Silicon Labs demonstrates their latest Internet of Things devices including their Dynamic Multiprotocol support based on their Mighty Gecko ARM Cortex-M4 platform supporting Zigbee and Bluetooth in parallel running Micrium RTOS with just a few microsecond delay when switching. Micrium RTOS is the number 1 in the commercial RTOS market. Silicon Labs also shows their Bluetooth 5 support, voice over Bluetooth LE, sensor to cloud connectivity, apple homekit, Bluetooth 5 can do 4 times longer distance or 2 times more bandwidth compared with Bluetooth 4. Silicon Labs shows their Bluetooth Mesh system using their Mighty Gecko development board that also features a memory LCD display. Silicon Labs acquired Sigma Designs Z-Wave Business, where Z-Wave goes into sub-Ghz so there is less noise going through walls, reaching longer distances compared with Bluetooth and Zigbee and also able to make it a Mesh. They now have the 500 series chip and they are going to announce the 700 series ARM Cortex-M4 chip running at lower power providing a longer range. Silicon Labs has shipped hundreds of millions of devices thus far based on their Mighty Gecko, Bluetooth, and Zigbee products and they also have shipped over 100 million devices using Z-Wave.
Socionext and partners show their newest solutions featuring the Linaro Edge Box and other of their solutions for camera and video processing, AI, IoT including their Image Signal Processor demonstrations for High-accuracy license plate recognition, High-performance under ultra-low-light conditions, Multi-camera UHD panorama view (four cameras), AR / VR / MR / XR, Video – Hybrid Codec Solution Demos, Socionext's High-density video transcoding for Cost-saving IP video distribution, Intelligent edge computing, AI / IoT – Edge Computing and High-performance AI inference system for High-efficiency video management systems (VMS) and Power-saving edge.
TechNexion shows off their new products at Computex 2018: pre-certified IoT modules, Android Things development kits, IP69K embedded systems and more. The booth tour starts with Android Things development kit PICO-PI-IMX7 live demo, based on NXP i.MX7 Dual applications processor and ARM Cortex-A7 architecture has been the go-to development kit since the official Android Things launch at Google I/O in May. The company also demonstrates PICO-IMX8M SoM based on NXP i.MX8M processor and Cortex-A53 + M4 architectures that delivers a whooping 4K UltraHD video performance with HDR and pro audio fidelity for multimedia applications. TechNexion is also launching CE, ETSI, FCC, IC, RCM and TELEC pre-certified IoT wireless communication modules and development kits: PIXI-9377 based on Qualcomm QCA9377, PIXI-6174 based on Qualcomm QCA6174 that deliver high transmission rates, low latency and improved range in noisy industrial environments. The company is showcasing a fully waterproof TWP-1010-IMX6 HMI based on NXP i.MX6 ARM Cortex-A9 processor that was specially designed to withstand extreme environments and cleaning with a jet spray. TWP series likewise includes models based on Intel Braswell architecture. TEK5-APL box PC based on Intel Atom x5-E3930, x5-E3940, x7-E3950 and Apollo Lake architecture, enclosed in a fully ruggedized enclosure for use in a vehicle.
Jensen Huang, Founder and CEO of Nvidia, Announces Jetson Xavier which I have filmed a separate interview about here, he does not launch the rumored GTX2080 or GTX1180 next-gen graphics cards yet, provides update on Max-Q thinner full GPU gaming laptops, talks DGX-2 supercomputer "The World's Largest GPU" (an update on the DGX which I filmed here) with 2 petaflops of performance in one node, 512GB frame buffer which has set 5 world records: fastest single chip, fastest single node, fastest at scale, fastest inference, and highest inference throughput.
Nvidia launes Jetson Xavier with 20x the performance of Jetson TX2 and 10x the energy efficiency with 512-core Volta GPU with Tensor Cores in an embedded module with more than 9 billion transistors it runs at under 30W, with multiple operating modes at 10W, 15W, and 30W. The Jetson Xavier ARM SoC has 6 kinds of high-performance processors on its SoC, a Volta Tensor Core GPU, an eight-core ARM64 CPU, dual NVDLA deep learning accelerators, an image processor, a vision processor and a video processor. Jetson Xavier has a peak performance of up to 30 TOPS (trillion operations per second) of mixed-precision FP32/FP16/INT8 performance. It can encode dual 4K60 H265 and decode dual 4K60 H265 at up to 12bit. Comes with 16GB LPDDR4x RAM with 137GB/s memory bandwidth, 32GB eMMC storage. It also has a dual NVDLA DL/ML Accelerator Engines which are open source available at http://nvdla.org and a 7-way VLIW Vision Accelerator. Nvidia Jetson Xavier runs using the Nvidia Isaac platform, a toolbox for the simulation, training, verification and deployment of Jetson Xavier. This robotics software consists of: Isaac SDK, APIs and tools to develop robotics algorithm software and runtime framework with fully accelerated libraries, Isaac IMX (Intelligent Machine Acceleration) applications, a collection of NVIDIA-developed robotics algorithm software, Isaac Sim, a highly realistic virtual simulation environment for developers to train autonomous machines and perform hardware-in-the-loop testing with Jetson Xavier. The Nvidia Jetson Xavier developer kit, which includes the Isaac robotics software, will be priced at $1,299, with early access starting in August from distributors worldwide.
BOE presents their latest flexible AMOLED display solutions for the future of smartphones that can be bent, folded, and rolled and even flap in the wind. BOE's flexible displays is demonstrated for robots with touch control, smart loudspeakers, an S-shaped in-car flexible AMOLED display. 8K displays, micro displays, QLED displays and other IoT solutions such as their TFT based AMOLED fingerprint recognition system that works in any spot of the display area
The foldable all-screen WQHD AMOLED display launched by BOE can achieve minimum dynamic bending with a radius of only 1mm. It can be bent more than 100,000 times and has an NTSC color gamut up to 118%. BOE is exhibiting a 5.99" FHD+ 2160x1080 Flexible AMOLED foldable mobile phone and a 7.56" foldable tablet. The display can be used for mobile phones when it is folded up and for tablets or monitors when it unfolds.
As one of the upcoming possibly revolutionizing OLED technical directions, BOE demonstrates their OLED printing technology to possibly just print the future of Smartphone displays showing their 5.5" FHD (1920×1080) printing flexible OLED display.
UHD has become a keyword of SID 2018 for material and equipment suppliers and device manufacturers, signaling the advent of the 8K era. In addition to the 110-inch 8K, 75-inch 8K, and 65-inch 8K glasses-free 3D displays, BOE also presents 13.3-inch 8K display products, promoting the development of small and medium-sized 8K products.
BOE has gathered speed in building an 8K ecosystem ever since it launched the "8425 strategy" which means "promoting 8K, popularizing 4K, replacing 2K and making good use of 5G". BOE has recently launched the 8K solution that incorporates BOE's 4K/8K image service cloud, 8K decoder player, and 8K display device, making it possible to shoot, edit, transmit and broadcast 8K content. This helps to solve problems like the costliness and massive size of traditional decoder players, as well as the lack of 8K content, thus promoting the faster popularization of 8K.
Among several micro displays at BOE's booth is a silicon-based OLED AR product which features monocrystalline silicon as the active drive backplane as well as high resolution, high level of integration, low power consumption, small size, and light weight. The AR product is backed by a 0.39-inch silicon-based OLED which has the world's leading pixel density of 5644PPI, 17 times that of a Retina display, and a contrast ratio over 10000:1, which enables the overlapping and interaction between virtual 3D images and real scenes. All these secure an ultimate experience for users as well as bright prospect in the field of education and training, video games, home decoration, etc.
Moreover, BOE shows its cutting-edge technologies and products such as QLED, mini-LED displays, a number of new applications and products including curved in-car display instruments and BOE iGallery.
Petfull is a maker of smart devices that cater towards pet owners. The automatic water dispensor can be remotely controlled or be controlled with buttons; the price is $20 for 1,000 pieces. The Dog food dispensor enables dogfood to be automatically and remotely dispensed; the dog feeder is $75 for 1,000 pieces and $150 retail.
Platform Security Architecture (PSA) is an IoT security framework being developed by Arm. Trusted Firmware M is an open source project to provide PSA compliant secure firmware for M profile devices. Zephyr is a Linux Foundation Collaboration Project to provide a small, scalable RTOS for connected, resource constrained device.
Sunchip shows some of their latest products including their all-in-one AR system based on Rockchip RK3288, RK3399 board for digital signage. $58 Amlogic S912 TV box, $26 RK3126 HDMI Stick, $200 Apollo Lake Box. 360 panoramic camera. $7 single Smart Wi-Fi Plug, $11 for dual Wi-Fi plug.