TowerJazz CMOS camera sensors 8K/HDR, Panasonic, real camera sensors vs Smartphone camera
TowerJazz offers a broad range of advanced analog process technologies enabling the most cost-effective and versatile IC manufacturing including SiGe BiCMOS and RF CMOS (SOI and bulk) for radio frequency (RF) and high performance analog (HPA) applications; CMOS image sensor (CIS); power management, including 700V BCD; CMOS; Mixed-Signal CMOS and MEMS capabilities, TowerJazz’s modular and customizable processes are available on either 150mm, 200mm or 300mm wafers in its seven fabrication facilities located in Israel, US and Japan, TowerJazz CMOS IMAGE SENSORS are advanced and proven CMOS image sensor technology for optical sensors used in high-end photography, industrial, medical, automotive and consumer applications, including high end camera phones and 3D cameras, TowerJazz claims leadership in CMOS image sensors and pixel technology available on 8” wafers, 180nm with aluminum backend, 8” wafers, 110nm with copper backend, 12” wafers, 65nm with copper backend.
JBD microLED 2 million nits, 10,000 DPI (5000×4000), brightest, highest pixel density in the world
JBD https://jb-display.com shows their active matrix inorganic microLED display chips and panels with wavelength ranging from UV to visible to IR. The pixel pitch ranges from 400 dpi to 10,000 dpi with a varity of resolutions, high brightness, high EQE, high reliability, these panels are ideal for AR, VR, HUD, projector, weapon sights, 3D printing, microscope and more. JBD's microLED uses wafer level technology, no phosphor, no pick and place, no mass transfer, no quantum dots, everything is made by Silicon and compound semiconductor on a wafer. At SID Display Week 2019, JBD shows 2 million nits brightness Micro LED, 600 DPI bi-color Micro LED display implementing JBD’s proprietary transferring technology to move red and green LEDs to silicon CMOS backplane. Also, JBD shows a mono-color microLED module with the same silicon CMOS backplane solution which achieves a pitch size of only 2.5µm and 10,000 DPI achieving a brightness of a million nits (on the 10K DPI display, 2 million nits is achieved on the 5K DPI display) at a resolution of 5000x4000. JBD is capable to minimize the pitch size to below 2.5µm, which surpasses DLP. Their next step is to increase brightness and to achieve full color.
Plessey microLED GaN-on-Silicon Monolithic 0.7″ FHD Bonded Display
Plessey at Display Week 2019 showcases their proprietary monolithic microLED technology to enable a new generation of augmented reality devices simplifying optical systems that are brighter, smaller, lighter and higher performing than incumbent light sources currently used in AR/MR headsets, smart glasses, pico-projectors and HUD. Plessey’s GaN-on-Silicon is their route for monolithic addressable micro LED arrays/pixels for hi-res and hi-lum displays, high brightness LEDs, microLED displays, power devices, UV LEDs, photonic integration, advanced sensors, Plessey is creating compelling cutting edge display technology solutions, addressing the challenges and limitations faced in the field of photonics, arrays with emitters as small as 1 micron, driven at low current density for greater efficiency and longevity. External Quantum Efficiency at least three times higher than best in class benchmarks with more improvements in the pipeline. Arrays that provide at least 100,000 nits at 1 watt, that’s TV equivalent brightness at only 5mW, Coloured pixels fabricated in monolithic form. IP protected custom CMOS back plane provides rapid developments for custom arrays. GaN-on-Silicon MicroLEDs outperform incumbent technologies such as OLED with an outstanding thermal performance, Focussed light emitting surface, monolithic die/array Lm/W maintenance, excellent uniformity, integrated electronic and optical components, showcasing a 0.7-inch Micro LED display for AR, made by 8µm blue LED chips on JDC’s CMOS backplane to achieve a resolution of 1920*1080. Plessey upgraded its facilities and equipment recently, equipped with new semiconductor-level clean rooms and automated facilities, Plessey produces the world first wafer to wafer bonding Micro LED display with Micro LED epitaxy wafer and silicon CMOS backplane. As AR projection applications are targeted by several leading companies, Plessey has cooperated with technology partners including AIXTRON, JSC, Nanoco, VUZIX and others to enhance production facilities, demonstrating its capability of commercialization of Micro LED AR.
Nanosys Quantum Dots at Display Week 2019, Hisense ULED XD, Vizio P Quantum X, Samsung Q900 8K QLED
Nanosys at SID Display Week 2019 showcases a wide range of Quantum Dot displays as Quantum Dots enter the mainstream TV market this year. Russell Kempt, Nanosys VP of Sales & Marketing along with Jim Ninesling, Head of Marketing at Hisense USA, walks through the booth explaining all the products and innovation for Quantum Dots this year.
Details from the demos around Nanosys’ booth:
HDR Content Analysis Demo
Vizio P Quantum X:
Peak Brightness: over 3,000 nits
DCI-P3 Coverage: above or equal to 98% u’v’
BT.2020 Coverage: above or equal to 85% u’v’
FALD Zones: 384
Price: $2,199.99
OLED TV:
Peak Brightness: 649 nits
Peak Brightness Full Screen: 148 nits
DCI-P3 Coverage: 99.18%
BT.2020 Coverage: 76.34%
Price: $3,799.00
Content:
‘Spears & Munsil UHD HDR Benchmark Blu-ray’: https://www.colorgrade.com/products/spears-munsil-uhd-hdr-benchmark-uhd-blu-ray-disc
Full HDR10 content with 10,000 nit peak luminance and BT.2020 color gamut. Shot on RED VistaVision cameras and graded using ColorFront and DolbyVision
‘Quantum Flows’ Shot by Phil Holland on a RED Monstro 8K VV in 8K resolution with full BT.2020 color gamut: https://www.youtube.com/watch?v=sKFMgVfh2eM)
Analyzer:
The AJA HDR Analyzer (https://www.aja.com/products/hdr-image-analyzer) provides real time analysis of the signal used in this demo. Every pixel is plotted in the CIE chart in real time.
Hisense ULED XD Demo
The Hisense ULED XD relies on Quantum Dots and a Dual-LC design to deliver a 100x improvement in contrast. The result is a set with blacks rivaling OLEDs with the high peak luminance and wide color gamut of a Quantum Dot LCD. Expected to launch in 2020, Hisense says these sets will cost less than comparably-sized OLEDs.
Peak Brightness: over 1,000 nits
DCI-P3 Coverage: 100%
FALD Zones: 132
Availability: 2020
Hisense H9F
The Hisense H9F is a great example of the value Nanosys Quantum Dot technology delivers today with full P3 color gamut and over 1,000 nits for under $1,000
Peak Brightness: over 1,000 nits
DCI-P3 Coverage: 98%
FALD Zones: 132
Price: $999
Available now
HP Omen Emperium X
Big Format Gaming with the full VESA HDR1000 spec thanks to Nanosys 100% Heavy metal free Quantum Dots
Peak Brightness: over 1,000 nits
DCI-P3 Coverage: 95%
FALD Zones: 384 zones
Refresh rate: up to 144hz refresh
Price: $4,999
Available now
Samsung Q900 82” 8K QLED TV
Peak Brightness: 2,000 nits
Color Volume: 100% P3 Color Volume
Price: $9,999
Available now
HP Pavilion 27
The world’s first Quantum Dot on Glass (QDOG) product also happens to be the world’s thinnest computer monitor at just 6.5mm thin.
Peak Brightness: over 400nits
DCI-P3 Coverage: 95%
Price: $399
Available now
More on Nanosys at SID Display Week 2019:
Monday Seminar by Charlie Hotz, Nanosys VP of R&D: https://youtu.be/oEgzGOpkXAY
Business Conference by Russell Kempt, Nanosys VP of Worldwide Sales & Makerting: https://youtu.be/2BoXrrkI-sE
Investor Conference by Jason Hartlove, Nanosys President & CEO: https://youtu.be/Rk3vsCREsB8
LG Display 65” Rollable OLED, 88” 8K OLED, 8K Crystal Sound OLED, The Rose
LG Display shows latest OLED displays at SID DisplayWeek 2019, this booth features the new 65" Rollable OLED that can fit inside the sound bar or furniture and be positionned in the middle of the room or in front of the window in the living room, the 88" 8K OLED display, the latest 8K Crystal Sound OLED, which implements exciters to the super-slim OLED panel to generate localized crystal-clear sound directly from the display itself and The Rose featuring 4 65" 4K OLED. Thanks to Conan for filming the second camera angle edited into this video filmed on Panasonic G85 on the DJI Ronin gimbal stabilizer. You can find out more information about OLED at https://en.oledspace.com an online community for OLED. Thanks to Conan for filming and providing the second camera angle giving an unprecedented view of how a Charbax Video is made. Here edited into this video, Conan filmed his camera angle using the Panasonic G85 on the DJI Ronin gimbal stabilizer.
BOE 12.3″ Rollable Phone, 7.7″ Foldable Phone, 65″ BD LCD, Printed OLED, 8K VR, Automotive, mini-LED
At SID Display Week 2019, BOE shows their latest 12.3" Rollable Phone, 7.7" Foldable Phone, many other flexible displays, UHD displays, micro-displays, other world-leading technologies and innovative applications such as their Smart driving experience brought by flexible display for the Internet of Vehicles (IoV) comprising a smart driver cabin and a spliced display screen of three units in three rows with only 0.99 mm bezels allowing visitors to experience a brand-new in-car display solution of the future. In addition to flexible display applications, BOE also displays the world-leading UHD display solution called the BD CELL UHD display which features an ultra-high static contrast ratio of up to 1,000,000:1, a bit depth of 12 bit, and a black field brightness of less than 0.003 nits, BOE also presents a host of 8K products, including 75" 8K 120Hz display, a 3.5" 8K VR display, and 0.39" 8K spliced VR display. Under the "8425 Strategy" (promote 8K, popularize 4K, replace 2K and make good use of 5G), BOE is now speeding up the application of 8K in many fields. Other leading-edge technologies and solutions that BOE shows at this show include the first ever HDR notebook featuring mini-LED, the 15.6" oxide display with an ultra-high refresh rate of 240Hz, the 55" inkjet-printed 4K OLED display, the 0.39" micro-OLED AR display that enjoys the world's largest pixel density of 5,644 PPI.
In the smart Automotive cabin, the information required for smart travel becomes part of the actual scene with the help of AR technology, the head-up display (HUD) can project useful information such as speed per hour and navigation onto the front windshield for the driver's reference. In addition, BOE replaces the conventional in-car LCD with flexible display. The 12.3" three-unit flexible display is backed by the OLED pixel compensation circuit technology developed by BOE, which can effectively improve the brightness uniformity of mid-sized OLED displays and provide better audiovisual experience for car users, BOE applies flexible AMOLED displays to transparent A-pillars, rearview mirrors to solve the problem of driver's blind spots in automotive design. The flexible display can perfectly match the shape of the A-pillar and show data with delay shorter than one millisecond. With the help of camera, the images blocked by the A-pillar can be shown on the flexible display, thus eliminating blind spots in the field of view. By applying flexible display, the rearview mirror can also be customized according to the interior shape of the car. BOE's smart cabin is equipped with a 6.39" flexible display as a built-in rearview mirror, which makes it safer to drive the car even on rainy and snowy days, BOE also exhibited some innovative applications of in-car display, such as center console solution that supports gesture-based interaction and V-shaped mini-LED for cars. BOE's high-end in-car display panels have been supplied to automakers in the United States, Germany, the UK, Japan and South Korea.
CLEARink ePaper 2.0 at SID Display Week 2019
CLEARink ePaper 2.0 won the People’s Choice Award at SID’s Display Week 2019. They're showing ePaper 2.0 for the first time, reflective displays using Electrophoretic Total Internal Reflection (eTIR), which has the goodness of previous ePaper technologies including sunlight readability, low power, along with color and video. CLEARink demonstrates 9.7” displays with 1:16 contrast, 227 dpi, 4096 colors with and without front light, monochrome and color modes running video content, 16 levels of gray, driven by less than 5V. Interview with Frank Christiaens CEO and Sri Peruvemba CMO.
SID Display Week 2019 opening, ribbon cutting
SID President Helge Seetzen welcoms more than 8,000 attendees from over 40 countries to Display Week 2019 to see the newest products taking the world by storm, learn about what’s coming next and rub elbows with some of today’s top technology visionaries. More than 250 exhibitors showcase their latest and greatest, the Innovation Zone (I-Zone) pack two large dedicated areas with prototypes and demos never seen before, great keynote sessions by Samsung, Google and BOE, the Technical Symposium, educational courses and business conferences deliver providing key intelligence about this ever-changing industry. Display tech and applications such as auto, AR/VR, AI and wearables, flexible OLED, reflective ePaper and microLEDs are some of the eye-popping exhibits engaging the crowds and to be posted here at a rate of about one new video every 4 hours for the next 12 days (check back!)
About Display Week
Display Week is the world's leading event focused on emerging electronic display and visual information technologies from concept to market. Display Week attracts attendees from the entire ecosystem of R&D, engineering, design, manufacturing, supply chain, marketing, sales and financial, as well as commercial and consumer end-user markets. It delivers unparalleled learning opportunities, market-moving trends, sourcing, roadmaps-to-market, and connections for career and business growth. You can follow Display Week on LinkedIn, Facebook, Twitter @DisplayWeek (hashtag #DisplayWeek), Instagram @siddisplayweek or Display Week on YouTube.
Microchip Technology Booth Tour at CES 2019
Microchip showcases their demos for the automotive, consumer, medical, industrial markets and more. Microchip demonstrations include: Connectivity
Wireless Sensor Network (WSN)
Networked sensors are the future of improving the efficiency of HVAC systems in smart buildings. Learn how three different networking schemes, LoRaWAN, MiWi™ and Wi-Fi® can all be used to send sensor readings to the AWS cloud.
Low-Power Wi-Fi Sensors
Discover how Wi-Fi devices can be used in hard-to-get-to places in the home without running new power through the walls with the ultra-low power ATWINC1510, an IEEE 802.11 b/g/n network controller to add-on to existing microcontroller (MCU) solutions bringing Wi-Fi and network capabilities through SPI-to-Wi-Fi interface.
Secure picoPower LoRa Node
Learn how to implement Arm TrustZone technology and other crucial security features found in low-power LoRa end nodes powered by the SAM L11MCU in such as this light sensor. The SAM L11 features picoPower Technology, with less than 25 uA/MHz active current and less than 100 nA sleep current, as well as enhanced Peripheral Touch Control, making it perfect for wearable, wireless and security-focused applications.
Versatile picoPower Technology
Learn how one family of 32-bit microcontrollers can serve your needs in low-power, water-tolerant touch and high-trust applications. The SAM L1x family’s picoPower technology, enhanced Peripheral Touch Controller and robust security technologies are well suited for smart city, industrial automation, smart agriculture, medical and accessory authentication applications.
Connected Home Demos
Time is money – especially in development processes where time to market is a key factor in the decision process. Microchip's turnkey touch solutions are readymade for your touch design. Buttons, sliders, wheels, proximity – all available with selectable interfaces (I2C, SPI, GPIO) from a single input, up to 64 buttons. Even appliance safety class B pre-certified solutions are available for designs where functional safety is a focus.
Voice-to-Text with Bluetooth Low Energy
Mobile phones are everywhere and sometimes you need to be able to see what is being said. Watch how the ATBTLC1000-ZR Bluetooth low energy System in Package (SiP) module, hosted by the SAM D21 MCU, can enable you to view the words you hear on an easy-to-use E-Ink display from Ineltek.
Easy Branding and Ease of Use
Drive profitable brand preference and ease of use for your end customers with the PIC32MZ DA graphics microcontrollers and MPLAB Harmony Graphics Composer tools and libraries. Custom graphics, animation and deep-color pallets will have your embedded design reflecting your company’s professional brand image, driving preference and profit.
Security
Wi-Fi to Bluetooth Low-Energy Gateway
Learn how to securely connect Bluetooth devices like a door lock, ceiling fan or LED bulb to the cloud with the combination of the ATWINC3400 Wi-Fi and Bluetooth module and the ATECC608A secure element. The ATWINC3400 is an IoT network controller offering Wi-Fi and Bluetooth Low Energy network capabilities within a single module. The ATECC608A secure element integrates Elliptic Curve Diffie Hellman (ECDH) security protocol an ultra-secure method to provide key agreement for encryption/decryption, along with Elliptic Curve Digital Signature Algorithm (ECDSA) sign-verify authentication, ideal for IoT applications.
Secure Authentication to Google Cloud IoT Core with a Secure Element
Learn how to protect the private key used for authentication in a flexible, secure element while easily implementing JSON Web Token-based authentication. This cost-effective solution uses the ATECC608A secure element to provide robust security, even to systems with small microcontrollers (MCUs) such as an Arm Cortex-M0+ based device.
Secure Authentication to AWS IoT Core with a Secure Element
Protect the private key used for the authentication of your AWS IoT connected device by using our flexible secure element (ATECC608A). Enabling robust, mutual authentication with Public Key Infrastructure (PKI), this cost-effective solution can be used across a wide range of MPUs and MCUs, including small Arm Cortex-M0+ based MCUs.
Qualcomm 8cx, 7nm ARM Laptop Windows 10 platform
Qualcomm shows their 8cx ARM Powered Laptop platform. The 8cx is the first ARM Processor designed specifically for the Laptop market. The Qualcomm Snapdragon 8cx Compute Platform is the most extreme Snapdragon ever, combines the best of the smartphone with the power and performance of a premium laptop in ultra-thin, fanless form factors to deliver a superior Always On, Always Connected PC computing experience. The first 7nm PC platform, the Snapdragon 8cx supports transformative 5G experiences, multi-gigabit LTE, and multi-day battery life and marks the biggest generational performance increase ever in a Snapdragon platform.
