Fireside chat with ARM and GLOBALFOUNDRIES at ARM Techcon 2012 in Santa Clara.
“The insatiable need for functional and feature integration on to Mobile SoCs, coupled with ever increasing performance demands has challenged the Foundries and Fabless Semiconductor companies alike. While the diminishing geometries of the process technologies have kept pace to address this challenge, the solutions for leakage power dissipation continued to fall behind threatening to thwart the advances in Mobility. The ground-breaking FinFET technology is the right low-power solution and will serve as an inflection point to further enable SoC-level integration and technological advances in this exciting era of Extreme Mobility. The panel will discuss how the next generation of FinFET technology will change the mobile revolution again.”
Dean Freeman, Research VP, Gartner Research
Bruce Kleinman, VP, Product Marketing, GLOBALFOUNDRIES
Subramani Kengeri, Vice President, Technology Architecture Office of the CTO, GLOBALFOUNDRIES
Srinivas Nori, Director. SOC Innovation, GLOBALFOUNDRIES
Dipesh Patel, Deputy General Manager of the Physical IP Division, ARM