Thermal design is becoming a first-order limiter for thin clients, rugged edge boxes, and AI racks, and Frore Systems frames AirJet and LiquidJet as two complementary ways to raise sustained power without reverting to bulky fans or oversized heat sinks. The tour connects solid-state active airflow at the device level with direct-to-chip liquid cooling at the rack level, focusing on steady-state thermal envelope instead of brief boost behavior. https://www.froresystems.com/products/airjet-r-mini-g2
Later in the video, filmed at CES Las Vegas 2026, AirJet Mini G2 is presented as a sealed, solid-state active cooling module roughly 2.65 mm thick that targets about 7.5 W of heat removal while consuming about 1 W. Gen 2 is described as a ~50% heat-removal step over the first AirJet Mini, and the discussion keeps coming back to why that matters in shipping hardware: acoustic limits, dust-tolerant airflow paths, and multi-year reliability testing.
On client compute, the theme is turning passively cooled form factors into sustained-TDP systems. A Qualcomm reference mini PC built around Snapdragon X2 Elite uses three AirJet Mini G2 units to support about a 25 W thermal envelope in a sub-10 mm chassis, and similar integration patterns are shown for ultra-thin notebooks and tablet-class devices. The engineering win is not a single peak score, but fewer throttle cliffs during long exports, compilation, and on-device AI inference.
Where rugged packaging matters, Frore shows how high static pressure can keep airflow viable through filters. A class-1 5G hotspot example pushes roughly 31 dBm transmit power and pairs it with Wi-Fi 7, yet stays pocket-size by using AirJet modules behind IP53-grade filtered vents; the company cites back pressure around 1750 Pa to move air even when the intake and exhaust are constrained. The same idea is applied to compact SSD enclosures aimed at sustained read/write bandwidth, and to industrial cameras where vibration from a fan would blur imaging.
In the cloud segment, LiquidJet is positioned as a direct-to-chip coldplate built with 3D short-loop jet-channel microstructures, manufactured using semiconductor-style steps like lithography and bonding on metal wafers. By designing the internal jet geometry from an ASIC power map, more coolant can be directed at hotspot regions, with Frore citing support for very high local heat flux up to about 600 W/cm². The claimed upside is headroom to run accelerators cooler for efficiency, or to trade temperature margin for higher clocks, improving tokens per watt and overall data-center PUE at scale.
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