Using Widcon, the latest and future Samsung ARM Processors and memory are stacked directly through TSV (Through Silicon Via) technology, this is the next step after Package-on-Package (PoP) designs where there is a circuit board between the processor and memory, thus data had to move through wires. In the new Widcon Processor and Memory package from Samsung, this means data can move through each ball and memory bandwidth becomes wider up to and beyond 17GB/s. This structure also brings better energy efficiency. Higher bandwidth allows application processor to perform maximum performance even at low clock speed. Moreover, superior thermal dissipation comes from TSV structure also enables the new Exynos 5 Octa processor and likely future Exynos6 to maximize the full potential performance of the processor at a lower power consumption. You can also see my previous video with Samsung talking about Widcon Wide IO memory technology here: http://138.2.152.197/2013/11/21/samsung-wide-io-memory-interface-for-the-faster-and-lower-power-arm-processors-of-the-future/
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