Frore Systems walks through a Qualcomm reference desktop built around Snapdragon X2 Elite, showing how three AirJet solid-state cooling modules can fit inside a mini PC that’s roughly 10 mm thin while staying very quiet. The point isn’t the industrial design; it’s demonstrating that active cooling doesn’t have to mean fans, thick heatsinks, or wide-open vents when you still want sustained SoC power around the 25 W class. https://froresystems.com/
AirJet is a fully self-contained thermal module that uses ultrasonic MEMS membranes to pull air in and push out high-velocity pulsating jets, trading “big fan airflow” for high static pressure and a controlled internal duct path. Frore’s published numbers put AirJet Mini G2 at about 7.5 W heat removal per chip, ~2.65 mm thickness, ~1,750 Pa back pressure, and ~21 dBA acoustics, which helps explain why stacking multiple chips scales cleanly inside a compact device package.
The reference design is shown in two form factors: an ultra-thin square slab and a circular puck variant, both intended as templates that Qualcomm can hand to OEMs rather than a finished retail product. Because intake happens through small, discrete inlets, the demo highlights adding fine filtration (they mention a MERV-14 class filter) to move toward dust-resilient, water-resistant designs that won’t clog like conventional fan grilles. This was filmed at CES Las Vegas 2026, where sealed edge compute is a recurring theme here.
In practical terms, the interesting engineering claim is sustained performance: keeping an Arm Windows desktop from thermal throttling once CPU, GPU, and NPU blocks are loaded for long AI sessions, compiles, or local inference. The speaker frames it as “about five times thinner than a Mac mini” while maintaining higher sustained output, but even if you ignore the comparison, the takeaway is a thermal budget strategy that prioritizes flat, mount-anywhere PCs over short benchmark bursts today.
If these concepts become shipping systems, expect them to show up behind monitors, inside kiosks, in conference-room AV racks, and in industrial/retail edge boxes where acoustic noise, dust ingress, and service intervals matter. Solid-state active airflow removes fan bearings as a failure point and gives OEMs more freedom on materials (plastic or metal) while keeping the system quiet.
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