Legrand uses this booth tour to show how it wants to be a full-stack infrastructure vendor for modern data centers, from power distribution and racks to cooling, structured cabling and out-of-band management. The conversation walks through how busway, OCP ORV3 power shelves, vertical PDUs, rear-door heat exchangers, high-density fiber and remote management all fit together into one architecture for AI and cloud workloads. More details on the portfolio are on Legrand’s data center site: https://www.legrand.com/datacenter/en
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The tour starts with overhead Starline-style busway distributing high-voltage power above the white space, so cabinets can be added, moved or decommissioned without rewiring under the floor. That same busway feeds Legrand’s OCP ORV3 cabinets and power shelves, with 1RU and 2RU shelves that convert AC into DC for IT loads and tie directly into a vertical DC busbar at the rear of the rack. Combined with the intelligent rack PDUs from the Server Technology and Raritan brands, Legrand positions itself as a major player in vertical power distribution and per-outlet metering at scale.
Cooling is handled by a rear-door heat exchanger mounted directly behind the cabinet, pulling hot exhaust air through a liquid-cooled door. In the interview they quote up to 200 kW of rack cooling capacity, which lines up with Legrand’s ColdLogik rear-door cooler portfolio aimed at high-density AI and HPC racks. Rear-door systems sit between air and direct-to-chip liquid cooling, letting operators raise supply temperatures, shrink chiller loads and still manage the thermal footprint of dense GPU nodes without completely redesigning the room.
On the connectivity side, Legrand emphasizes structured cabling and new “direct mating” fiber architectures. Instead of traditional cassettes, Infinium acclAIM style VSFF connectors mate patchcords directly to trunks, increasing density and reducing insertion loss in the link budget. The portfolio spans copper, fiber trunks up to 288 fibers, and a programmable optics line with transceivers, DACs and AOCs designed for spine–leaf fabrics and storage backbones. The goal is to keep passive infrastructure ready for 400G and 800G transitions while cleaning up patching complexity in crowded racks.
Finally they touch on out-of-band and monitoring, referring to a “ZU” or out-of-band platform that ties mission-critical IT resources together for secure remote access. That aligns with Legrand’s integration of ZPE Systems’ Nodegrid out-of-band management into its data center stack, combining serial console, remote power control and telemetry in one control plane. The interview closes by situating Legrand as a French-headquartered, globally manufactured group that delivers power, light and data to where people live and work, with data centers now a key growth area. This walkthrough was recorded at Supercomputing 2025 (SC25) in St Louis, where Legrand uses the booth as a live reference design for AI-ready data center infrastructure.
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