nVent is positioning its liquid cooling portfolio as core infrastructure for AI and high-performance data centers, starting with the new Project Deschutes 5.0 coolant distribution unit based on Google’s open OCP specification. The unit is a 2 MW, 500 gpm, high-pressure liquid-to-liquid CDU with N+1 sealless pumps, low-harmonic VFD drives and 3°C approach temperature, engineered to support Google’s seventh-generation TPU “Ironwood” and other high-density chips at scale while staying within tight thermal envelopes and electrical constraints. https://www.nvent.com/en-us/data-solutions/liquid-cooling
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In the video, Matt Archbald walks through how this Deschutes CDU is tuned to Google’s operating point: single-phase water-based secondary loops, up to 65–80 psi design pressure, and about 60 kW of electrical input to move roughly 2 MW of heat away from the racks. Ultra-low harmonic drives allow the CDU to share the same power rails as the IT load, avoiding extra electrical infrastructure. N+1 filtration with individually isolatable filters means maintenance can be done live, without shutting down the CDU or impacting TPU clusters and other liquid-cooled nodes. Variable-speed pumps make it possible to support lower-pressure environments and non-Google chips simply by shifting along the pump PQ curve.
nVent also shows the CX121, a “for the masses” row-based CDU platform in the 1.5–1.75 MW range with three pumps and true N+1 redundancy at a 4°C approach. The CX121’s power architecture is configurable as single, dual, three-feed or four-feed, enabling architectures such as “4 feeds makes 3” for Nvidia and AMD racks and reducing the need for extra CDUs as pure failover. Liquid quality monitoring, leak detection and telemetry are built in, while pump modules bundle pump, filter and drive into a hot-swappable 750 lb cartridge that can be changed by a single technician in under half an hour, keeping service windows short in large AI data halls.
Around the booth, the discussion zooms out to full-stack infrastructure. nVent demonstrates smart power distribution units with polling and streaming telemetry, enabling power analytics, threshold-based smart alerting and automated load shedding when temperatures or currents approach critical limits. On the thermal side, the portfolio spans in-rack CDUs for Nvidia MGX, GB200 and GB300 configurations, OCP OV3 and enterprise racks, rear-door heat exchangers for capturing residual air-side heat, and a liquid-to-air sidecar that uses the data hall’s airstream when facility water is not available. Overhead, the modular Technology Cooling System (TCS) network uses pre-defined manifold lengths, flexible interconnects and seismic bracing so coolant distribution to each rack remains resilient and easy to commission.
Filmed at Supercomputing 2025 (SC25) in St. Louis, the conversation also touches on lifecycle management and environmental impact. nVent emphasizes closed-loop secondary circuits that avoid evaporative losses, glycol-based formulations tuned to approach the thermal performance of water, and a partnership with Valvoline for global fluid supply, monitoring and end-of-life recycling. By standardizing around open specifications like Google’s Project Deschutes 5.0 and combining CDUs, manifolds, sidecars and rear doors with services and telemetry, nVent presents a coherent path to megawatt-class racks, 500 W+ chips and hybrid air/liquid deployments without requiring a complete data center rebuild.
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