Comments on: Gary Smith EDA’s impressions on ARM Techcon 2012

By: Gary Smith EDA » ARMdevices.net-11/12

Gary Smith EDA » ARMdevices.net-11/12 — Mon, 06 May 2013 21:59:05 +0000

[…] Blog: Gary Smith EDA’s impressions on ARM Techcon 2012 […]

By: Maventwo

Maventwo — Wed, 07 Nov 2012 20:20:00 +0000

One thing that Gary Smith didn´t mention was the development towards 2,5D and 3D with much more integration of SoC and RAM-memory and other solid memories like ReRAM (Memristor is a kind of ReRAM) which is coming forthcoming years.

2,5D and 3D will make ARM and now Imaging Technologies acquisition of MIPS
much more competitive to Intel than no develompment towards 2,5D and 3D.

By: Maventwo

Maventwo — Tue, 06 Nov 2012 00:25:00 +0000

Innteresting to hear Gary Smith´s views on Techcon and his life experience and know-how about past and his predictions of future for x86 vs ARM heterogenous architecture.

Think of Intel Fellow Mark Bohr´s former discrediting of the Foundry model
vs Gary Smith´s words of ARM community of many developers and makers in this interview.

It is easy to understand that Intels model of owning it´s own Fabs vs the Foundry model,

that the Foundry model will win because of the cost of owning it´s own Fabs.

By: Iso9660

Iso9660 — Sat, 03 Nov 2012 09:35:00 +0000

Please, next time don’t move the camera.