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Linaro is optimizing Linux software for the Snowball, includes full Android ICS and Ubuntu Linux.
Here are some of the phones and tablets rotating at the back of the Google Booth at Mobile World Congress 2012, between the free smoothies and the slide.
ZTE is serious about high-end. Here’s their new Tegra3 phone and also a mysterious phone codenamed PF112 with a yet unannounced Quad-core processor. If you know which Quad-core ZTE’s PF112 is using, please post it in the comments.
Possibly the cheapest Tegra2 phone in ZTE Mimosa X and a likely affordable MSM7227A ARM Cortex-A5 device in the ZTE Acqua.
The Recond HUD Ski and Snowboarding Goggles, shows speed, altitude, vertical distance travelled, synchronized with your phone showing SMS, caller-ID, music playlist, all in the head-up display while the user is skiing or snowboarding. The price is just 360 Euro (+ the price of the Goggles)!
Here’s the full video of the TI MWC 2012 Press Conference.
LG unveils this new huge awesome LG Optimus Vu phone. Here’s an overview of some of its crazy features. Big phone yeah!
Here’s a video showing the screen quality and size differences between the LG Optimus Vu, Samsung Galaxy Note and Samsung Galaxy Nexus.
Huawei’s new high performance Diamond series phone uses the new HiSilicon K3V2 Quad-core 40nm ARM Cortex-A9, with 64bit latest/fastest DDR2-for-smartphone memory bandwidth, they claim it has the worlds fastest ARM performance. Here’s an interview with the chief architect on the processor. I try to ask him about the performance, memory bandwidth, GPU, processor design. The K3V2 is made at the TSMC foundry. He has a team of about 500 processor engineers working for him in Shanghai to design this processor. He claims HiSilicon’s cache coherent interconnect design makes it superior to designs such as Tegra3, HiSilicon does not need that “companion core” as they claim to have designed the Quad-core in “the correct way”. HiSilicon has a GPU design partner which I have not heard them mention who it might be. In 6-12 months, HiSilicon is likely to release an ARM Cortex-A15 design on 28nm and also to upgrade their ARM Cortex-A9 designs to 28nm “when 28nm is ready”, for now, he says that the 28nm process manufacturing has too much leakage.