Category: Windows

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GIGABYTE shows Cavium ThunderX2 ARM Server Portfolio

Posted by Charbax – June 13, 2018

The R181-T90 is a 1U height dual socket general purpose ThunderX2 rack server with 8 channels RDIMM / ECC UDIMM DDR4 memory, 24 x DIMM slots, 1 x 25GbE SFP28 LAN port, 1 x 10GbE SFP+ LAN port (optional), 12 x 2.5” hot-swap HDD bays, 2 x OCP mezzanine slots (PCIe 3.0 x16), Aspeed AST2500 management controller, and 1+1 1600W 80 PLUS Platinum PSU. The R281-T91 is a 2U height dual socket general purpose ThunderX2 rack server with 8 channels RDIMM / ECC UDIMM DDR4 memory, 24 x DIMM slots, 1 x 25GbE SFP28 LAN port, 1 x 10GbE SFP+ LAN port (optional), 24 x 2.5” hot-swap HDD bays, 8 x PCIe 3.0 expansion slots, Aspeed AST2500 management controller, and 1+1 1600W 80 PLUS Platinum PSU. The R181-T90 and R281-T91 will be available to order from July 2018. The H261-T60 is a 2U height 4 node density optimized ThunderX2 server with dual ThunderX2 CN9975 sockets for each node (8 x sockets in total) and rear access to the node trays. The sockets will support a CPU up to 195W TDP. Each node supports 4 channels RDIMM / ECC UDIMM DDR4 memory, with 64 x DIMM slots for the system in total. The system contains in total 8 x SFP28 10G/25G LAN ports, 4 dedicated management ports, 12 x 3.5” SATA/SAS hot-swap HDD/SSD bays, 8 x low profile PCIe Gen3 expansion slots, 4 x OCP Gen3 mezzanine slots, and the system includes Aspeed AST2500 remote management controller and 1 + 1 2200W 80 PLUS Platinum redundant PSU. The H261-T60 will be available for shipping in late September or early October 2018. Find more information on GIGABYTE’s server products at http://b2b.gigabyte.com

Qualcomm Press Conference at Computex 2018

Posted by Charbax – June 6, 2018

Qualcomm launches the Snapdragon 850 for Windows 10, with representatives of Microsoft and Samsung participating in the keynote too. You can see my extensive video interview about Qualcomm Snapdragon 850 for Windows 10 Laptops here.

Cavium ThunderX2 benchmarks compared with Intel and AMD

Posted by Charbax – June 5, 2018

Patrick Kennedy, Editor-in-Chief at ServeTheHome.com talks about the independent benchmarks on ThunderX2 that he published at ServeTheHome.com as Cavium announced General Availability of the ThunderX2 ARM Server at their event in San Francisco last month.

The ThunderX2 family includes over 40 different SKUs for both scale up and scale out applications, ranging from top bin 32 core 2.5GHz parts to 16-core 1.6GHz parts, mapping directly across Intel's Xeon Skylake server CPUs from highest end Platinum to low end SKUs. With list prices for volume SKUs (32 core 2.2GHz and below) ranging from $1795 to $800, the ThunderX2 family offers 2-4X better performance per dollar compared to Xeon Skylake family of processors. The ThunderX2 family is fully compliant with Armv8-A architecture specifications as well as the Arm Server Base System Architecture and Arm Server Base Boot Requirements standards. The ThunderX2 SoC family is supported by a comprehensive software ecosystem, ranging from platform level systems management and firmware to commercial Operating Systems, Development Environments and Applications. Cavium has actively engaged in server industry standards groups such as UEFI and delivered numerous reference platforms to a broad array of community and corporate partners. Cavium has also demonstrated its leadership role in the Open Source software community driving upstream kernel enablement and toolchain optimization, actively contributing to Linaro's Enterprise and Networking Groups, investing in key Linux Foundation projects such as DPDK, OpenHPC, OPNFV and Xen and sponsoring the FreeBSD Foundation's Armv8 server implementation.

Qualcomm Snapdragon 850 for Windows 10 Laptops

Posted by Charbax – June 5, 2018

35% performance upgrade compared with Snapdragon 835 Windows 10 Laptops such as the Asus Novago which I filmed here features Qualcomm Kyro 385 which is their customized Octa-core quad ARM Cortex-A75 and quad ARM Cortex-A55, going up to 2.95GHz with less throttling. Samsung announces that they will be making Windows 10 on Snapdragon 850 device. Other manufacturing partners Asus, HP and Lenovo are also going to release new devices featuring this chipset. The Snapdragon 850 features 1.2Gbit/s LTE using the X20 modem on SoC (20% faster than 835), fast Wi-Fi, 3x faster AI performance than 835, up to 25 hours of continuous usage. Qualcomm Aqstic enables virtual surround sound, native DSD support, aptX HD as well as 4K capture (possibly up to 4K video-conferencing possible). Microsoft has published this session video from their recent Build conference explaining how developers can compile, build and optimize ARMv8 versions of any Windows app, on stage they showed how to compile the Windows VLC app for the ARM64 Windows 10 platform. Working with Gemalto, Qualcomm demonstrates Integrated SIM (iSIM) on their Snapdragon 850 trusted secure hardware element, to be able to select, load Telecom packages full securely, perhaps eventually also load and store any SIM card into the device and switch between each one.

Aiptek APEX and i70 pico projectors

Posted by juliusaugustus – May 10, 2018

Aiptek is a leading Chinse manufacturer of Projectors ranging in prices from $50 to $1000. One interesting device from Aiptek is the APEX projector with a built in Windows PC that is modular and detachable. The Aiptek i70 is the world's smallest wireless projector.

$300 Sunchip All-in-one AR on RK3288 (like Hololens), $7 Wi-Fi power plug

Posted by Charbax – April 20, 2018

Sunchip shows some of their latest products including their all-in-one AR system based on Rockchip RK3288, RK3399 board for digital signage. $58 Amlogic S912 TV box, $26 RK3126 HDMI Stick, $200 Apollo Lake Box. 360 panoramic camera. $7 single Smart Wi-Fi Plug, $11 for dual Wi-Fi plug.

Microsoft Azure on Arm Servers Keynote at Linaro Connect Hong Kong 2018

Posted by Charbax – March 21, 2018

HKG18-300K1 – Keynote: Leendert van Doorn “Microsoft Azure: Operating at Hyper-Scale”

At scale everything changes. It is one thing to operate a datacenter of 10K nodes, it’s an entirely different thing to operate millions of nodes across 100’s of datacenters around the world. What works well for enterprises doesn’t necessarily work at scale.

Microsoft is currently deploying their 6th generation platform designs and at each generation their insights improve and in some cases entirely change leading to many specific requirements to silicon vendors, ODMs and system integrators. Over the years Microsoft effectively had to become its own OEM where they manage the entire system design from sheet metal, motherboards, firmware, hypervisors, operating systems, management stacks and corresponding higher-level services. They do this so they can control cost, quality, reduce complexity and drive their innovations.

In this talk he takes people through some of the lessons learned when Microsoft Azure’s scale increased over the years. He presents some of the rationale behind their ARM64 server plans and specifically the rational behind some of their ARM64 silicon requirements.

Leendert van Doorn is a distinguished engineer in Microsoft’s Azure organization where he is running a set of hyper-scale incubation projects. Before joining Microsoft he was a Corporate VP/Fellow at AMD driving various software and hardware initiatives. Leendert holds a Ph.D. from the Vrije Universiteit in Amsterdam, The Netherlands.

http://connect.linaro.org/resource/hkg18/hkg18-300k1/

Learn More at http://connect.linaro.org

Epson EB-710Ui, Laser interactive projector

Posted by Charbax – March 9, 2018

This is Epson's best ultra short throw interactive FHD projector, generating up to a 100" laser display at Full HD WUXGA resolution with Epson's 0.67 inch with MLA (D10) 3LCD technology at 4000lumen, 2,500,000:1 Contrast Ratio, 20,000 Hours Durability.

TechNexion Android Things dev kits, modules, embedded systems at the Embedded World 2018

Posted by Charbax – March 7, 2018

TechNexion shows off its Android Things development kits, modules, embedded systems and more new products at the Embedded World 2018. The TechNexion product lineup has grown once again in size. The company is showcasing Android Things development kits based on PICO-PI-IMX7 Low-cost system on modules that are modular, scalable and versatile. The Android Things development boards are based on the NXP i.MX7 applications processor. TechNexion is also launching several wireless communication modules, including PIXI-41Z and the PIXI-9377 low-cost, certified, 1x1 802.11 AC/BT4.1 module that deliver high transmission rates, low latency and improved range.

TechNexion is a provider of embedded systems and system-on-modules, in 2017, TechNexion was chosen by Google as a partner to develop the reference design for its Android Things development kit. That kit based on the PICO-PI-IMX7 board has been the go-to development kit distributed at developer shows and used for demoing the potential of Android Things.

The New TechNexion PIXI series is a communication module that delivers all IoT multi-mode communication needs in one ultra-compact and secure module series. It is specifically designed to enable better transmission rates, lower latency, better range and higher resistance to interference when two or more communication protocols – for example, Wi-Fi, Bluetooth or Thread - are needed to run concurrently on one system-on-chip. Multiple communication protocols in one chip means users can collect more data from disparate communication protocols, while also having the flexibility to use the right protocol to suit the type of data and distance from your hub.

Panel PCs – TechNexion has three human-machine-interface (HMI) panel computing series: TC, TEP and TWP. The TEP Series is available with either ARM or x86 architecture and has an IP65 anodized aluminum enclosure and a flux mounted projective capacitive touch, high brightness LCD display - ranging from 5 to 15.6 inches. The TWP Series is a fully waterproof, IP69K, panel PC designed to withstand extreme temperatures, high vibration, and cleaning with a jet spray. It is also available with either ARM or x86 architecture – ranging from 10 to 15.6 inches. The TEP-1560-IMX6 is their 15” panel computer based on i.MX6 and the TWP-1560-IMX6 is their NEW model that is waterproof, stainless steel, panel computer.

Fanless Box PCs - The TEK Series fanless computing systems are enclosed in a compact, fully ruggedized enclosure, and are perfect for controlling versatile end-equipment.

System-on-Modules – TechNexion continues to expand its SoM options through its two series, EDM and PICO. These series have an exhaustive range of options around size, processor capability and connector type enabling the creation of almost any kind of embedded device. They are designed to be scalable and come with fully open source software – Linux and Android - and schematics.

WandPi-8M community board – TechNexion were also showing the latest version of their community development board. It is based on NXP’s i.MX8M Quad application processor with ARM Cortex-A53 + M4 architecture to deliver 4K UltraHD with HDR video quality with pro audio fidelity. The WandPi-8M is available for pre-order and is expected to ship in Spring of this year.

Blade Shadow cloud gaming pc service launched in UK and California

Posted by Charbax – February 24, 2018

Here I film at the UK launch of the Blade Shadow cloud PC gaming service, at the Meltdown London e-sports bar, where they have setup a bunch of Shadow PCs for cloud based gaming PC streaming service
here powering their League of Legends tournament. Blade Shadow is a French startup who I also interviewed at CES here they have now launched their service to cover the UK and they have also activated their West Coast USA server to serve customers in California. For about $35 per month you get remote access to "your own" Xeon gaming desktop with an Nvidia GTX1080 GPU, 12GB RAM, 256GB SSD running Windows 10 Pro.