Dell Technologies walks through its IR7000 Integrated Rack approach: a factory-tested, preconfigured 50U rack-scale platform (21-inch, OCP ORv3-oriented) built to host up to 36 compute nodes plus eight power supplies, with separate switching for the high-speed data fabric and the management network. The goal is “rack as a system” modularity, so the same chassis can be populated with NVIDIA Grace Blackwell hardware such as GB200 NVL4, future GB300-class payloads, or CPU-only nodes for more conventional simulation workload. https://www.dell.com/en-us/shop/dell-integrated-rack-scalable-systems/sf/integrated-rack-scalable-systems
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Cooling is treated as a first-class constraint. IR7000 supports direct liquid cooling with cold plates on CPUs and GPUs fed by either an in-rack CDU (coolant distribution unit) or an in-row CDU, while a rear-door heat exchanger interfaces to facility water for the room loop. That two-step scheme targets near-total heat capture at the rack, reducing dependence on cold data-hall air and shifting planning toward coolant supply temperature, flow rate, pressure drop, monitoring, and serviceability in water.
Power density is the other theme that dominates buyer questions. The demo references racks running around 264 kW, with a design path toward roughly 480 kW as accelerator sleds, NVLink-class domains, and higher-TDP CPUs raise per-node draw. In practice that means sizing busway and PDU capacity, choosing a redundancy model, validating breaker and cable derating, and ensuring cooling distribution scales across rows so new racks can be commissioned with predictable electrical and thermal capacity.
Recorded at Supercomputing SC25 in St. Louis, the message is less about one GPU SKU and more about making rack-scale AI infrastructure repeatable. When compute, networking, and liquid cooling are integrated as one deployable unit, operators can focus on topology, scheduling, and uptime targets rather than rebuilding the data center for each new generation of accelerated compute in HPC.
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