Category: Internet of Things

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TechNexion Factory Tour

Posted by Charbax – June 16, 2017

TechNexion is a design and manufacturing company showing in this video its engineering team, that designs IoT smart devices, development boards for the needs of projects like the ARM powered Android Things ecosystem by Google or Amazon Alexa Voice-Recognition development platform and its advanced manufacturing capabilities. In the video, we get a direct glimpse of how ARM modules and systems are designed and how much automation is being utilized in a smart SMT factory. The video tour takes you through all production stages from the module design to SMT manufacturing to post production functional testing. The factory churns out up to 250K PCBA per month. Filmed on location at the TechNexion factory in Taipei, Taiwan in June 2017.

Silicon Labs Blue Gecko Development Kit for Bluetooth 5 and IoT

Posted by juliusaugustus – June 5, 2017

Silicon Labs Blue Gecko Bluetooth Smart Module Wireless Starter Kit for BGM121 and BGM123 SiP modules and BGM111 module are Silicon Labs development boards to start evaluation and development of Bluetooth Smart applications for IoT. The wireless starter kit comes with the Bluetooth Smart module radio board, a main board with coin-cell battery holder, USB and Ethernet connections, display and connections to all the modules peripheral interfaces as well an extension board with additional peripherals like an accelerometer. The solution now support up to Bluetooth 5.0.

Android Things Development Board by TechNexion

Posted by Charbax – June 4, 2017

TechNexion shows the Android Things ARM Powered development platform designed to enable energy-efficient, secure and portable applications for Google's Internet of Things ecosystem strategy. The development platforms provide hardware that developers need to speed up their IoT projects on the Android Things platform as well as onto other supported platforms such as Ubuntu, Debian, Yocto Project, regular Android and more. TechNexion also continues to build on its complete lineup of System on Modules designed for modular, versatile, scalable and low-power applications that can be easily integrated into other devices for all types of IoT development.

ARM Keynote: Rene Haas, ARM IP Group President at Computex 2017 CPX Conference

Posted by Charbax – June 4, 2017

Keynote at the Computex 2017 CPX Conference by Rene Haas, ARM President, Intellectual Property Group.

$0.01 Flexible Plastic ARM Processor by PragmatIC

Posted by Charbax – May 21, 2017

Enabling Trillions of ARM processors to be made cheaply to be embedded everywhere as envisioned by ARM owner Masayoshi Son, PlasticARM is an implementation of an ARM Cortex-M0 based 32-bit microprocessor SoC in plastic. Using PragmatIC’s technology, the flexible integrated circuit (FlexIC) is implemented in thin film metal oxides on a polymer substrate, with a total thickness of less than 10um. The latest version uses a 1um cell library, delivering a 10x improvement in footprint over the last 2 years, and significantly advancing the state-of-the-art in printed logic. PlasticARM demonstrates the potential for PragmatIC’s ultra-thin and ultra-low-cost plastic electronics to extend from smart packaging into areas such as wearables and security. You can read more about PragmatIC at http://pragmaticprinting.com This video was filmed at the IDTechEx Show!

You can watch the Keynote presentation by PragmatIC at IDTechEx here:

TEGnology thermoelectric Energy Harvesting for self-powered Sensor Network

Posted by Charbax – May 21, 2017

TEGnology develops and commercializes new materials to be used in thermo electric generation, the material is cheaper and more heat-resistant than other materials on the market has developed costing less than 5% of the competition and is manufacturable in industrial quantities. With an ROI of less than two years, their two new materials exploit waste heat energy recovery very efficiently, useful for markets such as automotive, maritime, bio-fuel, Combined Heat & Power and the Sensor Industry. TEGnology replaces batteries, requires no maintenance, it's Made in Denmark, it is Low cost and available, uses commonly available materials, no tellurium or lead enables Self-powered wireless IOT sensor for temperature, pressure, vibration and more, it's high temperature energy harvesting for industry. Filmed at the IDTechEx show.

8Power self-powered Sensor Network (IoT with no batteries, no charging)

Posted by Charbax – May 21, 2017

8Power presents the Track100, a 100% self-powered Energy Harvesting LoraWan LPWA GPS Tracker for creating Sensor Networks that run on vibrations and solar. These can be installed all over the place, never having to go back to change the batteries nor recharging the devices to power the Sensor Network IoT. 8Power Ltd received the Best Technical Development within Energy Harvesting Award at the IDTechEx Show. Filmed at the IDTechEx Show.

Android Things on TechNexion Pico i.MX7D, i.MX6UL and soon i.MX8M

Posted by Charbax – May 20, 2017

Google Android Things launch partner, TechNexion Pico Pi SoM is an ARM Powered Google Android Things IoT development System on Module, the NXP Pico i.MX7D Dual Core ARM Cortex-A7 with ARM Cortex-M4, NXP Pico i.MX6UL and soon also it will be with 64bit i.MX8M Quad Core ARM Cortex-A53 and ARM Cortex-M4. These TechNexion Android Things System on Modules can dock into a Raspberry Pi form factor for development and expansion of advanced IoT projects using Android Things, you can read more about Android Things at http://iot.google.com and https://developer.android.com/things/hardware/developer-kits.html

you can see the TechNexion Android Things SoM at the Google I/O keynote about Android Things 19 minutes, 50 seconds into the video here:

Toradex at Microsoft Booth with Azure IoT Hub, Windows 10 IoT Core and Windows Embedded Compact

Posted by Charbax – May 19, 2017

At the Microsoft booth, Toradex demonstrated its multiplatform system connected to the Microsoft Azure IoT Hub – the Cloud Parking demo. Toradex System on Modules (SoMs) were employed in the access control, license plate recognition and the payment system, the communication between them made only through the internet, using only the Azure services. Linux, Windows 10 IoT Core, and Windows Embedded Compact are used as Operating Systems on the modules. Additionally, an interesting Toradex showcase included their new Heterogeneous Multicore Low Power demo featuring the Colibri iMX7D based on the NXP i.MX 7 Dual Core SoC.

Hololens at Microsoft Embedded World Booth Tour and Toradex, Azure Windows 10 IoT Core

Posted by Charbax – May 19, 2017

My first time trying on the Microsoft Hololens headmounted augmented reality system running on an Intel cherrytrail system selling at $3000 on the Microsoft store. In this video I walk around the Microsoft booth at Embedded World, checking out some of Microsoft's partners including Microtronics smart bicvcle running Silicon Labs ARM Cortex-M system through Windows Server. This video features Toradex at 4:13 into the video demonstrating its multiplatform system connected to the Microsoft Azure IoT Hub where Linux, Windows 10 IoT Core, and Windows Embedded Compact are used as Operating Systems on the modules featuring Heterogeneous Multicore Low Power Colibri iMX7D based on the NXP i.MX 7 Dual Core SoC.