Chipsip Technology at the Rockchip booth at CES 2014 presents their PCB Design using the ultra low power dual-core ARM Cortex-A9 Rockchip RK3168 SoC using POP Memory in a form factor that can fit in a Google Glass type of device, Rockchip powered. This means SoC, RAM and Flash all occupy the same space as the SoC alone, the rest of the PCB being for a few more things like Bluetooth/WiFi, sensors, power management and a few more. This design thus can fit in a headmounted Android computer configuration, display the Android UI in the heads-up display, here using the the same HIMIX display that Google uses in Google Glass. Taiwan based ChipSiP Technology is a PCB Design house who designs Rockchip based PCBs and products, they are also working to integrate the Rockchip RK3188 in this type of Google Glass like form factor. The price of end-units all depends on the volume of mass production, it would be expensive if volume remains low, but the price can come down to much lower if these designs are quickly mass produced.
Here is ChipSiP’s contact informations (please only contact them if you are a serious bulk purchasing potential customer):
ChipSIP Technology Co Ltd
Jay Hsu, Assistant Manager, Logic SiP Division, Project Control and Management
Telephone: +886 988 867 129
jayhsu@ChipSIP.com
http://www.ChipSiP.com
