Koolmicro presents its Integrated Manifold MicroChannel (IMMC) liquid cooling for high-power AI and HPC chips, showing how a single cold plate can cover dual Nvidia GB200 GPUs plus the host CPU in one compact module. By reshaping coolant paths inside the plate instead of simply pushing more flow, the design targets low thermal resistance and reduced pump power for dense data center racks and workstations. https://koolmicro.com/
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The interview explains Koolmicro’s manifold and microchannel geometry, where vertical manifolds feed short microchannels positioned directly over GPU and CPU hotspots. This produces a more uniform temperature field across the silicon and allows lower flow rates and higher inlet temperatures, which matters for power usage effectiveness and chiller design. Direct-to-chip cold plates of this type are becoming a core building block for large AI clusters, exascale nodes and other liquid-cooled HPC hardware.
To make the gains concrete, Koolmicro runs a live A/B comparison on an Nvidia RTX 5090, showing its own cold plate next to a conventional design under identical power, inlet temperature and flow. The demo reports roughly fifteen to twenty percent lower thermal resistance and about four to five degrees Celsius lower junction temperatures with the Koolmicro plate. A dedicated thermal test vehicle with 27 embedded sensors and programmable heat loads up to roughly 4.5 kW is used to characterize spatial temperature profiles and validate the cooling performance using detailed thermal mapping.
Koolmicro also outlines its IMMC roadmap: IMMC-1 as the current copper direct-to-chip plate, IMMC-2 moving liquid cooling into the package for shorter thermal paths, and IMMC-3 targeting future wafer-level cooling co-designed with semiconductor manufacturing. Their manifold microchannel structures have been demonstrated in published data at heat flux levels near 2,000 W/cm², pointing toward support for next-generation AI accelerators, data center CPUs, non-memory semiconductors and high-power optical or LiDAR infrastructure.
Recorded at the SC25 Supercomputing conference, the discussion situates Koolmicro within a broader shift toward liquid-cooled AI infrastructure and the Korean ecosystem of chip and system vendors. With headquarters in South Korea and R&D centers in Atlanta and San Jose, the team emphasizes complete liquid loops for servers and workstations—pumps, manifolds, cold plates and controls—rather than treating the plate as an isolated part. The result is a technically grounded look at how manifold microchannel liquid cooling can scale with future AI workloads while improving data center energy efficiency and cooling.
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