Category: Internet of Things

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TEGnology thermoelectric Energy Harvesting for self-powered Sensor Network

Posted by Charbax – May 21, 2017

TEGnology develops and commercializes new materials to be used in thermo electric generation, the material is cheaper and more heat-resistant than other materials on the market has developed costing less than 5% of the competition and is manufacturable in industrial quantities. With an ROI of less than two years, their two new materials exploit waste heat energy recovery very efficiently, useful for markets such as automotive, maritime, bio-fuel, Combined Heat & Power and the Sensor Industry. TEGnology replaces batteries, requires no maintenance, it's Made in Denmark, it is Low cost and available, uses commonly available materials, no tellurium or lead enables Self-powered wireless IOT sensor for temperature, pressure, vibration and more, it's high temperature energy harvesting for industry. Filmed at the IDTechEx show.

8Power self-powered Sensor Network (IoT with no batteries, no charging)

Posted by Charbax – May 21, 2017

8Power presents the Track100, a 100% self-powered Energy Harvesting LoraWan LPWA GPS Tracker for creating Sensor Networks that run on vibrations and solar. These can be installed all over the place, never having to go back to change the batteries nor recharging the devices to power the Sensor Network IoT. 8Power Ltd received the Best Technical Development within Energy Harvesting Award at the IDTechEx Show. Filmed at the IDTechEx Show.

Android Things on TechNexion Pico i.MX7D, i.MX6UL and soon i.MX8M

Posted by Charbax – May 20, 2017

Google Android Things launch partner, TechNexion Pico Pi SoM is an ARM Powered Google Android Things IoT development System on Module, the NXP Pico i.MX7D Dual Core ARM Cortex-A7 with ARM Cortex-M4, NXP Pico i.MX6UL and soon also it will be with 64bit i.MX8M Quad Core ARM Cortex-A53 and ARM Cortex-M4. These TechNexion Android Things System on Modules can dock into a Raspberry Pi form factor for development and expansion of advanced IoT projects using Android Things, you can read more about Android Things at http://iot.google.com and https://developer.android.com/things/hardware/developer-kits.html

you can see the TechNexion Android Things SoM at the Google I/O keynote about Android Things 19 minutes, 50 seconds into the video here:

Toradex at Microsoft Booth with Azure IoT Hub, Windows 10 IoT Core and Windows Embedded Compact

Posted by Charbax – May 19, 2017

At the Microsoft booth, Toradex demonstrated its multiplatform system connected to the Microsoft Azure IoT Hub – the Cloud Parking demo. Toradex System on Modules (SoMs) were employed in the access control, license plate recognition and the payment system, the communication between them made only through the internet, using only the Azure services. Linux, Windows 10 IoT Core, and Windows Embedded Compact are used as Operating Systems on the modules. Additionally, an interesting Toradex showcase included their new Heterogeneous Multicore Low Power demo featuring the Colibri iMX7D based on the NXP i.MX 7 Dual Core SoC.

Hololens at Microsoft Embedded World Booth Tour and Toradex, Azure Windows 10 IoT Core

Posted by Charbax – May 19, 2017

My first time trying on the Microsoft Hololens headmounted augmented reality system running on an Intel cherrytrail system selling at $3000 on the Microsoft store. In this video I walk around the Microsoft booth at Embedded World, checking out some of Microsoft's partners including Microtronics smart bicvcle running Silicon Labs ARM Cortex-M system through Windows Server. This video features Toradex at 4:13 into the video demonstrating its multiplatform system connected to the Microsoft Azure IoT Hub where Linux, Windows 10 IoT Core, and Windows Embedded Compact are used as Operating Systems on the modules featuring Heterogeneous Multicore Low Power Colibri iMX7D based on the NXP i.MX 7 Dual Core SoC.

Android Things (Brillo) explained by Karim Yaghmour and Chris Simmonds at Embedded World

Posted by Charbax – May 9, 2017

Karim Yaghmour (author of Embedded Android: Porting, Extending, and Customizing) and Chris Simmonds (author of Mastering Embedded Linux Programming) talk about the state of Android and Linux in the Embedded World.

ARM mbed OS 5.4 with med Cloud device management, bootloader and filesystem infrastructure

Posted by Charbax – May 9, 2017

The mbed OS 5.4 release incorporates functionality to prepare for mbed Cloud device management services including bootloader and filesystem infrastructure and the certified Thread 1.1 stack for developers with target platform support up to 74 targets. Since there's been releases up to mbed OS 5.4.4 you can read more about it here.

Flex (Flextronics) Flexible electronics, wearables, augmented reality

Posted by Charbax – May 9, 2017

Flex (formerly known as Flextronics) is the world's second largest global electronics manufacturing services (EMS), original design manufacturer (ODM) company by revenue, after Foxconn to original equipment manufacturers (OEMs). Headquartered in Singapore and has manufacturing operations in over 40 countries, totaling approximately 200,000 employees.

TSCH (time synchronized channel hopping) by Dust Networks of Linear Technology

Posted by Charbax – May 9, 2017

Dust Networks of Linear Technology pioneered time synchronized channel hopping TSCH, in which all motes in the network are synchronized to within a few microseconds. Filmed at the IDTechEx show!

GPU for ARM Cortex-M, Think Silicon NEMA, 0.1mm2 @ 28nm

Posted by juliusaugustus – May 8, 2017

Think Silicon NEMA GPU Series and NEMA dc are claimed to be the world’s smallest 2D/2.5D/3D GPU and display controller. They have been specifically designed for area constrained wearable devices, embedded systems and IoT platforms where power consumption and battery life is crucial while still maintaining vibrant graphics and fluid smartphone performance-like user interface performance. The NEMA GPU Series is what Think Silicon claims to be the only GPU which works with SoCs sporting a 32-bit MCU such as the ARM Cortex-M by utilizing the MCU by just 3-4%. Think Silicon's GPU for Embedded silicon footprint can be of 0.1mm2 @ 28nm, has leakage power GPU consumption of 0.07mW. Implementing Think Silicon’s patented compression technologies (TSFBc and TSTXc) limits memory power consumption to just 0.03mW (in DDR-less systems). With Think Silicon’s proprietary graphics API NEMA|GFX and the GUI Developer Toolkit NEMA|GUI, developers can use these tools provided by Think Silicon to create their individual Graphical User Interface in a fraction of time. Tools and the GPU Bitstream (NEMA|Bits) are available for free to download at http://think-silicon.com