Tektronix focuses here on one of the harder measurement problems in modern power electronics: capturing fast, high-voltage switching behavior without corrupting the waveform through probe loading, ground noise, or isolation limits. The interview centers on the second-generation IsoVu isolated voltage probe, where optical power delivery over glass fiber lets the probe head stay electrically isolated while still measuring very small and very fast events. That matters for SiC and GaN power stages, where dv/dt, common-mode noise, and switching transients quickly expose the limits of conventional probing. https://www.tektronix.com/
A key point in the demo is flexibility at the probe tip. The discussion mentions interchangeable tips spanning low-voltage work up to kilovolt-class measurements, which fits the broader need to move between gate-drive, shunt, switch-node, and bus measurements without rebuilding the whole setup. Tektronix also highlights its isolated current probing, including an RF link architecture with no direct physical connection inside the probe path, aimed at very high common-mode rejection. In practice, this is the kind of tooling engineers need for double-pulse test setups, power integrity analysis, wide-bandgap converter design, and validation of fast-switching inverter stages. ([tektronix.com][1])
What makes the video interesting is that it is less about headline specs and more about measurement credibility. The screen demo compares a reference voltage with current captured through the isolated current probe, showing how Tektronix is positioning these probes as part of a complete power integrity workflow rather than as standalone accessories. That fits a broader shift in lab instrumentation, where probe architecture, tip ecosystem, connection standards, and noise rejection are becoming just as important as oscilloscope bandwidth. The clip was filmed at Embedded World 2026 in Nuremberg, where this kind of test and measurement detail is especially relevant for embedded power, automotive, industrial control, and energy conversion teams.
The booth tour also briefly points to Tektronix’s wider high-speed instrumentation stack, including the 7 Series DPO at up to 25 GHz and 125 GS/s, plus the DPO70000SX platform, which Tektronix lists up to 70 GHz and 200 GS/s for very high-speed serial, PCIe, memory, and signal-integrity work. So the story here is really two layers of debug: precision isolated probing for power devices such as SiC and GaN MOSFETs, and high-bandwidth scope platforms for the digital and interconnect side of the same system.
