Samsung offers its first wireless connectivity solution, S5N2120, for the growing Internet of Things (IoT) market. This solution supports IEEE 802.11 b/g/n Wi-Fi 2.4 GHz, and has an extremely small footprint, which is essential for a wide array of applications.
This solution features an integrated micro control unit (MCU) with a power amplifier, power management, audio codec and direct microphone functions. With this MCU, OEM customers can easily reconfigure their existing designs to add Wi-Fi connectivity functions. This allows for a shorter development lead-time and less engineering resources are required.
This flexibility along with excellent performance and a small footprint is optimal for battery-constrained applications such as Wi-Fi speakers, headsets, remote controls, digital & sports cameras, smart heating/cooling meters, sensors and other types of IoT or M2M applications. Samsung's new Wi-Fi connectivity solution, S5N2120, is currently sampling and scheduled for mass production in the second quarter of 2014.
Using Widcon, the latest and future Samsung ARM Processors and memory are stacked directly through TSV (Through Silicon Via) technology, this is the next step after Package-on-Package (PoP) designs where there is a circuit board between the processor and memory, thus data had to move through wires. In the new Widcon Processor and Memory package from Samsung, this means data can move through each ball and memory bandwidth becomes wider up to and beyond 17GB/s. This structure also brings better energy efficiency. Higher bandwidth allows application processor to perform maximum performance even at low clock speed. Moreover, superior thermal dissipation comes from TSV structure also enables the new Exynos 5 Octa processor and likely future Exynos6 to maximize the full potential performance of the processor at a lower power consumption. You can also see my previous video with Samsung talking about Widcon Wide IO memory technology here: http://armdevices.net/2013/11/21/samsung-wide-io-memory-interface-for-the-faster-and-lower-power-arm-processors-of-the-future/
The Linaro Enterprise Group (LEG) is dedicated to accelerate Linux ARM server ecosystem development and extends the list of Linaro members beyond ARM silicon vendors to Server OEM's and commercial Linux providers.
Linaro Enterprise Group (ARM Servers) engineers Ed Nevill, Leif Lindholm, Andrea Gallo, Al Stone, Hanjun Guo share key achievements in the OpenJDK, HipHopVM, UEFI and ACPI areas, building on new hardware, defining plans towards upstream acceptance, solving bugs and more.
This is Huawei's budget 8" 1280x800 IPS tablet with the HiSilicon Kirin 910 1.6GHz quad-core ARM Cortex-A9 processor with Mali-450 GPU, 5-megapixel camera, 1-megapixel front-facing camera, 4800mAh battery, dual front-facing speakers, 7.9mm thinness and a weight of 329gr.
Nokia makes Here Maps, to compete with Google Maps, Baidu Maps and Bing Maps. Now Nokia has ported Here Maps for Android, exclusively for now on the Nokia X Android phone. This video features an 18 minute overview of Nokia Here maps, including the UI, technology overview, automotive and more.
SanDisk launches the world's highest capacity MicroSD card, the SanDisk Ultra 128 GB microSDXC class 10 UHS-I card. Twice the speed of ordinary cards with file transfer speeds up to 30MB/s. Write speeds were closer to 15MB/s.
4K video recording and playback on a phone is amazing. Here Sony shows and talks about their Qualcomm S801 powered 4K video support on their new flagship Sony Xperia Z2 phone. They also show awesome 4K video playback using MHL 3.0 to a huge Sony 4K TV. Sony also ships a new stereo microphone accessory for higher quality microphone support.
NXP Semiconductors demonstrates their new Qi wireless charging transmitter device, which integrates all the circuits for a 5V mobile phone charger in an extremely small package measuring only 5-mm square. Using the NXP solution, fewer than 10 external components are needed to build a complete low-power 5V Qi A5/A11 wireless charging transmitter, alongside the Qi coil and resonant capacitors. The small footprint of the NXP NXQ1TXA5 system-on-chip means that the whole transmitter sits on a PCB of less than 1.5 cm-square with components on a single side. This opens up interesting possibilities for innovative wireless charging pad designs, including fitting the transmitter within the center of the Qi coil.