ZutaCore explains why two-phase direct-to-chip cooling is showing up everywhere in AI infrastructure: instead of pushing more water through a cold plate, a dielectric fluid boils on the hot surface and carries heat away as vapor, so bubble activity naturally follows local heat flux. The loop then condenses that vapor and returns liquid back to the cold plate, which is why the demo looks like “cooling by boiling” while keeping electronics isolated from conductive coolant.
https://zutacore.com/
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The key engineering point is that phase change does most of the work: temperature is pinned near the boiling point, and extra power shows up as more vapor generation rather than a runaway junction rise. Because the design targets low flow and low pressure, the mechanical plant can be simpler (smaller pumps, less parasitic power, fewer failure points), while staying safer around IT gear thanks to a non-conductive, non-corrosive fluid in a closed loop.
On the product side, they point to production-ready “server loop” assemblies that arrive factory-integrated on OEM platforms, including an NVIDIA-approved HGX B300 configuration shown on an ASRock Rack system. The conversation anchors on today’s 1,200 W-class accelerators and the need to stay ahead of upcoming heat-flux jumps, noting cold-plate validation figures up to 2,800 W and mentioning mixed CPU/GPU builds such as AMD EPYC plus AMD Instinct MI325X in the same rack.
Rather than framing it as just keeping silicon below a limit, they connect cooling to facility economics: lower fan power, lower pump power, and better overall PUE when racks are dense and power-constrained. In a segment filmed at Supercomputing SC25 in St Louis, a partner discussion with Neuralwatt cites measurements like reduced peak temperature, avoidance of thermal throttling, and a reported lift in inference “tokens per watt” when chip power management is combined with two-phase cooling, aiming at measurable energy efficiency.
They also preview OmniTherm, an orientation-agnostic two-phase cold plate meant for reversed layouts and emerging back-side power delivery, where gravity-sensitive vapor paths can break performance. The takeaway is that ZutaCore is packaging two-phase cooling as a familiar cold-plate integration plus a waterless CDU and loop architecture (including end-of-row CDU designs announced in late 2025), so operators can scale to higher-TDP NVIDIA, AMD, Intel, and custom accelerators without redesigning the chip.
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