Frore Systems is showing an AirJet PAK module aimed at rugged edge-AI boxes built around NVIDIA Jetson Orin NX “Super” class designs, where sustained 40W operation usually pushes passive heatsinks into bulky, heavy metal. The idea is to replace a large passive thermal mass with a compact solid-state active cooler that keeps the same compute envelope, but targets around an 80% reduction in volume and weight for the thermal hardware. https://www.froresystems.com/products/airjet-r-pak
At the core is AirJet Mini G2, a thin solid-state air-moving “chip” designed for high backpressure airflow in sealed enclosures (useful when you need to pull air through tight ducts and filters). In this demo the AirJet PAK 5C G2 integrates five Mini G2 devices plus a control board into a self-contained heatsink module; a heat spreader couples the SoC to the PAK, and a simple 4-pin interface handles power/ground and operating level control for closed-loop thermal management.
What’s interesting here is the system-level trade: keeping “fanless-like” industrial attributes (silent operation, fewer moving parts, long service life) while avoiding the passive-only penalty in mass, z-height, and enclosure size. That matters for robots and humanoids where every gram affects payload, stability, battery sizing, and joint torque, and where thermal throttling directly cuts TOPS/W under sustained inference loads. The video itself was filmed at CES Las Vegas 2026.
Reliability is a big part of the pitch: the PAK can be paired with dustproof, water-resistant filtration so the device behaves more like a sealed industrial node than a laptop-style ventilated box. If your target is “deploy and forget” edge compute for 5–10 years, this kind of high-backpressure solid-state airflow plus filtration is a practical path to sustained 40W AI at the edge without oversizing the enclosure for passive heat soak.
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