI-IMX7 live demo, based on NXP i.MX7 Dual applications processor and ARM Cortex-A7 architecture has been the go-to development kit since the official Android Things launch at Google I/O in May. The company also demonstrates PICO-IMX8M SoM based on NXP i.MX8M processor and Cortex-A53 + M4 architectures that delivers a whooping 4K UltraHD video performance with HDR and pro audio fidelity for multimedia applications. TechNexion is also launching CE, ETSI, FCC, IC, RCM and TELEC pre-certified IoT wireless communication modules and development kits: PIXI-9377 based on Qualcomm QCA9377, PIXI-6174 based on Qualcomm QCA6174 that deliver high transmission rates, low latency and improved range in noisy industrial environments. The company is showcasing a fully waterproof TWP-1010-IMX6 HMI based on NXP i.MX6 ARM Cortex-A9 processor that was specially designed to withstand extreme environments and cleaning with a jet spray. TWP series likewise includes models based on Intel Braswell architecture. TEK5-APL box PC based on Intel Atom x5-E3930, x5-E3940, x7-E3950 and Apollo Lake architecture, enclosed in a fully ruggedized enclosure for use in a vehicle.