Corning Precision Glass TGV semiconductor packaging to enable revolutionary PCB designs, more compact, cheaper

Posted by Charbax – June 11, 2017

Corning Precision Glass Solutions shows high precision wafer and panel format glass-based-solutions, enabling higher speeds, lower form factors and enhanced optical performance in a variety of applications. Corning suggests that their Glass can provide many opportunities for advanced packaging. The most obvious advantage is given by the material properties. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust the coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks for both through glass vias (TGV) and carrier applications. Glass also gives advantages for developing cost effective solutions. Glass forming processes allow the potential to form both in panel format as well as at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods.

At their SID Display Week 2017 booth, Corning also showcases some of their other technologies related to their Corning Glass for the display industry, including Corning Gorilla Glass 5 for improved drop performance for phones, Vibrant Corning Gorilla Glass for printing vibrate images on glass for decorative use, Corning Gorilla Glass for the Automotive market, that they claim is tougher than plastic, enabling high touch sensitivity and that can be cold formed into complex 3D shapes to enable the upcoming comformed display for automotive market. Corning Lotus NXT Glass enables conformed Smartphones like the Samsung Galaxy S8/S8+ with edge conformed displays, higher resolutions, more brithness, better energy efficiency, and more innovative designs for smartphones with high performance backplane LTPS-LCD and LTPS-OLED.