HiSilicon and Hoperun introduces their new HiKey 970 development board, 10nm HiSilicon Kirin 970 based (same chipset that is in the recent Huawei Mate 10) quad ARM Cortex-A73 at 2.36GHz with quad ARM Cortex-A53 at 1.8GHz with Mali-G72MP12 and their new Dedicated Neural-network Processing Unit (NPU) with 256MAC/cycle @ 960MHz performance. To be available next month for $299 on Amazon and at http://hihope.org this is their Super Edge AI Computing Platform with Huawei HiAI SDK that can provide up to 25X Performance and 50X better Power Efficiency compared with doing the AI tasks by CPU or GPU. This enables the Heterogeneous multi processing Resource Management for use in applications such as Deep Learning, Robots, Automobile, Smart City. The NPU provides frequently used artificial intelligence function APIs, model management APIs and basic operator computing APIs, so developers can focus on developing new AI applications instead of focusing on performance tuning. The HiKey970’s dedicated AI processor has a rich set of imaging and I/Os that enables developers to build highly integrated flexible products for AI-based intelligent cameras in smart cities.
Features include:
UEFI + ARM Trusted Firmware
Kernel 4.9
CAN driver
CSI/CSI-2 driver
WiFi enable
Video Codec enable
PCIe enable for storage and LTE connect
4 lanes CSI + 2 lanes CSI
CAN V2.0B up to 1Mbps
Video Dec up to H.265 3840×2160@60fps
6GB 1866MHz, 4 Channel LPDDR4x
GPS, GLONASS, and BeiDou
E Ink shows and talks about its latest innovations in consumer electronics, architecture, healthcare, retail and fashion at CES 2018, to bring dynamic elements to generally static environments such as architecture and design, as well as discuss how its ePaper technology is being integrated into smart cities and connected devices, famous for eReaders, also revolutionizing the digital signage, healthcare and retail industries as well. Bus signs, electronic shelf labels, medical devices, products featured include the E Ink DAZZLE wall, the world’s largest media façade on the San Diego International Airport parking garage, featuring 2,100 tiles of E Ink’s Prism technology. A dress designed by Bergmeyer featuring E Ink Prism which won Best in Show at IIDA Fashion Show in October, 2017. A reconfigurable Retail Price Tag, a thin, batteryless price tag containing Powercast’s power harvesting technology that enables quick price changes using a typical handheld UHF RFID reader for wirelessly updating the display, the LTS Smart Patch transdermal therapeutic system that delivers medication to patients in a convenient and controlled manner, ReMarkable E Ink tablet offering paper-like reading, pen input writing and sketching, Onyx Boox Note, Onyx Boox Max2 (which I filmed here), Sony Digital Paper and more.
The Zephyr Project is a scalable real-time operating system (RTOS) supporting multiple hardware architectures with more than 82 development boards supported already, with additional hardware support being added regularly, optimized for resource constrained devices, and built with security in mind. The Zephyr Project wants to be the open source “Linux of Embedded”. Zephyr Project members include Linaro and the Open Source Foundries, Intel, NXP, Synopsys, Nordic Semiconductor, DeviceTone, runtime.io, Texas Instruments, Oticon and more. This video features functional prototype devices using the Zephyr kernel, including a functional Bluetooth Mesh network, a low energy Bluetooth controller, and an OpenThread demo. Other demos include the World’s first Bluetooth 5.0 qualified, open source low energy Bluetooth Controller that features open source code from Application to Radio, a BlueZ Bluetooth Host stack, a Zephyr kernel, low energy link layer, OS Host Controller Interface, the Nordic Semiconductor nRF52, and the Arm Cortex M4F + Bluetooth 5 and Radio SoC. This demo will take a closer look at the different layers that make up a full BLE protocol stack helps explain this capability. Bluetooth Mesh in action on BBC micro:bit boards available since Zephyr OS v1.9 showcases the many-to-many BLE communication, how every node can be a relay and the user interface. A functional Bluetooth Mesh Network with Lightweight Machine to Machine Device Management showcases the Cloud Device Management System using Linux-based IoT gateways and Zephyr-based IoT devices for real-world project prototypes and smart objects. A demonstration of OpenThread integration, benefits from the Zephyr infrastructure and how it works with Nordic nRF52840 and OpenThread 6loWPAN Thread Stack. The flow of IP traffic is handled seamlessly by both the Zephyr native IP stack and OpenThread: 802.15.4 traffic received by radio driver is forwarded to the OpenThread stack, where it is processed by the 802.15.4 MAC, 6loWPAN and IPv6 layers implemented in OpenThread.
Reinhard Keil, Senior Director Embedded Tools, Arm talks about the Arm Keil MDK which is a complete development environment and supports over 5000 microcontrollers. At Embedded World, Arm introduced the TrustZone-M firmware project for security and a runtime software system for safety applications that accelerates software development for Cortex-M press release The certification enables the use of the runtime system in projects that run on Arm Cortex-M0, Cortex-M0+, Cortex-M3, Cortex-M4 and Cortex-M7, and target certification according to ISO 26262 and IEC 61508 up to ASIL D and SIL 3, respectively. Certification for Cortex-M23 and Cortex-M33 is planned for 2019.
Jack Ogawa, Senior Director of Marketing, MCU at Cypress Semiconductor talks PSoC 6 and arm PSA at Embedded World 2018, PSoC 6 MCUs now support the highest level of security as defined by the Arm Platform Security Architecture (PSA). In the interview, Jack discusses the three levels of hardware-based isolation for securing connecting devices. Cypress also gave a cool demo illustrating how a LoRaWAN edge node can be secured with a PSoC 6 MCU.
PSoC 6 is purpose built for the Internet of Things, enabling easy integration of sensing, processing, connectivity and security functions all in a low-power MCU. Integrating secure element functionality with on-chip hardware accelerated cryptography, PSoC 6 MCUs enable designers to easily implement security in a single chip without needing an external secure element device. For more information you can check out the announcement here and here.
TechNexion shows off its Android Things development kits, modules, embedded systems and more new products at the Embedded World 2018. The TechNexion product lineup has grown once again in size. The company is showcasing Android Things development kits based on PICO-PI-IMX7 Low-cost system on modules that are modular, scalable and versatile. The Android Things development boards are based on the NXP i.MX7 applications processor. TechNexion is also launching several wireless communication modules, including PIXI-41Z and the PIXI-9377 low-cost, certified, 1×1 802.11 AC/BT4.1 module that deliver high transmission rates, low latency and improved range.
TechNexion is a provider of embedded systems and system-on-modules, in 2017, TechNexion was chosen by Google as a partner to develop the reference design for its Android Things development kit. That kit based on the PICO-PI-IMX7 board has been the go-to development kit distributed at developer shows and used for demoing the potential of Android Things.
The New TechNexion PIXI series is a communication module that delivers all IoT multi-mode communication needs in one ultra-compact and secure module series. It is specifically designed to enable better transmission rates, lower latency, better range and higher resistance to interference when two or more communication protocols – for example, Wi-Fi, Bluetooth or Thread – are needed to run concurrently on one system-on-chip. Multiple communication protocols in one chip means users can collect more data from disparate communication protocols, while also having the flexibility to use the right protocol to suit the type of data and distance from your hub.
Panel PCs – TechNexion has three human-machine-interface (HMI) panel computing series: TC, TEP and TWP. The TEP Series is available with either ARM or x86 architecture and has an IP65 anodized aluminum enclosure and a flux mounted projective capacitive touch, high brightness LCD display – ranging from 5 to 15.6 inches. The TWP Series is a fully waterproof, IP69K, panel PC designed to withstand extreme temperatures, high vibration, and cleaning with a jet spray. It is also available with either ARM or x86 architecture – ranging from 10 to 15.6 inches. The TEP-1560-IMX6 is their 15” panel computer based on i.MX6 and the TWP-1560-IMX6 is their NEW model that is waterproof, stainless steel, panel computer.
Fanless Box PCs – The TEK Series fanless computing systems are enclosed in a compact, fully ruggedized enclosure, and are perfect for controlling versatile end-equipment.
System-on-Modules – TechNexion continues to expand its SoM options through its two series, EDM and PICO. These series have an exhaustive range of options around size, processor capability and connector type enabling the creation of almost any kind of embedded device. They are designed to be scalable and come with fully open source software – Linux and Android – and schematics.
WandPi-8M community board – TechNexion were also showing the latest version of their community development board. It is based on NXP’s i.MX8M Quad application processor with ARM Cortex-A53 + M4 architecture to deliver 4K UltraHD with HDR video quality with pro audio fidelity. The WandPi-8M is available for pre-order and is expected to ship in Spring of this year.
Diamond Systems founder Jonathan Miller shows the company’s newest products at Embedded World 2018 including the COM-based Zeta SBC, EPSM-10GX (used to connect to a carrier board) and EPS-24G2X Ethernet switch solutions. As Miller explains, the EPS-24G2X brings out all the signals including those for the two 10G SFI ports. There is a lot of Ethernet available via this solution. It’s all about communication, sharing information and so some people want more ports. The switches discussed are examples of those found in unmanned vehicles as well as many other rugged applications. Included in these new products is the EPS-12GMini, one of the world’s smallest 12-port Ethernet switches is a two-board design enabling its small form factor for on-board vehicle use (military and industrial).
The rugged enclosure called SABRE is the newest of Diamond Systems’ enclosures, this rugged box provides protection in the harshest environments and enables complete solutions for their customers. The one on display, Sabre, at this show is for the COM Express Mini form factor and it accommodates the 12-port switch. On the front is a set of three military connectors. Next is a an Industrial MIDI enclosure with a variety of I/O brought out to the front which accommodates an Eagle SBC which uses Toradex Apalis ARM modules and Diamond Eagle carrier board that goes inside along with a variety of I/O (serial ports, CAN ports, connectors, display, analog). Diamond has an ongoing relationship with partner Toradex who I also filmed at EW2018 here
More boards on display in their booth includes the Analog I/O modules: DMM-16-AT along with DMM-16RP-AT which is bus agnostic. Eaglet, a more compact version of the earlier noted Eagle SBC. The discussion turns to PC/104 where Miller notes the longevity of the product and long value it has had as a form factor. A little later, PCIe MiniCards are shown and discussed as used: I/O; CAN module, Analog I/O module; Ethernet and digital I/O.
Pandora box with connectors on the board for connecting directly into the box. Plug in and go. Typically used on a controller.
Products shown on the right half of the booth are proven designs that they have had on the market now already for a while. A large part of the sales are based on these designs and are custom in some fashion depending on customer’s request.
Next for Diamond are more small things, COM Express, small form factors and more. You can read more about their solutions at http://diamondsystems.com
Toradex booth tour at Embedded World 2018 featuring their new Toradex Apalis iMX8 QM System on Module (SoM) based on the NXP’s i.MX 8QuadMax processor. Toradex’s demos featuring the Apalis iMX8QM includes one with Qt 3D Studio. The Apalis iMX8QM offers one click OS installation via the Toradex Easy Installer and offers 2x Arm Cortex-A72 cores, 4x Cortex-A53 cores, and 2x Cortex-M4 cores. The Apalis iMX8QM also contains on-board dual-band 802.11ac 2×2 MU-MIMO Wi-Fi and is Bluetooth 5 ready. This SoM offers advanced hardware security and safety features, and is ideal for signal processing, computer vision and HMI applications. Interested third parties can sign up for early access for the Apalis iMX8QM here
In addition, Toradex is also showing their soon to be available Toradex Colibri iMX8X SoM, based on NXP’s i.MX 8X processor. With 2-4x Arm Cortex-A35 cores and 1x Cortex-M4 core, the SoM is ideal for industrial automation, HMI, robotics, building applications and healthcare. The Colibri iMX8X also contains on-board dual-band 802.11ac 2×2 MU-MIMO Wi-Fi and is Bluetooth 5 ready.
Toradex also showcases some of their other demos such as a Deep Learning demo featuring its Toradex Apalis TK1 SoM in collaboration with its partner Vertex.AI, the demo highlights Vertex.AI’s Vision deep learning and object detection software, and is a complete end-to-end deep learning demo, showcasing pasta detection. Additionally, Toradex has a demo in collaboration with its partner, Roboception, which integrates Toradex’s Apalis TK1 SoM for high-performance onboard processing, the demo has onboard SLAM for indoor and outdoor navigation, accurate visual-intertial motion estimation, and standard interfaces for an intuitive WEB-GUI.
Toradex also has a range of demos highlighting its Toradex partner ecosystem. From CODESYS’ real-time SoftPLC with EtherCAT, Crank’s low- and high-end UI, DiSTI’s safety focused HMI, Green Hills’ INTEGRITY RTOS on Colibri iMX6, Antmicro’s Android on Vision Kit, Acontis’ optimized EtherCAT, TES’ 3D Surround View/Guiliani, Mender.io’s over-the-air updates, Christmann’s Apalis computer cluster, Gumstix’s voice control carrier board, MVTec’s HPeek and more.
The Arm Machine Learning processor provides up to 4.6 Trillions of Machine Learning Operations Per Second, as part of the Project Trillium, Arm’s Machine Learning (ML) platform, enables a new era of advanced, ultra-efficient inference at the edge with Programmable layer engines for future-proofing, Highly tuned for advanced geometry implementations, Specifically designed for ML and neural network (NN) capabilities, the architecture is versatile enough to scale to any device, from IoT to connected cars and servers.
Built from the ground up for optimal performance and efficiency, Project Trillium completes the Arm Heterogenous ML compute platform with the Arm ML processor, the second-generation Arm Object Detection (OD) processor and open-source Arm NN software.
The Arm Machine Learning processor consists of state-of-the-art optimized fixed-function engines that provide best-in-class performance within a constrained power envelope. Additional programmable layer engines support the execution of non-convolution layers, and the implementation of selected primitives and operators, along with future innovation and algorithm generation. The network control unit manages the overall execution and traversal of the network and the DMA moves data in and out of the main memory. Onboard memory allows central storage for weights and feature maps, thus reducing traffic to the external memory and therefore, power.
Google booth tour at the BETT education technology conference, showcasing some of the newest Chromebooks released for the education market, new security features to help schools prepare for the new General Data Protection Regulation (GDPR) of the EU (more information at Google Blog), collaborative tools for teachers and students, the Jamboard interactive whiteboard display device, Google Expeditions using Augmented Reality and VR. Chromebooks are the leading device for the K-12 education market in the USA and now also in Sweden, Canada and New Zealand with 25 million users worldwide. G Suite for Education is used by 80 million users worldwide.
At the 2017 IET Christmas Lecture, Hub Mentor and pioneering technology entrepreneur Sir Robin Saxby, founding CEO and Chairman of ARM Holdings (who I interviewed here) shares his advice for growing a start-up with limited resources into a global powerhouse. Under his leadership, ARM became the world’s leading semiconductor Intellectual Property (IP) company, and now connects over 5 billion people, powering everything from supercomputers to each Whatsapp message on your phone.
[You can auto-translate the english subtitles to any language from YouTube on a desktop, the video is also available with only external subtitles here]
He answers questions like:
How can a small start-up compete with far bigger competition?
How do you build the right team?
What is the most common mistake technical founders make?
Sir Robin continues to champion entrepreneurship in the UK, and is a committed supporter of the Royal Academy of Engineering’s Enterprise Hub (https://enterprisehub.raeng.org.uk/)
Participated in creating this video:
Jan Mary Baloyo, IET
Nilar Shyun Mya, IET PSB Academy On Campus
Syafiq Shahul, IET PSB Academy On Campus
Stanley Liau, IET Singapore LN
HDMI 2.1 Specification Supports a Range of Features for Enhanced Gaming:
– Variable Refresh Rate (VRR) reduces or eliminates lag, stutter and frame tearing for more fluid and better detailed gameplay.
– Quick Media Switching (QMS) for movies and video eliminates the delay that can result in blank screens before content is displayed.
– Quick Frame Transport (QFT) reduces latency for smoother no-lag gaming, and real-time interactive virtual reality.
– Auto Low Latency Mode (ALLM) allows the ideal latency setting to automatically be set allowing for smooth, lag-free and uninterrupted viewing and interactivity.
HDMI 2.1 Specification Supports Ultra High Speed Bandwidth Up to 48Gbps enabling Higher resolutions and faster refresh rates including 8K60Hz and 4K120Hz and support for resolutions up to 10K120 compressed. The Ultra High Speed HDMI Cable supports 48Gbit/s bandwidth for uncompressed HDMI 2.1 feature support and has very low emissions of Electromagnetic interference (EMI).
Dynamic HDR support ensures every moment of a video is displayed at its ideal values for depth, detail, brightness, contrast and wider color gamuts. Here this interview is with Technicolor about their implementation of Dynamic HDR supported as part of the new HDMI 2.1 Spec.
eARC in HDMI 2.1 simplifies connectivity and supports the most advanced audio formats such as object-based audio, such as Dolby Atmos and DTS:X, highest audio quality, and ensures compatibility between audio devices and upcoming HDMI 2.1 products, enabling to deliver those formats via an eARC-enabled HDMI port on a future HDMI 2.1 TV. eARC also provides support for the TV’s over-the-air tuner, streaming apps received by the TV, and audio from HDMI sources connected to the TV.
A key advantage of eARC is that it enables a TV-centric living room or home theater configuration that can provide a more seamless experience. Today, an AV receiver—or a similar repeater device—is necessary to extract high quality audio from an HDMI link, while the video is processed and passed through to the TV. The user may have to switch inputs on both the TV and an audio device to find the source of their content, and content sourced within the TV and from TV inputs is frequently limited to stereo or, in the best case, one of a very small number of compressed formats.
With eARC, it will be possible to connect all sources through the TV and send audio to the sound system completely uncompromised. Furthermore, eARC will make possible a new breed of audio-only receivers that will yield greater value and ease-of-use by eliminating a video subsystem. So, in theory anyway, overall video and audio performance will improve with eARC.
Chris Goodyer
Overview of Arm
• HPC engagements
Arm partner information
• Latest deployment information
Arm Software Ecosystem
• Software stack enabling
• Arm’s priorities on libraries and applications,
Filmed at the Arm HPC User Group at SC17 in Denver.
At CES 2018, Onyx is launching Boox Note, the nicest E Ink device yet, thin and light (320gr) 10.3″ 1872×1404 (227dpi) E Ink notepad e-reader to be shipping in February at $549 on Amazon (with a red limited edition for Valentine’s Day) and the Onyx Boox Max2 is a 13.3″ 2200×1650 (207dpi) E Ink notepad e-reader at 550gr in weight for sale now at $849 at Amazon.com (price to be $799) both run on a Quad-core ARM Processor, with Bluetooth, Wi-Fi, very long battery life with a 4100mAh battery in both. The HDMI input is available on Max2 to use the 13.3″ E Ink display as a Computer monitor. Both come with WACOM stylus note input with 2048 levels of touch input for annotations, note taking, idea scribbling, pdf document scribble overlays, with 11 ebook formats supported, eventually that can be used for collaboration and productivity. Both run Android and any Android apk that runs on Android 6 can be loaded and used on these devices which run with 2GB RAM and 32GB Flash storage with a MicroSD slot.
Geniatech shows their Tablet Dock for use with 96Boards compatible/sized development boards, where the board can just be swapped into the Tablet Dock to power it, including with touch support. To be distributed by Arrow at an affordable price.
Geniatech also provides a range of 96Board sized open source Qualcomm 410, 820 based development boards which you can see some of them featured in this video filmed at Embedded World 2017:
