ARMdevices.net

This was an interesting conference about ARM-based products and especially interesting facts that sub $100 tablet pc is now coming massive.

About small form factor, with the development of 3D IC tech forthcoming years like IBM and 3M announced in September their joint-venture in developing 3D IC.
http://www.youtube.com/watch?v=GjvIdQGfO_0 
The animation from IBM is only 0:38min. short.

Whole semiconducting industry is now working in the developing of 3D IC tech.

Korean Besang have very illustrated animation of theirs know-how and patents.
http://www.besang.com/index.html 
Monolithic3d is another one in some business.
http://www.monolithic3d.com/ 
And of course AppliedMaterials, which is calling their similar concept for Wafer-Leveling Packaging
and TSV Fabrication.
http://www.appliedmaterials.com/tsv 

One question was about Samsung, Samsung have it´s joint-venture company Commonplatform together with IBM and GlobalFoundries.
http://www.commonplatform.com/