RoseFinch7100 has passed the certification of China Mobile and China Telecom, and it has been widely deployed in gas meters, household appliances, municipal management (parking, manhole cover, street lamp, environmental monitoring) and other industries.
The demonstration will show the RoseFinch7100 running the Zephyr RTOS with integrated IP/TCP/UDP/COAP/MQTT/LWM2M protocols, IoT Cloud Engine and FOTA services. Sanechips has worked closely with the Linaro IoT and Embedded (LITE) group to enable upstream Zephyr support for the chip. The Sanechips Development Environment (SDE), based on OpenOCD (Open On-Chip Debugger) and Eclipse, will also be demonstrated.
Produced on a 55nm ultra low power technology process, the RoseFinch7100 is specifically designed for intensive low power IoT applications, such as cellular LPWA (low power wide area). The chip integrates the low power/high performance CEVA-X1 DSP IP for baseband and offers low sleep current of 2uA at 2V, which can provide an extended battery life. It also offers Cloud-Chip Global Security based on Trusted Zone, up to 30 GPIOs and all R14 Frequency Bands, and no need for an external MCU as the RoseFinch7100 can provide strong connectivity for most LPWA applications independently.
Marcus Taylor, CEO of Silent Sensors (http://silentsensors.com) demonstrates their Energy Harvesting and RFID products for use in rubbers elastomers and polymers, with a special focus on tires. Tires, first and foremost, are safety products. About 20% of all accidents on the road are caused by underinflated tires. Underinflated tires also translate into increased fuel consumption and increased tire wear. All the components they use have to be automotive grade.
At the IDTechEx Show! Europe, Silent Sensors introduced a new supercapacitor that is very flexible and able to withstand high temperatures, which is necessary for tire manufacture and production.
Holst Centre (http://holstcentre.com) is an independent R&D center that develops technologies for wireless autonomous sensor technologies and flexible electronics, in an open innovation setting and in dedicated research trajectories. A key feature of Holst Centre is its partnership model with industry and academia based around roadmaps and programs. It is this kind of cross-fertilization that enables Holst Centre to tune its scientific strategy to industrial needs.
CAP-XX provides peak power support to 3V coin cell batteries and eliminates need for 2.7V LDO regulator for less expensive, smaller, more energy-efficient designs with extended battery life
CAP-XX is a leader in supercapacitors that deliver peak power to support or replace batteries, announced at the IDTechEx Show! Berlin 2018 that it has developed the industry’s first 3V thin, prismatic supercapacitors. The company will deploy its 3V technology first in thin prismatic form to meet demand for small, inexpensive, energy-efficient power solutions for thin wearables, key FOBs and other IoT devices. CAP-XX will then integrate the 3V technology into its larger prismatic supercapacitors, automotive modules and other products for high-energy, high-power applications.
Silicon Labs demonstrates their latest Internet of Things devices including their Dynamic Multiprotocol support based on their Mighty Gecko ARM Cortex-M4 platform supporting Zigbee and Bluetooth in parallel running Micrium RTOS with just a few microsecond delay when switching. Micrium RTOS is the number 1 in the commercial RTOS market. Silicon Labs also shows their Bluetooth 5 support, voice over Bluetooth LE, sensor to cloud connectivity, apple homekit, Bluetooth 5 can do 4 times longer distance or 2 times more bandwidth compared with Bluetooth 4. Silicon Labs shows their Bluetooth Mesh system using their Mighty Gecko development board that also features a memory LCD display. Silicon Labs acquired Sigma Designs Z-Wave Business, where Z-Wave goes into sub-Ghz so there is less noise going through walls, reaching longer distances compared with Bluetooth and Zigbee and also able to make it a Mesh. They now have the 500 series chip and they are going to announce the 700 series ARM Cortex-M4 chip running at lower power providing a longer range. Silicon Labs has shipped hundreds of millions of devices thus far based on their Mighty Gecko, Bluetooth, and Zigbee products and they also have shipped over 100 million devices using Z-Wave.
Socionext and partners show their newest solutions featuring the Linaro Edge Box and other of their solutions for camera and video processing, AI, IoT including their Image Signal Processor demonstrations for High-accuracy license plate recognition, High-performance under ultra-low-light conditions, Multi-camera UHD panorama view (four cameras), AR / VR / MR / XR, Video – Hybrid Codec Solution Demos, Socionext’s High-density video transcoding for Cost-saving IP video distribution, Intelligent edge computing, AI / IoT – Edge Computing and High-performance AI inference system for High-efficiency video management systems (VMS) and Power-saving edge.
TechNexion shows off their new products at Computex 2018: pre-certified IoT modules, Android Things development kits, IP69K embedded systems and more. The booth tour starts with Android Things development kit PICO-PI-IMX7 live demo, based on NXP i.MX7 Dual applications processor and ARM Cortex-A7 architecture has been the go-to development kit since the official Android Things launch at Google I/O in May. The company also demonstrates PICO-IMX8M SoM based on NXP i.MX8M processor and Cortex-A53 + M4 architectures that delivers a whooping 4K UltraHD video performance with HDR and pro audio fidelity for multimedia applications. TechNexion is also launching CE, ETSI, FCC, IC, RCM and TELEC pre-certified IoT wireless communication modules and development kits: PIXI-9377 based on Qualcomm QCA9377, PIXI-6174 based on Qualcomm QCA6174 that deliver high transmission rates, low latency and improved range in noisy industrial environments. The company is showcasing a fully waterproof TWP-1010-IMX6 HMI based on NXP i.MX6 ARM Cortex-A9 processor that was specially designed to withstand extreme environments and cleaning with a jet spray. TWP series likewise includes models based on Intel Braswell architecture. TEK5-APL box PC based on Intel Atom x5-E3930, x5-E3940, x7-E3950 and Apollo Lake architecture, enclosed in a fully ruggedized enclosure for use in a vehicle.
Jensen Huang, Founder and CEO of Nvidia, Announces Jetson Xavier which I have filmed a separate interview about here, he does not launch the rumored GTX2080 or GTX1180 next-gen graphics cards yet, provides update on Max-Q thinner full GPU gaming laptops, talks DGX-2 supercomputer “The World’s Largest GPU” (an update on the DGX which I filmed here) with 2 petaflops of performance in one node, 512GB frame buffer which has set 5 world records: fastest single chip, fastest single node, fastest at scale, fastest inference, and highest inference throughput.
Nvidia launes Jetson Xavier with 20x the performance of Jetson TX2 and 10x the energy efficiency with 512-core Volta GPU with Tensor Cores in an embedded module with more than 9 billion transistors it runs at under 30W, with multiple operating modes at 10W, 15W, and 30W. The Jetson Xavier ARM SoC has 6 kinds of high-performance processors on its SoC, a Volta Tensor Core GPU, an eight-core ARM64 CPU, dual NVDLA deep learning accelerators, an image processor, a vision processor and a video processor. Jetson Xavier has a peak performance of up to 30 TOPS (trillion operations per second) of mixed-precision FP32/FP16/INT8 performance. It can encode dual 4K60 H265 and decode dual 4K60 H265 at up to 12bit. Comes with 16GB LPDDR4x RAM with 137GB/s memory bandwidth, 32GB eMMC storage. It also has a dual NVDLA DL/ML Accelerator Engines which are open source available at http://nvdla.org and a 7-way VLIW Vision Accelerator. Nvidia Jetson Xavier runs using the Nvidia Isaac platform, a toolbox for the simulation, training, verification and deployment of Jetson Xavier. This robotics software consists of: Isaac SDK, APIs and tools to develop robotics algorithm software and runtime framework with fully accelerated libraries, Isaac IMX (Intelligent Machine Acceleration) applications, a collection of NVIDIA-developed robotics algorithm software, Isaac Sim, a highly realistic virtual simulation environment for developers to train autonomous machines and perform hardware-in-the-loop testing with Jetson Xavier. The Nvidia Jetson Xavier developer kit, which includes the Isaac robotics software, will be priced at $1,299, with early access starting in August from distributors worldwide.
BOE presents their latest flexible AMOLED display solutions for the future of smartphones that can be bent, folded, and rolled and even flap in the wind. BOE’s flexible displays is demonstrated for robots with touch control, smart loudspeakers, an S-shaped in-car flexible AMOLED display. 8K displays, micro displays, QLED displays and other IoT solutions such as their TFT based AMOLED fingerprint recognition system that works in any spot of the display area
The foldable all-screen WQHD AMOLED display launched by BOE can achieve minimum dynamic bending with a radius of only 1mm. It can be bent more than 100,000 times and has an NTSC color gamut up to 118%. BOE is exhibiting a 5.99″ FHD+ 2160×1080 Flexible AMOLED foldable mobile phone and a 7.56″ foldable tablet. The display can be used for mobile phones when it is folded up and for tablets or monitors when it unfolds.
As one of the upcoming possibly revolutionizing OLED technical directions, BOE demonstrates their OLED printing technology to possibly just print the future of Smartphone displays showing their 5.5″ FHD (1920×1080) printing flexible OLED display.
UHD has become a keyword of SID 2018 for material and equipment suppliers and device manufacturers, signaling the advent of the 8K era. In addition to the 110-inch 8K, 75-inch 8K, and 65-inch 8K glasses-free 3D displays, BOE also presents 13.3-inch 8K display products, promoting the development of small and medium-sized 8K products.
BOE has gathered speed in building an 8K ecosystem ever since it launched the “8425 strategy” which means “promoting 8K, popularizing 4K, replacing 2K and making good use of 5G”. BOE has recently launched the 8K solution that incorporates BOE’s 4K/8K image service cloud, 8K decoder player, and 8K display device, making it possible to shoot, edit, transmit and broadcast 8K content. This helps to solve problems like the costliness and massive size of traditional decoder players, as well as the lack of 8K content, thus promoting the faster popularization of 8K.
Among several micro displays at BOE’s booth is a silicon-based OLED AR product which features monocrystalline silicon as the active drive backplane as well as high resolution, high level of integration, low power consumption, small size, and light weight. The AR product is backed by a 0.39-inch silicon-based OLED which has the world’s leading pixel density of 5644PPI, 17 times that of a Retina display, and a contrast ratio over 10000:1, which enables the overlapping and interaction between virtual 3D images and real scenes. All these secure an ultimate experience for users as well as bright prospect in the field of education and training, video games, home decoration, etc.
Moreover, BOE shows its cutting-edge technologies and products such as QLED, mini-LED displays, a number of new applications and products including curved in-car display instruments and BOE iGallery.
Petfull is a maker of smart devices that cater towards pet owners. The automatic water dispensor can be remotely controlled or be controlled with buttons; the price is $20 for 1,000 pieces. The Dog food dispensor enables dogfood to be automatically and remotely dispensed; the dog feeder is $75 for 1,000 pieces and $150 retail.
Platform Security Architecture (PSA) is an IoT security framework being developed by Arm. Trusted Firmware M is an open source project to provide PSA compliant secure firmware for M profile devices. Zephyr is a Linux Foundation Collaboration Project to provide a small, scalable RTOS for connected, resource constrained device.
Sunchip shows some of their latest products including their all-in-one AR system based on Rockchip RK3288, RK3399 board for digital signage. $58 Amlogic S912 TV box, $26 RK3126 HDMI Stick, $200 Apollo Lake Box. 360 panoramic camera. $7 single Smart Wi-Fi Plug, $11 for dual Wi-Fi plug.
Actions S900 is a Quad-core ARM Cortex-A53, the Actions S500 is a Quad-core Cortex-A9. Actions also shows some other products for video smart speaker, smart door bell, smart kids robots, Actions also provides their MIPS based chipset for Bluetooth speakers, here also they are launching their new ATB1103/ATB1109 ARM Cortex-M0 system for their upcoming Bluetooth and perhaps also low cost smart speakers platform.
Allwinner Smart Home solutions including their chipsets and development kit for the R18 which I also filmed here the $26 (169rmb) Allwinner R16 powered Xiao’ ai Classmate Smart Speaker Mini by Xiaomi to be delivered in over 5 million units quantity, smart speakers by DIngDong. The Allwinner R6 enables even lower priced smart speakers with a maximum of 2 microphone in the microphone array for devices that will be closer to the user. The Allwinner B288 enables E Ink e-reader supported by DongDong which is China’s leading online book store. The Allwinner MR100 powers the fully open source drone project by Kudrone. The Xiaomi Drone uses the Allwinner R16 too. The Allwinner FC1600 powers the Niutingting Early Learning Machine by Benew which reads stories for kids for 2-6 years old. Allwinner T3 for car dashboard and smart mirror, T8 for in-car entertainment. The Xiaomi Robot Vaccum Cleaner uses the Allwinner R16 and uses lasers to calculate distance to walls and navigate to vaccum and mop the floor.
Today’s world of devices connected to clouds looks set to evolve with more intelligence and processing being pushed to the edge or migrating between the cloud and the edge. The very definition of edge is evolving too. In this presentation we will look at some potential futures made possible by the emergence of the fog and its implications for the segments that it embraces.
Mark Hambleton / ARM
Approaching 20 years of experience in embedded systems ranging from real time control of wind tunnels in his early career to a more recently on mobile devices. Mark has been working with the Linux kernel for approaching 15 years, initially creating networking products focussing on traffic classification and shaping for core and edge routers to more recently on mobile devices. Working as a Chief Architect for at Symbian (and Nokia), Mark established himself within the ARM community, he then joined Broadcom in 2012 to refocus on Linux on ARM working on their leading edge mobile SOCs and then on to ARM in 2014.
wolfSSL is a commercial grade TLS library available in open-source GPL form on GitHub (http://github.com/wolfSSL/wolfssl) written in C and designed for Embedded use because its modular design. They provide build-time options for enabling and disabling all algorithms and TLS features. They support progressive algorithms such as Ed25519/Curve25519, ChaCha20/Poly1035 and SHA-3 using TLS 1.2/TLS 1.3. The part used for the demo is an STM32F777ZI. They are going to add support for ARMv8-M TrustZone-M hardware security when chipsets become available in the near future.
ST Microelectronics Booth Tour at Embedded World 2018 featuring their major new product announcements (STM32WB, STM32C2C and ST25DVW), featuring ST partners in the ST fanzone with Photon with ToF (Time-of-flight), Conrad robotics, Style spinner, universities and research organisations that ST collaborates with: the CEA-leti for self-flying drones (360 sensor fusion), INSA from Toulouse France for some gameboy projects to teach students about system integration, software defined instrumentation with the CTU university from Prague.
STM32WB is a dual-core MCU with wireless support based on an Arm Cortex‐M4 core running at 64 MHz (application processor) and an Arm Cortex‐M0+ core at 32 MHz (network processor). With two totally independent cores, this innovative architecture is optimized for real‑time execution (radio‑related software processing), resource use flexibility, power management, and a low BOM cost, to bring better user experience. The STM32WB platform is an evolution of the well‐known market-leading STM32L4 ultra‑low‑power series of MCUs. It provides the same digital and analog peripherals suitable for applications requiring extended battery life and complex functionalities. STM32WB proposes a variety of communication assets, a practical crystal-less USB2.0 FS interface, audio support, an LCD driver, up to 72 GPIOs, an integrated SMPS for power consumption optimization, and multiple low-power modes to maximize battery life. On top of wireless and ultra‐low‐power aspects, a particular focus was placed on embedding security hardware functions such as a 256‐bit AES, PCROP, JTAG Fuse, PKA (elliptic curve encryption engine), and Root Secure Services (RSS). The RSS allows authenticating OTA communications, regardless of the radio stack or application.
The STM32WB55 Bluetooth 5 -certified device offers Mesh 1.0 software support, multiple profiles and flexibility to integrate proprietary BLE stacks.
ST25DV-W series of dynamic NFC/RFID tags offers a 13.56 MHz long-range interface compatible with NFC phones and readers. Based on an ISO/IEC 15693 and NFC Forum Type 5 tag, ST25DV tag ICs can be operated from an RFID reader or an NFC phone. They also include an I²C interface that lets them connect to a host (MCU, MPU, etc.). These tags feature an innovative fast transfer mode between an embedded host and an NFC phone or reader thanks to their half-duplex 256-byte buffer. ST25DV dynamic NFC/RFID tags can be used in a wide variety of applications including consumer electronics, industrial, metering, electronic shelf labels, IoT objects and more.
STM32C2C P-L496G-CELL01 STM32 discovery pack for 2G/3G cellular to cloud (STM32-C2C/2G-3G) is a turnkey development platform for cellular and cloud technology based solutions. The pack is composed of an STM32L496AGI6-based low-power discovery mother board with preloaded firmware, and an STMod+ cellular expansion board with antenna. The P-L496G-CELL02 discovery pack for LTE IoT cellular to cloud (STM32-C2C/LTE IoT) is a turnkey development platform for cellular and cloud technology based solutions. The pack is composed of an STM32L496AGI6-based low-power discovery mother board with preloaded firmware, and an STMod+ cellular expansion board with antenna.