Booth Tour with Qualcomm at Mobile World Congress 2023 in Barcelona, the world’s most influential connectivity industry event where leading companies and trailblazers share the latest thought leadership about the future of connectivity. They’re accelerating innovation and digital transformation in mobile computing, XR, automotive, wireless fiber, the modern network, and more. Discover how they enable the intelligently connected future. This was part of my MWC 2023 day 2 livestream here https://www.youtube.com/watch?v=uV5-rsvcRsM
Category: Chip provider
Qualcomm Booth Tour at MWC 2023 #mwc23
Planet Computers XR1 & XR2 Rockchip Arm Linux Desktops at MWC 2023 #mwc23
Live at Mobile World Congress 2023 in Barcelona, day 1 walking around the show floor with my Yolobox Pro Panasonic G9 and a second Sony camera. Please watch and comment live. We will try to stream live the whole day, we have power banks and multiple batteries charged. Check out the MWC 2023 website and floor maps at https://www.mwcbarcelona.com/maps and search in list of exhibitors here https://www.mwcbarcelona.com/exhibitors to see in real-time where we are streaming from and post in live chat which booths you’d like us to live stream from next! Please search MWC news on the web and post in live chat what’s new and awesome that we need to find and livestream interviews from. We will try to do this every day until March 2nd, thanks for watching!
Silicon Labs at Embedded World 2022 day3
via https://youtu.be/7GwELcFnt5o
Renesas Audio Codecs at Embedded World 2022 day2
via https://youtu.be/8M-B8aCKhps
Qualcomm at Embedded World 2022 day2
via https://youtu.be/8HqEW6pD4ZQ
Nordic Semiconductors at Embedded World 2022 (at 2h54m in my Livestream day1)
via https://youtu.be/FQocfRt1vI8
Texas Instruments at Embedded World 2022 (at 2h31m in my Livestream day1)
via https://youtu.be/Ub2FI0H5ugg
Coffee with Toradex CEO, COO and CMO
I had the pleasure of an impromptu chat with Toradex’s CEO (Samuel Imgrueth), COO (Stephan Dubach) and CMO (Daniel Lang) set against a gorgeous locale close to the Toradex headquarters in Switzerland. We talked about Toradex’s history, key focus and offerings and a lot more.
CES 2021: Kyocera DuraForce Ultra 5G UW, rugged, drop/water proof, Snapdragon 765G, push to talk
via https://youtu.be/fbpmWv_GJA4
TI Jacinto 7 new Advanced driver assistance systems processor DRA8 gateway TDA4 SoC ADAS platform
via https://youtu.be/Zr9hGfvbY8o
Nvidia Maxine Interview, AI video compression conferencing technology
via https://youtu.be/CRwqfSZaKOQ
ST Booth Tour at MWC
Virtual tour at ST Microelectronics MWC 2018 booth, checking out Smart Home demo using BlueCoin board and chats with Alexa and sees how motion and voice sensors can be used to automate your home. Also sees MEMS Micro-Actuators demonstrating ST’s PETRA technology which is tipped to revolutionize headphones. Other demos include a water proof pressure sensor, touch sensors that can be used even with gloves, an NFC smart tile (ST25DV at http://bit.ly/ST25DV ) which can tell you whether your goods have been shaken, Deep convolution neural networks demonstration talking about artifical intelligence on microcontrollers and used on sensors as part of the IoT, super accurate Teseo GNSS ADAS sensor that works on all satellite constellations and more.
40 degree diagonal $1299 Third-Eye X1 AR Smart Glasses with 13mp camera Qualcomm Snapdragon CPU.
Third-Eye X1 are augmented reality smart glasses made by Third-Eye Gen, an advanced tech manufacturer for the US Department of Defense based in New Jersey, USA. Third-Eye Remote Aid platform X1 AR smart Glasses Comes with. Resulotion:1280*720*RGB, Field of view: 40 degree diagonal. Virtual Image Size: 90’at 10 feet. Qualcomm Snapdragon CPU Andreno 530 GPU. 3Gb RAM 32 GB ROM +SD card and OS 7.0.HD camera 13mp. Battery :2400mah 8hours stand by time. Lens: swappable lens. https://www.thirdeyegen.com/product/x1-smart-glasses/
(text by flatslap5657 of Fiverr)
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Ittiam H265 Real Time Encoder
Ittiam Systems, a leading technology provider to the broadcast and media industry, announced the availability of its i265 H.265/HEVC Encoder for the new Intel Visual Compute Accelerator (Intel VCA) platform. The recently announced Intel Visual Compute Accelerator is a PCIe based media processing card with 3 Intel Xeon E3 series processors, designed to accelerate high-end media transcoding in a standard Intel Xeon E5 series processor based server. Intel VCA offers a lower total cost of ownership, lower power requirement and higher density compared to other solutions for Data Centers, Broadcasters and Distribution Networks. Ittiam’s multiprocessor implementation of its i265 H.265/HEVC Encoder for Intel VCA, an industry first, leverages the integrated Intel IrisTM Pro graphics capabilities and interconnects on the Intel VCA card to enable real time 4K60 broadcast quality encoding in 1RU servers. This also delivers significant performance scaling for offline high quality encoding and dense transcoding applications. Ittiam’s i265 H.265/HEVC Encoder for Intel VCA leverages Ittiam’s deep expertise in video algorithms and graphics acceleration. i265 for Intel VCA is available now as a codec SDK for system developers and will be available as part of Ittiam’s upcoming Media Engine transcoding system. About Ittiam Systems: Ittiam Systems is a global technology company with deep R&D driven solutions for media creation, management and consumption, ittiam provides advanced media codecs, software development platforms, systems and workflows for embedded and online applications. Its solutions are at the heart of tens of millions of lifestyle products that drive mobility, content access, networking and sharing.
NORDIC Bluetooth 5, IEEE 802.15.4 , Thread and Cellular IoT Ultra Low Power Wireless Solutions from SEMICONDUCTOR.
Nordic Semiconductor provides ultra-low power (ULP) wireless chips that can run for a long time from small power sources, like watch batteries. NORDIC the latest version of Bluetooth is Bluetooth5 by NORDIC .It represents the greatest advancements in the specification since Bluetooth 4.0 and the introduction of Bluetooth Low Energy. Errata High throughput, Long range, advertising extensions, increased broadcast capacity, improved co-existence. IEEE 802.15.4: is a standard for low data rate, low power networks. IEEE 802.15.4 defines the physical (PHY) and Medium Access Control (MAC) layers and forms the basis for numerous upper layer networking specifications including Thread, 6LowPAN, Zigbee and Wireless HART. IEEE 802.15.4 is supported by the Nordic nRF52840 multi-protocol SoC. Thread is a standards-based IPv6-based mesh networking protocol developed for simply and securely connecting products around the home to each other, to the internet and to the cloud. Cellular IoT (A low power LTE-M and NB-IoT solution for wide area network deployments). The LTE-M and NB-IoT standards are open standards created by 3GPP to allow wide deployment of IoT nodes while leveraging existing cellular infrastructure. The LTE protocols are designed for unparalleled scalability in number of nodes while maintaining good Quality of Service. Both technologies offer eDRX and PSM which are techniques for lowering the power consumption compared to traditional LTE. In eDRX, device and network agree exact times when the device will be ready to receive data.
(text by flatslap5657 of http://fiverr.com/s2/bb496d0ed0)
Gole11 Indiegogo Materials Update, to ship to early bird backers by end June, Manufacturing next
John gives an update from the Gole design house and factory building maker of the Gole11 now crowdfunding with now 100x $139 each 2-pack perks ($278 for 2pcs) available on Indiegogo at http://igg.me/at/gole11 if the campaign reaches the $100K goal by June 20th then all early bird backers (at $99, $119, $139 (2pcs) or $169) will get their Gole11 shipped to them before the end of June, and in July regular backers (those at $199) will be getting it.
$99 Gole11 on Indiegogo, 11.6″ FHD Touch, 4 COM Ports RS232/485, Intel Celeron N3450, Windows 10 Pro
Gole11 Mini PC now crowdfunding at http://igg.me/at/gole11 starting at $99 for the first 30 early birds, comes with an 11.6″ 1920×1080 capacitive touchscreen, runs Intel Celeron N3450 at 2.2Ghz, 4GB RAM, 64GB eMMC, comes with a full Windows 10 Pro.
Nordic Semiconductor nRF5340 dual Arm Cortex-M33 at Embedded World 2020, NB-IoT, LTE-M, BLE, Quuppa
Nordic Semiconductor’s Bjørn Kvaale shows the latest cellular IoT NB-IoT, LTE-M, GPS and BLE Bluetooth 5.1 Direction Finding, Zigbee and Thread solutions for development on the market today. Showing their Bluetooth Low Energy solutions including the newly launched nRF5340 SoC featuring dual Arm Cortex-M33 processors, truly secure, with two flexible processors, the advanced feature set, and an operating temperature up to 105 °C, makes it the ideal choice for professional lighting, advanced wearables, and other complex IoT applications The nRF5340 PDK is the preview development kit for the nRF5340 SoC, containing everything needed to get started with development, on a single board. The PDK supports development with an extensive range of wireless protocols. It supports Bluetooth Low Energy, including the Long Range and high-speed 2 Mbps features. Mesh protocols like Bluetooth mesh, Thread and Zigbee can be run concurrently with Bluetooth LE, enabling smart phones to provision, commission, configure and control mesh nodes. NFC, ANT, 802.15.4 and 2.4 GHz proprietary protocols are also supported. The PDK is bundled with an NFC antenna that quickly enables testing of nRF5340’s NFC-A tag peripheral. A SEGGER J-Link debugger is on the board, enabling full-blown programming and debugging, of both the nRF5340 SoC and external targets. All analog and digital interfaces, and GPIOs are available via headers and edge connectors. The kit is Arduino Uno Rev3 hardware compatible, meaning it can be easily interfaced with external device shields, including the Power Profiler Kit. Four buttons and four LEDs simplify input and output to and from the nRF5340 SoC, they are all user-programmable. An on-board external memory is connected to the 96 MHz QSPI peripheral in the nRF5340 SoC. The PDK is typically powered with USB, but can be powered by a wide range of sources, within the supply range of 1.7 to 5.0 V. In addition to USB, it can be powered with external source, but also includes a CR2032 battery holder and a Li-Po battery connector, for in-field testing. Current consumption can be measured by using the dedicated current measurement pins. The nRF Connect SDK is the software development kit for the nRF5340 SoC, and it has board support for the nRF5340 PDK.