Category: Chip provider

LG G2 Mini, 4.7″ qHD MSM8226

Posted by – March 22, 2014

LG G2 Mini is affordable 540 x 960 pixels, 4.7 inches, KitKat, available in single SIM, dual-SIM, 3G, and 4G LTE variants, along with four colour options - Titan Black, Lunar White, Red, and Gold. The processors used are MSM8926 for LTE, and MSM8226 for 3G and the Latin American LTE variant (LATAM LTE) features a 1.7GHz Nvidia Tegra 4i.

Archos 64 Xenon, 6.4″ 720p MT6582 $199€

Posted by – March 21, 2014

6.4-inch HD IPS screen (1280 x 720), the unlocked ARCHOS 64 Xenon phablet uses the MT6582 Quad-Core CPU for released available for under $200.

Linaro Security Working Group discussing open source TEE

Posted by – March 19, 2014

Linaro Security Working Group (SWG), Jens Wiklander, Joakim Bech, Pascal Brand and Cedric Chaumont are talking about what is happening within Linaro's working group that handles security. The group is currently focusing on creating an open source Trusted Execution Environment (TEE) solution running on TrustZone® for ARMv7 and ARMv8 architecture. They also mention that they are going to work on secure boot (UEFI) and DRM schemes (EME) later on. According to SWG there has been and is a lot of interest shown from various companies, markets and countries. People have a hard time trusting a black box that is supposed to protect their most valuable assets. Therefore it is more than welcome to create an open source TEE solution right now, says SWG.

Geniatech OTT TV devices, M802 HDMI Stick, DVT-T, ISDB-T, Office Cast, WiTV

Posted by – March 18, 2014

This video features:
1. Geniatech ATV180 shows 2Ghz AmLogic M802 based ATV180 Series HDMI Stick with 4K2K support, OTT STB / UHD Support, 600MHz Mali 450MP8 Octa Core GPU, 1GB RAM, 8GB Flash

2. Geniatech PT115 – Android TV Dongle for DVB-T, PT115 DVB-T is a high sensitivity Tiny size digital micro USB TV Stick It turns your Tablet into a portable digital multimedia center. Features Watch and record DVB-T TV on Tablet, Supports Electronic Program Guide EPG and Subtitle Supports Time-Shifting function Low power consumption, requires Android 4.1 and a phone or tablet with OTG USB host support.

3. Geniatech PT230 - Android TV Dongle for ISDB-T same as PT115 but for ISDB-T standard

4. Geniatech Office Cast / any cast New product / connect - display and beam any content from smartphone / tablet / notebook / PC to Beamer. Office use ! Protocol: Miracast, DLNA, UPnP, own APK iOS and Android. ARM CORTEX A9, frequency is 800MHz-1GHz, RAM is 1G, built in 2G-32G flash memory Linux / based !

5. Geniatech ATV1610 - Series

6. ATV582 Series

7. WiTV - Wireless, WiTV is a small stand alone TV tuner which connects worldwide TV signals and streams of live TV wirelessly to mobile devices in iOS/Mac OS/Android OS the iPad, iPhone, iPod Touch, Android Phone and Android tablet etc.. Live TV can be watched through your home Wi-Fi network

HiSilicon D01, 16-core ARM Cortex-A15 presented by Huawei

Posted by – March 15, 2014

Here's the 16-core ARM Cortex-A15 processor from HiSilicon Huawei on a development board for ARM Powered Networking and Servers coming up. Hacked on in this video by Linaro Toolchain Engineer Rob Savoye (2), who now is climbing the Mount Everest. Linux kernel v3.13 is running on this board, with three SATA ports and two Gigabit ethernet ports driver ready. The BSP code will soon be upgraded to kernel v3.14 and be upstreamed in parallel. Source code and binaries are released through Linaro website. Ubuntu Server is verified on this board. In this demo, it runs a GCC toolchain native build. Linaro Toolchain Working Group plans to use this board to run multiple builds per board, to maximally saturate D01's computing and storage capability.

Kernel source: http://git.linaro.org/landing-teams/working/hisilicon/kernel.git (branch: integration-hilt-d01)
Binary release: http://www.linaro.org/downloads/ (found 'HiSilicon D01')
WiKi page: https://wiki.linaro.org/Boards/D01

Linaro’s validation team demonstrates using LAVA for native toolchain builds and “hack” sessions on Arndale Octa and APM X-Gene ARMv8 platforms

Posted by – March 12, 2014

Linaro's automated validation architecture (LAVA) is typically used to execute automated tests to validate Linaro's engineering output. However, LAVA has recently integrated features to automate builds and provide secure remote interactive sessions to developers. Linaro's lab lead Dave Pigott shows a native toolchain build orchestrated by LAVA. This technology enables developers to validate the toolchain on many ARM processor designs as well as other architectures. Tyler Baker a technical architect at Linaro explains how LAVA abstracts the image deployment, boot process, and installation of software needed to support these "hack" sessions.

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You can read more at:
http://validation.linaro.org
http://community.validation.linaro.org

Samsung ISOCELL CMOS Image Sensors at 16Mp and 13Mp

Posted by – March 12, 2014

Samsung's new CMOS image sensor technology, ISOCELL, substantially increases light sensitivity and effectively controls the collection of electrons, resulting in higher color fidelity even in poor lighting conditions. By incorporating ISOCELL, the image sensor will have 30 percent decrease in crosstalk; 30 percent increase in full well capacity; and 20 percent wider chief ray angle. Using the new technology with 1.12µm ISOCELL pixels, Samsung is introducing two new CMOS image sensors —16 and 13Mpixel.

The 16Mpixel ISOCELL imager provides a wider, clearer viewing experience to mobile device users by implementing a 16:9 aspect ratio, allowing for full-size, high-resolution images and video to be displayed on screen without field-of-view (FOV) loss. This high-speed sensor captures full FOV 16:9 full HD (1080p) video at 60fps, and for the first time in the industry, enables continuous shooting of all 16Mpixels at 30fps. Samples of the 16Mpixel ISOCELL CIS are available now and scheduled for mass production in the first quarter of 2014.

Samsung's new 13Mpixel ISOCELL CIS features Smart Wide Dynamic Range (WDR) technology, which allows users to capture images at 30fps. With a mosaic pattern of multiple exposures, images are then processed with an advanced algorithm for wider dynamic range. This enables users to capture details clearly in both bright and dark areas even in high contrast lighting conditions. This Smart WDR feature is based on Samsung's advanced 65nm stacked process, where the pixel array is attached right on top of the logic circuit. Samsung's 13Mpixel product is sampling now and is scheduled for mass production in the second quarter of 2014.

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Samsung Exynos 5410 in Android Set-top-box

Posted by – March 12, 2014

Samsung shows the Exynos 5 used for advanced Android Set-top-box systems, showing multi-window, content sharing, camera integration, supporting everything in the house through this Samsung Octa Core set-top-box and Android. Gaming, advanced VOD and more. 4K video playback also supported and more.

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Samsung S5N2120 Low Power Wi-Fi MCU for the IoT market

Posted by – March 12, 2014

Samsung offers its first wireless connectivity solution, S5N2120, for the growing Internet of Things (IoT) market. This solution supports IEEE 802.11 b/g/n Wi-Fi 2.4 GHz, and has an extremely small footprint, which is essential for a wide array of applications.

This solution features an integrated micro control unit (MCU) with a power amplifier, power management, audio codec and direct microphone functions. With this MCU, OEM customers can easily reconfigure their existing designs to add Wi-Fi connectivity functions. This allows for a shorter development lead-time and less engineering resources are required.

This flexibility along with excellent performance and a small footprint is optimal for battery-constrained applications such as Wi-Fi speakers, headsets, remote controls, digital & sports cameras, smart heating/cooling meters, sensors and other types of IoT or M2M applications. Samsung's new Wi-Fi connectivity solution, S5N2120, is currently sampling and scheduled for mass production in the second quarter of 2014.

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Samsung Widcon, 17GB/s+ Memory Bandwidth for future ARM Processors

Posted by – March 11, 2014

Using Widcon, the latest and future Samsung ARM Processors and memory are stacked directly through TSV (Through Silicon Via) technology, this is the next step after Package-on-Package (PoP) designs where there is a circuit board between the processor and memory, thus data had to move through wires. In the new Widcon Processor and Memory package from Samsung, this means data can move through each ball and memory bandwidth becomes wider up to and beyond 17GB/s. This structure also brings better energy efficiency. Higher bandwidth allows application processor to perform maximum performance even at low clock speed. Moreover, superior thermal dissipation comes from TSV structure also enables the new Exynos 5 Octa processor and likely future Exynos6 to maximize the full potential performance of the processor at a lower power consumption. You can also see my previous video with Samsung talking about Widcon Wide IO memory technology here: http://armdevices.net/2013/11/21/samsung-wide-io-memory-interface-for-the-faster-and-lower-power-arm-processors-of-the-future/

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